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Testing of Wafers Assemblies and Ladders Test beam Overview

Testing of Wafers Assemblies and Ladders Test beam Overview. Wafer Testing Activities. 1. Wafer Testing (B. Hecking M. Keil, P. Riedler) End August - Mid September : 3 wafers fully tested, 1 wafer tested to 70%. 2. FM Tests (F. Meddi, M. Marini, P. Riedler) September 24-26 :

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Testing of Wafers Assemblies and Ladders Test beam Overview

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  1. Testing of Wafers Assemblies and Ladders Test beam Overview P. Riedler/CERN SPD Team

  2. Wafer Testing Activities 1. Wafer Testing(B. Hecking M. Keil, P. Riedler)End August - Mid September: 3 wafers fully tested, 1 wafer tested to 70% 2. FM Tests(F. Meddi, M. Marini, P. Riedler)September 24-26: >>see talk by F. Meddi • 3. Training: >>see talks by G. Pappalardo and M. Cinausero • September 26-28:G. Pappalardo, F. Librizzi, Catania • sent one wafer (PAVM1ET)+Probecard+MB card D3 • Sept. 30-Oct 4:G. Prete, L.Vannucci, Padova/LNL • sent one wafer (PKVM14T), 1 Dummy, 1 Probecard Wafer lists, test results, test sheets, classification criteria: http://riedler.home.cern.ch/riedler/alice/alice.html ->Wafer probing P. Riedler/CERN SPD Team

  3. Assemblies and Ladders • New Deliveries: • June 26, June 28, September 4 • >> see talk by M. Campbell • new relaxed bumps • thin detector assemblies 200+750µm • thick assemblies 300+750µm • thin ladders 200µm+300µm P. Riedler/CERN SPD Team

  4. Thick Assemblies 13, 14, 22, 27*, 28*, 29*, 30*, 31* (AB9VHXT), 38*, 39* (AM9VG4T) * NA60 mounted on cards P. Riedler/CERN SPD Team

  5. VTT 22 Sr-Measurement P. Riedler/CERN SPD Team

  6. 12, 49*: tested (* used in test beam) 48, 61, 71: untested 60: broken “Thin” Assemblies Chip: 750µm Detector: 300 µm 12, 48, 49, 60, 61, 71 (AM9VG4T) Vdep=12V • High leakage currents: e.g. 49: 10µA @ 15V • stable bump bonds P. Riedler/CERN SPD Team

  7. 300µm Chips 63 53 50 43 33 200µm Detector Thin Ladder 1 thin ladder tested: I det: 14µA @ 20V P. Riedler/CERN SPD Team

  8. VTT ladder (November 2001): Stretched bump bonds Chip: 750µm Detector: 300µm P. Riedler/CERN SPD Team

  9. Chip 53 Chip 63 Sr Measurement of Thin VTT Ladder P. Riedler/CERN SPD Team

  10. Chip 63 Chip 53 Chip 43 Chip 33 Chip 50 Sr source P. Riedler/CERN SPD Team

  11. VTT Ladder Thin - Sr Measurement >99% working pixels! P. Riedler/CERN SPD Team

  12. Chip 63 Chip 53 Chip 43 Chip 50 Chip 33 Sr-source P. Riedler/CERN SPD Team

  13. Testbeam 2002 July 3-17, 2002 H4 test beam area, CERN 350 GeV protons Trigger: 4 scintillators 2mm x 2mm beam spot Reference planes: 2 mini-buses (4 pixel assemblies) with 16384 pixels each Tested: 1 thick assembly 1 thin assembly (200µm det.) 1 full ladder P. Riedler/CERN SPD Team

  14. July3: First beam on planes after 50 min July 6: asynchr. Pilot on middle plane, AMS76 delay-scans, threshold scans, angle scans July 10: MD, installation of thin assembly VTT49thin delay-scans, threshold scans, angle scans, multiplicity July 13: installation of VTT ladder delay-scans, threshold scans, angle scans, multiplicity July 17: End of test beam P. Riedler/CERN SPD Team

  15. ….the Shift-Team (26 shifts in total): Enrico, Federico, Franco, Giovanni, Karoly, Maria, Marian, Michael, Michele, Paul, Peter, Petra, Roberto, Romualdo, Rosa Anna, Tiziano, Vito Thanks for help to: Bruno, Francoise, Ian, Jean-Paul, Per, Pieter, Piotr, Ron P. Riedler/CERN SPD Team

  16. Mini0Mini1 Idigital 417mA 300mA Ianalog 900mA 660mA Vth 210(215) 215 Efficiency ~99% ~98.5% (online) Synchronous pilot Reference Planes 2 mini-buses with each 16384 pixels Mini0: chip0=AMS59 chip1=VTT1 Mini0: chip0=VTT12 chip1=VTT10 Bias: 60V Total leakage current: ~6µA stable P. Riedler/CERN SPD Team

  17. Beam spot AMS 76 Plane 1 Plane 2 Plane 0 P. Riedler/CERN SPD Team

  18. Wide Beam (Q16=100A) - plots scaled to 1 Mini0_chip0 Mini0_chip1 Mini1_chip0 Mini1_chip1 P. Riedler/CERN SPD Team

  19. Mini 0 Mini 1 VTT 1 AMS 59 VTT 10 VTT 12 • Assemblies were produced 2001 • Long term stability needs to be checked P. Riedler/CERN SPD Team

  20. Some Online Results >> see talk by P. Nilsson for the Offline Analysis Online Efficiency: ~ 98.8% P. Riedler/CERN SPD Team

  21. “Thin” Assembly - VTT49 thin Delay Scan Strobe 150ns, plateau 44ns Bias Scan Online Efficiency ~98.5% P. Riedler/CERN SPD Team

  22. VTT Ladder 1 P. Riedler/CERN SPD Team

  23. Beam spot on VTT1-ladder chip0 chip1 chip2 chip3 chip4 P. Riedler/CERN SPD Team

  24. 2 3 2-3 Ladder VTT2 Beam spot in three positions: P. Riedler/CERN SPD Team

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