Who Cares About Quality?

1. Who Cares About Quality? Michael J Smith Michael.J.Smith@Teradyne.com US/Canada Dial-in #:  (877) 809 3723 Int'l/Local Dial-In #: +1 (706) 634 0863

2. Agenda - Who Cares About Quality? • Industries that Care About Quality • Technology Changes that Affect Quality • XStation MX Quality Advantages • Customers Who Care • Summary

3. Industries that Care About Quality

4. Data Communications- High Reliability, Cutting Edge Technologies Source: IBM

5. Automotive- Life Critical, Harsh Environment Drive by Wire! Brake by Wire! Source: Delphi

6. Telecommunications- Harsh Environment, Cutting Edge Technology • 18 month replacement • Smaller and thinner • High expectations • Drop test! • Must work

7. Defense & Aerospace- Mission Critical, Harsh Environment • High reliability • They must work • High cost of repair • Limited access • Limited burn-in • Thermal layers/coated • Parts on the boards cost up-to $100,000 each.

8. Technology Changes that Effect Quality

9. Quality Expectations Have Changed • The Electronic PCB Assembly Process Produces Fewer Defects • Quality improvements from inspection and ICT feedback • “Noise Level” Defects in Production Have Now Become Important • Insufficient and excess solder • Field failures • Cosmetic look • Customer acceptance

10. Electrical Loss of Access Electrical Loss of Access: - Component density and geometries - High frequency signals - Time to market constraints

11. 30 mm QFP BGA 20 mm TAB 15 mm COB CSP FC 10 mm (.4 in.) Transition to Area Array from Peripheral Packages Total Parts Total Parts Area Array Connect Packages Peripheral Connect Packages Source: IPC Roadmap

12. Loss of Visual Access No Visual (AOI) Coverage of: - Area array packages - BGAs - Shielding and covers – fitted as part of the process - Other technologies with hidden joints: - µBGA and flip-chips - Fine pitch - Small pad 0201s - Stacked devices

13. Lead Free - Can Change Quality • Different Shaped Joints • Increased Voiding

14. AXI AOI ICT Solder Joint Acceptability/Quality Marginal Solder Joint • What AOI Can See • Leaded devices only • Angles based on reflection • No volume measurements • Toe only • What AXI Can See • Full shape of Joint • Volume measurement • Full heel and toe measurements • Angles based on slope of solder density

15. XStation MX Quality Advantage

16. Fully Automated Defect Detection ClearVue 3D X-Ray TraX 2D X-Ray Teradyne’s Imaging Quality Tool Suite High Fault Coverage Measurement Tools Double Sided Boards Obscured Devices ClearVueTM Single Sided Boards High Throughput TraXTM Accurate Image Analysis Automated Defect Detection X-AlgTM

17. 4.4” 2.2” 0.719” ClearVueTM – 3D Capabilities • Makes Obscured Components Clear, Visible and Inspectable • Allows for multiple slicing of top and bottom side components. • Provides Accurate Diagnostics • Typically less than 500 ppmJ false fail rates. • No mechanical errors and averaging • Static image capture increases image quality. • No moving parts during image capture. • High Quality Imaging • High resolution at large FOV to inspect 0201’s • Uses computational techniques to reconstruct images – No blurring

18. 2.2” 4.4” TraXTM – 2D Capabilities • Provides Single Sided Board Inspection • Meets the Fastest Line Rates with Up to 6 Sq Inches per Second Throughput • Provides Accurate Diagnostics, • Typically less than 500 ppmJ False Fail Rates. • No mechanical errors and averaging • Static image capture increases image quality. • No Moving Parts during image capture. • High Quality Imaging • High Resolution at Large FOV to inspect 0201’s • No image reconstruction – No blurring

19. XFrameTM – Off-Line Programming • Maximize System Utilization • Tools Focused at Generating the Highest Quality Program CAD Input and Model Generation Slice Definition and Measurements Automated Limit Setting and Fine Tuning

20. High Quality Defect Detection BGA Gull-Wing J-Lead Discrete PTH • Detection Capabilities Include: • BGA, LCC, QFN, passives, PTH, slugs, • Excess & insufficient solder, voids, lifted leads, solder balls, • Missing, tombstone, billboard, skew, off-position, bridging, opens,

21. Capacitor In this slice all bottom-side components have been removed Looks Like Short with 2D X-Ray BGA Ball Resistor Test Point ClearVueTM Provides Maximum Fault Detection and Lowest False Call Rates • By Providing High Resolution Without Loss Of Original Image Information, All Defect Types Can Be Located Acquired Image ClearVue Slice

22. Increased False Fails & Reduced Fault Coverage ClearVueTM vs. Other X-Ray Technologies • Poor Image Construction Masks Real Problems Using Laminography • Capacitor on back side of board not removed from image • Halo effect on BGA balls • Poor Image Quality Using Laminography • Voids are lost due to averaging • Limited gray scale resolution (256 vs. 4,096) 1 4 2 3 3 XStation MX Laminography

23. Increased False Fails & Reduced Fault Coverage ClearVueTM vs. Other X-Ray Technologies: 2,303 grey levels delta between ball and board Signal = 83.3 % Noise = 1.4 % SNR = 57.4 % 70 grey levels delta between ball and board (outer) 35 grey levels delta between ball and board (Inner) Signal = 44.8 % Noise = 3.5 % SNR = 12.9 % XStation MX Laminography

24. Strength of TraXTM – Transmission X-Ray • High Resolution Transmission Images @ 2.2” x 2.2” FOV • Throughput • 6 Sq in/sec Actual Resolution 2.2” 2.2”

25. Customers Who Care

26. Contract Manufacturer of DataCom Boards With Installation of XStation MX: • Defect Coverage Improved to Over 98% • Incremental Coverage on Difficult to Test Solder Joint Types, Including: • Solder bridging on active and passive devices • Missing solder • Insufficient solder • BGA Defects • Not testable previously

27. World-Class Automotive Company With Installation of XStation MX: • Ability to Achieve <5 DPMO Total Failure Rates • > 99% Component Coverage on AXI • > 99% Defect Coverage on AXI • Fully In-Line Operation • 14.5 sec Inspection Time • Within beat-rate • Sub 100 ppmJ False Failures

28. Communications Company With Installation of XStation MX: • The Ability to Inspect • Components un-testable by AOI due to shields and covers. • Package on Package (POP) / stacked BGAs that can only be inspected by next generation AXI. • Meets Full Production Beat Rates While Still Providing Full Coverage.

29. Mil/Aero Company With Installation of XStation MX: • AXI allowed for non-powered inspection • AXI does not stress or degrade product life-span • XStation MX allowed inspection of all aspects of every solder joint prior to deployment - Total Quality • XStation MX provides the ability to keep and analyze data off line - Traceability • Highest quality imaging and defect coverage using TraX and ClearVue

30. Summary

31. XStation MX – The Quality Benefits • Highest Quality – by the Highest Level of Fault Coverage • ClearVueTM – double sided components • TraXTM – single sided components • XFrameTM - focused at generating the highest quality program • Highest Quality – by the Lowest False Call Rates • Reducing escapes due to false call overload • Highest Quality – by Resolving Technology Issues • Loss of access • Product complexity • Manufacturing changes Meeting the Markets Expectations!

32. Who Cares About Quality? Michael J Smith Michael.J.Smith@Teradyne.com More Information:-http://www.teradyne.com/atd/resource/type/web_recordings.html ORYour local sales engineer or Teradyne account representative