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Full Mission Simulation Report. NNU University Dr. Lawrence, Dr. Parke, Chad Larson, Ben Gordon, Seth Leija , David Vinson, Drew Johnson, Zach Thomas April 22 nd 2012. Mission Overview.
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Full Mission Simulation Report NNU University Dr. Lawrence, Dr. Parke, Chad Larson, Ben Gordon, Seth Leija, David Vinson, Drew Johnson, Zach Thomas April 22nd 2012
Mission Overview • The experiment is designed to test the feasibility of using Superhydrophobic materials in the presence of high acceleration and vibration for possible use on space missions. • The other half of the experiment is to test radiation hardened chips in the presence of high radiation in a true space flight.
Mechanical/Structure • The structure has not been machined but will be done this week • The integration procedure is simply mounting the Arduino and SH boxes to the lower plate and wiring power down from the top plate • A partial parts list has been written up Action Items • Finish making boxes – April 23 to 25th • Test for leakage – April 28th
Mechanical/Structure Team Pairing • We are interfacing with 4 supports with our payload on the bottom half. • Working on communicating complete project specifications
Design View Flexible & Radiation Hardened Chips AVR Board Geiger Counter Board Arduino Board Superhydrophobic “Boxes”
Electrical/CDH • Not all of the electronics have been integrated • The activation system works perfectly • The data has been sampled but not yet written to an SD card • The data does make sense • Action Items • The data needs to be written to the SD card • The last chip needs to be wire-bonded April 22nd to 25th
Testing Chips Ring Oscillator Voltage testing
Power (EPS) • Doing a 15 min test without the chips running The batteries’ voltage initially 9.31V, 9.32V The batteries’ voltage after 8.57V, 8.58V • The circuit is loading the Arduino microcontroller for power resulting in not enough power for writing correct data • Action items • Retest with both chips attached and reading data • Fix voltage loading • Permanent jumper wires to main power
Software • The preliminary software cannot be tested due to the header pins not yet connected. • Expected sampling rate is 1kHz currently 60Hz has been achieved • This is due to delay times in the test code • Action items • Determine pattern for and how to stream 1’s and 0’s to hexidecimal • Write output code
Action Item Summary • Mechanical • A machinist will finish making boxes • Test for leakage • Electrical • The data needs to be written to the SD card • The last chip needs to be wire-bonded • Power • Retest with both chips attached and reading data • Fix voltage loading • Permanent jumper wires to main power • Software • Determine pattern for and how to stream 1’s and 0’s to hexidecimal • Write output code
Conclusions • The project is behind schedule but can be completed with the main electrical student working May 7th to 11th once school is done • The mechanical portion should be completed May 3rd to 6th • The main problem is voltage loading. Once that is fixed the electrical side should be able to continue good progress