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Temperature Sensors on Flexible Substrates. Z. Celik-Butler, D. Butler and M. Chitteboyina Nanotechnology Research and Teaching Facility University of Texas at Arlington http://www.uta.edu/engineering/nano/ March 13, 2009. Temperature Sensor - CoventorWare Model. Flexible superstrate.
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Temperature Sensors on Flexible Substrates Z. Celik-Butler, D. Butler and M. Chitteboyina Nanotechnology Research and Teaching Facility University of Texas at Arlington http://www.uta.edu/engineering/nano/ March 13, 2009
Temperature Sensor - CoventorWare Model Flexible superstrate 0.15cm x 0.05cm x 0.005 cm Top surface is in contact with the structure Temperature Sensor cross-section cut Flexible substrate Temperature sensor is connected to external flexible circuitry through the flexible substrate
Z-scale exaggerated 5 times Aluminum Temperature Sensor Insulation Layers Sensor Element Right arm of the temperature sensor Left arm of the temperature sensor Flexible Substrate
Fabrication Process Flow for the Temperature Sensor Clean silicon wafer
Fabrication Process Flow for the Temperature Sensor 100 nm silicon nitride layer
Fabrication Process Flow for the Temperature Sensor Flexible Substrate Polyimide ~ 40 µm
Fabrication Process Flow for the Temperature Sensor Right electrode of the sensor
Fabrication Process Flow for the Temperature Sensor Sensor Element
Fabrication Process Flow for the Temperature Sensor First Insulation Layer
Fabrication Process Flow for the Temperature Sensor Left electrode of the sensor
Fabrication Process Flow for the Temperature Sensor Second Insulation Layer
Fabrication Process Flow for the Temperature Sensor Flexible Superstrate Polyimide ~ 40 µm Undercut made to access the sensor Second Insulation Layer Silicon Nitride ~ 100 nm
Top aluminum surface will be in contact with the structure Fabrication Process Flow for the Temperature Sensor Aluminum ~ 400 nm
Back side view of the Temperature Sensor Fabrication Process Flow for the Temperature Sensor Sensor are connected to flexible circuitry through the flexible substrate
370.5 K 300.0 K Temperature pulse applied on the top aluminum surface Temperature Sensor CoventorWare Model Temperature Sensor Simulation Results Bottom Flexible substrate kept either floating or fixed at 300 K Simulated, heating thermal time constant = 0.07 ms cooling thermal time constant = 0.67 ms
STEP 2 STEP 3 STEP 1 Sensor Element First Insulation Layer Right arm of the sensor Temperature Sensor Fabrication STEP 4 STEP 5 STEP 6, 7, 8 • Spin-coat and pattern polyimide superstrate layer • Deposit Aluminum layer • Etch the back-side of the wafer and get access to bond-pads Left arm of the sensor Second Insulation Layer
Temperature Sensor Fabrication • Spin-coat and pattern polyimide superstrate layer • Then deposited Aluminum on top of the superstrate layer to make contact with the structure
Temperature Sensor Results TS 80x80 µm Device 1 TS 80x80 µm Device 2