Digital System Design and Labs

1. Digital System Designand Labs數位系統與實驗 歐陽明(Ming Ouhyoung) Professor, Dept.of CSIE, National Taiwan University

2. 課名: 數位系統與實驗課號: CSIE 2344授課: 歐陽明英文課名:Digital System Design and Lab(選修,2018/9 改) • 大綱: • Digital System Labs • Introduction to Boolean Algebra and Digital System Design • The Process of Design, Rapid Electronic System Prototyping • Minimization of Boolean Function • Combinational Circuits • Programmable and Steering Logic • Sequential Logic Design (Reverse Engineering and Forward Design) • Finite State Machine Design, Hardware Description Languages • Digital System Labs:Case Study (ALU design, Memory Control etc.) • 教科書C. H. Roth, Jr. and L. Kinney, Fundamentals of Logic Design,International Edition, paper back.

3. Goals 1. Transform students into engineers, capable of designing and implementing complex digital systems. 2. Use a hardware description Language (VHDL) 3. Implement with multiple existing integrated circuits • PS: Course name in MIT: 6.111 Introductory Digital Systems Laboratory

4. Objectives and Outcomes On completion ofthis course, students will have confidence in their abilities to conceive and carry out a complex digital systems design project in a team of two or three people. More broadly, they will be ready to handle substantial, challenging design problems. In particular, students will be able to: 1. explain the elements of digital system abstractions such as digital logic,Boolean algebra, flip-flops and finite-state machines (FSMs).

5. 2, design simple digital systems based on these digital abstractions, and the "digital paradigm" including discrete, sampled information. 3. use basic digital tools and devices such as digital oscilloscopes, PALs, PROMs, and VHDL. 4. work in a design team that can propose, design, successfully implement, and report on a digital circuit design project. 5. communicate the purpose and results of a design project in written and oral presentations.

7. Where is this course in the CSIE course map? • Circuits and Micro-Electronics (optional) THEN (2) Digital System Design and Laboratory THEN (3) Computer Architecture, or (4) VLSI design, or (5) Embedded System Design

8. Digital vs. Analog Systems • Difference • How to bridge these two systems?

9. AD and DA converter

10. Expected capabilities for students(see the demos!) (1)Understand the Digital System Design principles (2) Can write a program for Reverse Engineering (Read a circuit from the System Design, and explain its function, by a program) (3) Can write a program for Forward Design (Read a finite automata or finite state machine, then generate the circuits with logic gates)

11. Hardware Description Languages • VHDL (demo) • Verilog (demo)

12. State machines: Moore machine

13. State machines: Moore machine

14. State machines: Mealy machine

15. VHDL • VHDL was originally developed at the  request of the U.S Department of Defense in order to document the behavior of the ASICs that supplier companies were including in equipment.

16. VHDL • The idea of being able to simulate the ASICs from the information in this documentation was so obviously attractive that logic simulators were developed that could read the VHDL files. The next step was the development of logic synthesis tools that read the VHDL, and output a definition of the physical implementation of the circuit.

17. logic synthesis In electronics, logic synthesis is a process by which an abstract form of desired circuit behavior, is turned into a design implementation in terms of logic gates. Common examples of this process include synthesis of HDLs, including VHDL and Verilog. Some tools can generate  bitstreams for  programmable logic devices such as PALs or FPGAs, while others target the creation of ASICs. Logic synthesis is one aspect of electronic design automation.

18. Combinational logic vs. Sequential logic (with registers) • A synchronous circuit consists of two kinds of elements: registers and combinational logic. Registers (usually implemented as D flip-flops) synchronize the circuit's operation to the edges of the clock signal, and are the only elements in the circuit that have memory properties. Combinational logic performs all the logical functions in the circuit and it typically consists of logic gates.

19. Combinational logic and Sequential logic (example)

20. Reverse Engineering Can write a program for Reverse Engineering (Read a circuit from the System Design, and explain its function, by a program)

21. Results (a finite state machine!)Mealy machine vs Moore machine

22. In the theory of computation, a Moore machine is a finite-state machine whose output values are determined solely by its current state. 

23. In the theory of computation, a Mealy machine is a finite-state machine whose output values are determined both by its current state and the current inputs. 

24. Can write a program for Forward Design (Read a finite automata or finite state machine, then generate the circuits with logic gates) Example: design a counter that can count from 1 to 5 (and input bits can overlap).

25. Results (a logic circuit design)

26. Two types of results of circuit Implementation • (1) 電路板 (麵包板, breadboard)or FPGA(field-programmable gate array)

27. Results of Implementation (II)(可送台積電, 聯電製造) (2) A chip (ASIC, application specific integrated circuits)

28. That’s why you need the logic lab in Dept. of CSIE! To do the FPGA implementation withbreadboard, or chip deign By writing programs (VHDL, Verilog etc.)! (and you need debugging, also in hardware, to be sure that your product is correct!) THEN you need: logic analyzer (邏輯分析儀, 4GHz one, for example),

29. logic analyzer • a laboratory test instrument designed to display and evaluate digital signals. The device works in a manner similar to the way that an oscilloscope displays and facilitates the analysis of analog signals. • A logic analyzer allows engineers to design, optimize, and debug the hardware in digital systems, and can help technicians find and fix problems in malfunctioning systems.

30. What is the cost of a product from design to implementation?(for a machine/a circuit) • In terms of total time and money used

31. Design goals: constraints=Design fees + manufacture+ support

32. Total Cost of Circuit/Chip Design • Cd: design cost, shared by all products N • Cm: manufacture cost • Cs: field support cost, including relibility of components, interconnection, servicing cost • Solution: Early prototyping, Design for testability, Programmability (like software design, using VHDL, Verilog etc IEEE standards)

35. From design to implementationto debug

36. Design considerations/constraints

37. Dynamic changes of hardware design

38. Radical change in logic design (Chap. 1.1) • Automatic generation of logic circuits using software tools. • Versatile digital components (programmable, FPGA, PLA--programmable logic array etc.) (3) Design emphasis: shifting from detailed implementation hardware to the software specification. Problems: software design, face same problems in writing a program!

39. The elements of modern designRepresentation, circuit technology, rapid prototyping

40. Digital hardware systems

41. The art of design:to design is to represent

42. Semiconductor theory:Why TSMC needs neno tech.? • (1) Can you explain the function of the following CMOS inverter, in terms of Vin (gate voltage), and how the CMOS will work in terms of fundamental semi-conductor theory (electron or hole flow)? What is the cause of flow of electrons or holes?

43. Neno(meter) technology • 1 Angstrom = 10 to the -10 meters • 1 Nano-meter = 10 to the -9 meters, so, 1 nenometer is equivalent to 10 Hydrogen atoms TSMC : industry leading 20/28 nm (Q4 2015, 16 nm) semiconductor process technology Collaborates with Fujitsu on 28 nm process

44. CMOS inverter physical layers

45. Semi-conductor theory II (2) When the poly-silicon and diffusion layer width is reduced by a factor of R, so are others. Please answer what is the packing density (gates/area)? power/gate, gate delay (speed) in terms of R. Explain with simple explanations using the following models, and make your own assumptions.

46. Scaling assumptions **Voltage scaled by R, oxide thickness (T0) scaled by R, then device current is scaled by R, Depletion region width scaled by R, increase the substrate doping, NA, by R To simplify the condition: • Case 1: The source-drain voltage, the width, the length, the source-drain current flow, and the oxide thickness are ALL reduced by R.

47. CMOS inverter physical layers

48. Circuit theory • Delay T is proportional to Capacitor C and Impedance (Resistance) R delay T = R*C speed S is inversely proportional to T R is proportional to length(L), and inversely proportional to width(W) of resistor: L/W C is proportional to area (A) divided by distance (D)of two plates: A/D

49. Basic scaling properties • Parameter scaling factor Dimension L 1/R W 1/R t0 (Oxide thickness) 1/R Doping concentration R Voltage 1/R Current 1/R (current is proportional to W/L*V2/t0 )

50. The effect of scaling (k) Packing density R2 Capacitance 1/R Power/gate (VI) 1/R2 Chip power density 1 Gate delay, (CV/I) 1/R Power/delay product 1/R3