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Connectors

Connectors. Mechanical C onnector. In-plane connector to test fluidic samples : two metallic plates screwed together two plastic o-ring to avoid leaks in the connection between the wafer holes and tubes. Design of Raphael Dumps. Substain high pressure ( t ested up to 300 bar)

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Connectors

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  1. Connectors Collaboration meeting CERN - CSEM

  2. MechanicalConnector • In-planeconnector to test fluidicsamples: • two metallic plates screwed together • two plastic o-ring to avoid leaks in the connection between the wafer holes and tubes Design of Raphael Dumps • Substain high pressure (tested up to 300 bar) • Easy to assemble • Tested in thermal cycles Collaboration meeting CERN - CSEM

  3. MetalSolderingConnectors ‘Solder-based chip-to-tube and chip-to-chip packaging for microfluidic devices’ Edward R. Murphy et al., The Royal Society of Chemistry, 2007 Swagelok standard objects: - assemble - swaging for sealing Stainlesssteelferrule Brassferrule 1/16’’ tube - solderingwith tin to the metaldeposited on the wafer surface 20 nm Ti + 200 nm Au Collaboration meeting CERN - CSEM

  4. MetalConnectors-Testing - Testinginside vacuum vessel and thermal cycling (Frame3 NA62 with C6F14fluid) - Testingwith CO2 up to 70 bar and -10 °C. 20 nm Ti + 200 nm Au On the non-polishedside!! - Pressure test to check leaks no problems up to 300 bar! 100 µm thin Si chip  no solder in the tube!! Collaboration meeting CERN - CSEM

  5. MetalConnectors-Future Developments • Studying the quantity of metal and the type of metal to deposit (some problems of bad soldering were observed in some samples with no RF etch cleaning before deposition) • Depositing metal just on a small surface to sold connectors masking the surface during deposition • Future plan of integrating with the full Si connector in plane • full siliconconnectors: • Up pool withchannel for the fluid • Bottom pool integratedwithmicro-channels FLUID IN Collaboration meeting CERN - CSEM

  6. ConnectingTwoFluidicDevices - Tubes inside micro-channels 0.31 mm tube inserted from the side in between the channels , leak tightness assured by gluing recirculation - Bridgesbetween micro-channels Future interconnection between µ-channel devices with in-plane connectors  proposalto cool down the stave detector of ALICE ITS Inlet Collaboration meeting CERN - CSEM Outlet

  7. Future Tests • Studying the metal type and thickness for deposition • Trying to soldSi-Siwith a metal layer • Interconnectingdevices tests on-going • … Collaboration meeting CERN - CSEM

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