1 / 1

SiGen’s technology enables the transfer of thin layers onto semiconductor or

1. 2. 3. 3. 2. 4. 4. 1. “Thin” Layer Transfer Process. Donor Reclaim. SiGen’s technology enables the transfer of thin layers onto semiconductor or other material substrates. Surface Finish. Cleave Plane Formation. Wafer Bond. Cleave. Cleave Plane Formation.

cerise
Download Presentation

SiGen’s technology enables the transfer of thin layers onto semiconductor or

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. 1 2 3 3 2 4 4 1 “Thin” Layer Transfer Process Donor Reclaim SiGen’s technology enables the transfer of thin layers onto semiconductor or other material substrates Surface Finish Cleave Plane Formation Wafer Bond Cleave Cleave Plane Formation. Plasma Bond Step: using a proprietary plasma-activation bond process. Cleave Step (rT-CCP™): using a proprietary cleave process. Surface Finishing Step: using a proprietary gas-phase non-contact smoothing process. . Plasma-Activation Tool DB&C Tool

More Related