http://www.eet.bme.hu

1. Budapest University of Technology & Economy Department of Electron Devices http://www.eet.bme.hu

2. The Department of Electron Devices • The only university department in Hungary dealing with all aspects of microelectronics. • Highly acknowledged European research center

3. The Department of Electron Devices Expertise in • device physics, • microelectronics CAD tools • esp. thermal simulation & circuit simulation, • IC & MEMS design, • gas sensors, • thermal issues, • multimedia, internet applications

4. Education (continued) Special subjects: • Microelectronics CAD (basic concepts in digital VLSI design, CAD systems, basics of layout level & analog design) • ASIC & FPGA Laboratory (design of an MSI circuit) • High level synthesis (VHDL, hardware synthesis methods) • VLSI Laboratory (introduction to Cadence Opus, design of a standard cell in Opus)

5. Education (continued) Special subjects: • Monolyth technology(+ processing practice in the semiconductor laboratory) • Integrated microsystems • Testing laboratory (for ICs, semiconductor materials, MEMS packages and structures,) • Course laboratories (topics are selected from all above issues)

6. Research • European projects: BARMINT, THERMINIC, HIPERLOGIC,TALENT, DETERMIN, PROFIT, REASON, PATENT • thermal measurements (IR, LC, transient) • thermal simulation • thermal testing • electro-thermal simulation • compact dynamic thermal modeling • MEMS design, simulation and characterisation

7. Research facilities Laboratories: • Thermal laboratories • VLSI CAD Laboratory • Semiconductor laboratory • FPGA Laboratory

8. Research facilities CAD Laboratory Facilities (hardware) • SUN Enterprise Ultra server, WNT server, • 10 SUN workstations • 100/10 Mbps LAN, 4 network printers • 20 Linux workstations • Tektronix LV500 IC tester

9. Facilities • Installed software tools: • Cadence Opus • AMS 0.8 • ST 0.25 • Mietec 2.4 • CMP MEMS Engineering Kit • Atmel-ES2 SOLO 1400 (for education only) • HSpice, Spectre • THERMAN & SUNRED tools of MicReD

10. Facilities Using Cadence Opus in the SUN Laboratory

11. Facilities Tektronix LV500 IC tester

12. Facilities - Thermal laboratory Aga 782 IR camera with PC interface LC based thermal imaging system

13. Facilities - Thermal laboratory Commercialized version of the transient tester The department’s thermal transient tester

14. Facilities - semiconductor laboratory Scanning electron-microscope with PC interface

15. Facilities - semiconductor laboratory Diffusion furnace Sputtering and evaporation are also available

16. Facilities - semiconductor laboratory Spreading resistance meter

17. Facilities - semiconductor laboratory ….without contacts on the surface SPV - surface photovoltage

18. Some research resultsDesign of CMOS temperature sensors Frequency output version Generic designs, almost process independent behavior

19. Some research resultsDesign of thermal test dies Tester-on-the-die: dissipator + sensor + boundary scan - first realization 5x5 dissipator / sensor cells Following this experiences, a more sophisticated chip has been designed together with the MicReD company...

20. Some research resultsDesign of thermal test dies Our recent design:81 individually programmable dissipator / temperature cells with boundary scan interface: improved implementation of the two older designs, 6x6 mm2, 8 W

21. Some former research resultsElectro-thermal simulation Experimental system implemented in Cadence Opus on top of the ECPD07 design kit of Atmel-ES2

22. Some former research resultsLiquid crystal thermal imaging of ICs

23. Some research results Sophisticated post-processing of IR images Thermal transient recording using the IR camera

24. Some recent research resultsThermal transient testing of IC packages Identification of properties of the chip-to-ambient heat-conduction path based on thermal transient measurements The so called structure functions provide the required information

25. Detecting die attach and soldering failuresThe differential structure function of the reference device 2: the copper island of the mounting plate 3: the total mounting plate 4: the cold plate 1: the transistor case Rth of the plastic coating Rth of the soldering

26. Detecting die attach and soldering failuresComparison of the differential structure functions of C02 and C08 3 3 Rth between 2 and 3 increased The soldering error can be noticed even visually

27. Some recent research resultsThermal transient testing of IC packages • Identification of properties of the chip-to-ambient heat-conduction path based on thermal transient measurements • Identification of the partial thermal resistances in the heat flow pathenabling detection of die attach and soldering failures • Calculation of effective thermal conductivity and emissivity values from the measured results, etc

28. Some recent research results Compact thermal model generation The generated BCI (Boundary condition independent) compact model A package

29. Some recent research results BCICompact thermal model generation The transient results (FS=field solver, CM=compact model)

30. Some recent research resultsInvestigation of surface potentials on different materials • Vibrating capacitor with transparent reference electrode

31. Some recent research results Gas sensing: the adsorption induced shifts in work function differences at 460-360K (Pd-Ag-Au-Pt-V-Pt-SnO2) (Kelvin method) 30mm 460K C 25mm 360K Pd Ag Au Pt V Pt SnO2 1% H2 -air mixture NH4OH vapour (NH3) CHCl3 vapour C2H5OH vapour

32. Further research in progress • Enabling board level simulators to accept packages with their compact thermal models • Design for testability of MEMS structures • Thermal transient examination of power circuits • Development of a fast and user friendly electro-static solver • Development of a methodology to detect die attach failures in packages with transient thermal testing • Research in low power circuit design • Research in surface potential measurement • Development of gas sensors • Characterisation of solar cells by different methods, etc