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ATLAS B eam C ondition M onitor Working principle

ATLAS B eam C ondition M onitor Working principle Distinguish interactions from background via time of flight With two symmetric stations at ± Δz/2 Interactions: in time Background: out of time on one side by Δt = Δz/c At high luminosity expect about one hit for each bunch crossing

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ATLAS B eam C ondition M onitor Working principle

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  1. ATLASBeam ConditionMonitor • Working principle • Distinguish interactions from background via time of flight • With two symmetric stations at ±Δz/2 • Interactions: in time • Background: out of time on one side by Δt = Δz/c • At high luminosity expect about one hit for each bunch crossing • Interactions at Δt = 0, 25, 50 … ns • Optimally distinguished background at Δt = 12.5 ns ⇒ • Δz = 3.8 m

  2. Sensors • Polycrystalline CVD diamond sensors chosen • Radiation hard – shown to work at > 1015 particles/cm2 • Fast signals – high velocity and cut-off due to trapping • Small leakage current – no cooling required • Procurement in collaboration with CERN RD-42 • Sensors produced and conditioned by Element Six Ltd. • Metallized with proprietary radiation hard process at OSU • Sensor properties • Size 10 mm x10 mm, active 8 mm x 8 mm (metallization) • Thickness ~500 μm • Charge collection distance ~220 μm • Holds ~ 2 V/ μm, operating voltage 1000 V, current ~ nA

  3. Fotec FE (500 MHz) 200 MHz BWL S/N ~ 7.5:1 S/N ~ 9.2:1 Typical MIP pulse Measurements with β source: Fotec FE (500 MHz) 200 MHz BWL S/N ~ 7.5:1 S/N ~ 9.2:1 Typical MIP pulse

  4. Measurements with β source:

  5. ~100 kRad ~100 m ~15 m electronics cavern ATLAS PP2 ~30 MRad Signal processing schematics ATLAS PIXEL • NINO amplifier-discriminator tests • Differential timing amplifier-discriminator (1 ns peak, 25 ns jitter) • LVDS output with width proportional to time-over-threshold • Radiation tolerant design by CERN-MIC • Signal split 1:12 into two inputs to increase dynamic range • Tests confirm suitability as BCM back-end chip

  6. Production status: • 8 module boxes completed, equippped with sensors • 2 spare boxes in production • brackets produced • 2 prototype NINO boards produced, measurements in beamtest running • beamtest with microstrip telescope underway

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