1 / 16

FSSR2 Hybrid Mechanics

FSSR2 Hybrid Mechanics. March 22, 2013 Matthew Jones. Current Status. PCB still out for quotes – contacted purchasing to find out what the delay is but have not heard back. Ordered 500 μ m glass wafers for the pitch adapter Found that 300 μ m was very fragile

chiku
Download Presentation

FSSR2 Hybrid Mechanics

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. FSSR2 Hybrid Mechanics March 22, 2013 Matthew Jones

  2. Current Status • PCB still out for quotes – contacted purchasing to find out what the delay is but have not heard back. • Ordered 500 μm glass wafers for the pitch adapter • Found that 300 μm was very fragile • No significant impact on wire bonding • Expect delivery early next week • Design for pitch adapter mask sent to company for fabrication • Waiting for purchase order to be processed • Expect delivery next week

  3. Mechanical Issues • Three separate mechanical issues: • Assembly fixture/carrier for wire bonding • Fixture for mounting two perpendicular sensors • Fixture for mounting 2x2 perpendicular sensors • Looking for common design features • Need some input on requirements and constraints

  4. Basic Idea • pitch adapter, sensors and FSSR2 chips assembled on the hybrid which is mounted on an assembly fixture • Hybrid is screwed to a plane that is recessed below the surface of a plate • This allows a cover to be placed over the whole assembly, or multiple assemblies to be stacked. • Provides light seal for both testing and operation.

  5. Basic Idea FSSR2 chip D0 sensor Hybrid Pitch adapter

  6. Assembly Process

  7. Assembly Process Spacer provides support and insulates the biased back side of sensor We probably don’t want a very rigid attachment here.

  8. Assembly Process

  9. Assembly Process

  10. Assembly Process Suitable for wire bonding, handling and testing

  11. Assembly Process

  12. Assembly Process Insert black foam rubber light seal here

  13. 1x1 Sensor Plane • The same geometry works as a stackable sensor plane. • Two plates, rotated by 90° screwed together • Provides 4 cm x 4 cm coverage

  14. 2x2 sensor plane • Same idea but a bigger hole in the middle • Two sets of mounting holes for the two possible sensor positions • More choices: • 2x2 sensor plane made from four assemblies? • 2x2 sensor plane made from two assemblies, each with two sensors at 90° • Might be inconvenient to also use this as an assembly fixture. • Some examples being investigated

  15. Telescope Frame • Planes need to mount in a frame • T-slot aluminum could be a good choice • Need more discussion to ensure devices to be tested fit and have easy access DUT

  16. Design Questions • Constraints on materials: • Do radiation concerns mean we should avoid aluminum and should use carbon fiber instead? • What spacing between sensors is desirable or undesirable within a plane? • Weight concerns: • Inconvenient if its too heavy • Unnecessary material could be removed to reduce the weight • Need to calculate some estimates • Other questions: • Good thermal contact with the hybrid • Do we want channels in case active cooling is needed/desired?

More Related