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Presentation of the POSH Project

HK Polytechnic University. University of Western Sydney Hawkesbury. Presentation of the POSH Project. Presented by : Phillip T. M. Choi. Content. 1. Introduction - rationale of the project. 2. Electronics Industry. 3. Objectives. 4. Approach of the Project. 5. Process of IC Packaging.

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Presentation of the POSH Project

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  1. HK Polytechnic University University of Western Sydney Hawkesbury Presentation of the POSH Project Presented by : Phillip T. M. Choi

  2. Content 1. Introduction - rationale of the project 2. Electronics Industry 3. Objectives 4. Approach of the Project 5. Process of IC Packaging 6. Critical Analysis Methodology

  3. Introduction - rationale of the project To raise the compatibility of Hong Kong (HK), the Commission on Innovation and Technology was established by the Chief Executive Officer of HK. From the final report of the Commission (1999): "we recommend the government to step up its overseas liaison ... in major technology centers such as the Silicon Valley" WHAT IS SILICON VALLEY??

  4. Rationale of the topics From Mazurek (1999), the Silicon Valley is a place to produce the microchips that are used for manufacturing the electronic products & from the fact that HK Government has budgeted for the Year 2000 to 2001 (2000) to invest HK$ 2 billion on the building the Science Park at Pak Shek Kok All these imply the possibilities of re-establishing the electronics industry in Hong Kong by the Government.

  5. Electronics industry From the Government (2000), statistics in 1998 shown that Manufacturing is the top four “Major Economic Activity” having the highest number of accidents; and within the Manufacturing activity, the electronics industries is the top four industries having the highest number of accidents From Chen (1998), fire incidents have broken out on September 1998, November 1997 and October 1996 in Hsinchu science park Taiwan on electronics manufacturing companies, the results are well known --- the plants were damaged and caused the soaring of the price for electronic components, like “Ram”.

  6. Electronics industry From OSHA of USA (1999), an electronics manufacturer was fined for US$161,500 because of an uncontrolled release of inorganic arsenic on August 3, 1998 which required sending three employees who might have been exposed to the chemical to Morristown Memorial Hospital for observation. This could be summarized from the words of Gauna (2000), “It’s a clean product, but it’s deadly for the workers and deadly for the environment…enormous amount of toxic chemicals in their production processes and they generate huge amount of toxic wastes”.

  7. Electronics industry Since there is the possibilities of re-establishing the electronics industry in Hong Kong by the Government. This lays the basis of this study. WHAT IS THE FOCUS??

  8. Electronics industry From HK Trade Development Council (1999), “low-end” electronics products are no longer having production in HK, the electronics companies still having major production are the IC packaging related industries and PCB board processing industries. “Critical Study of Hazardous Processes in IC Packaging Industry”.

  9. Objectives To identify the hazards in the IC Packaging industry. To identify the most hazardous processes in the IC Packaging industry through critical analysis. Base on the risk assessment results, produce the standard operation procedures for the most hazardous processes, this is acting as a risk control measures. Base on the standard operation procedures, develop a checklist as tools for the supervisory level for the judgment of the working conditions.

  10. Approaches of the project Produce a checklist for the work site Produce a SOP for the process Critically study the process Define the production processes of the IC Packaging

  11. Production processes of IC packaging From Gassert (1985), the processes of IC packaging can be divided into several stages: the die saw, the die attach, the wire-bonding, the plastic molding, singulation, marking, electroplating, form, testing, packing and then shipped out. Similar process was provided from Intel (2000), ASAT (2000), HTL (1999) and AIT (2000). They are summarized in the following diagram:

  12. Basic Process flow of IC Packaging Production processes of IC packaging

  13. Literature survey on approaches of critical study Different Methods: From Kazer (1993) - identify all hazards, evaluate the risks, control the risks From Wyatt (1996), identify the hazard, assess the hazard, provide and monitor the control measures From Australia/New Zealand Standard (1995), establish context, identify risks, analyze risk, assess and prioritizes risk, treat risk and monitor with review

  14. Literature survey on approaches of critical study From The University of Melbourne (1999) - hazard identification, risk assessment, risk control and verification. From Ferry (1988), many individual methods such as Fault Tree Analysis, Management oversight and Risk Tree, Change Analysis, Failure Mode and Effect Analysis, Technique of Human Error Rate Prediction R Technique of Operations Review

  15. Risk Assessment Risk Prioritize Risk Treatment Monitor and review The approach to be selected The approach to be used in our study will then be: Hazard Identification

  16. Expected Results Able to identify one or two of the process in IC packaging Conduct detailed study Produce the SOP Produce checklist for the supervisors or engineers

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