SWA Team Meeting, July 2013

1. SWA Team Meeting, July 2013 • PAS PROGRESS and STATUS • Outline: • PAS STM progress • STM AIT • Physical properties • STM planning • PAS EM Progress • New model philosophy EM-1 and EM-2 • IRAP FPGA progress • Planning • Another PAS critical issues (to complete before CDR) • PAS proto calibration • PAS/HIS ion optics modification • CEMs life time/Qualification • HV board progress • Cleaning/Purging

2. SWA Team Meeting, Feb 2013 PAS PROGRESS and STATUS Outline (continue): PAS/HIS Alignment PAS bracket PAS general planning

3. SWA Team Meeting, Feb 2013 • PAS (HIS IRAP) team: • Philippe Louarn(CoPI, Scientific leader) • Mechanics Design: • CarineAmoros • RomainMathon • Electronics Design Instrument (Calibration, etc) • Henry Claude Seran (system and HV) Jean Rubiell Romeo • Rituparna Baruah (HV) Philippe Rouger • Guillaume Ortner (FPGA boss) • Mathieu Petiot (FPGA, EGSE) • Wilfried Marty (Sequencer, EGSE) • LubomirPrec (Prague, Detector board) • Quality and Administration Project manager and Instrument scientist • Sandra BordonAndrey Fedorov • Catherina Garat • Gaelle Terrier

4. PAS STM progress Good news: STM is completed and passed mechanical tests and physical properties measurements. Model Realization See the red tag smart cover sealing both entrances

5. PAS STM progress Good news: STM is completed and passed mechanical tests and physical properties measurements. MLI is installed Mechanical test. Macor washers have been replaced with Ti ones

6. PAS STM progress Physical properties measurements results: External surface resistance measurements result: Thermal shield surface to the grounding point: < 10 Ohm MLI surface to the grounding point: < 2 Ohm White deflector housing: < 100 Ohm

7. PAS STM progress Next step: Thermal Balance Test in ESTEC Contract: OK Feedthrough: will be delivered in August 2013 Procedure: OK Predictive thermal analysis: OK The test should be completed on 19 Oct 2013 STM can be delivered to ASU on end of Oct. 2013

8. PAS EM progress Due to very early EM delivery date, to keep the continuity in PAS electronics progress we have decided to make two EMs: EM-1 (deliverable) and EM-2 (for working with and perform most of the tests) EM-2 (with detectors to test functionality in the vacuum chamber) EM-1

9. PAS EM progress. FPGA FPGA Board Schematics finished Place and route under progress Sequencer Software to edit, debug and simulate the FPGA execution of the sequencer was done Sequencer development is under progress High voltage sweeping algorithm done Peak tracking, HK development under progress

10. PAS EM progress. FPGA Items for FPGA splinter : • FPGA Component • EM : Does FPGA used is industrial or commercial quality? • QM/FM : Explicit the philosophy and planning of burning and post programming burning • FPGA board • EM : How soldering the FPGA and is PCB? • FPGA interface • Science packet encoding status? • Questions asked by the SWA team

11. PAS EM progress. FPGA and EM planning Delivery of the first FPGA prototype is a critical point for the PAS progress On October 2013 we will have two FPGA boards with no FPGA installed

12. PAS Critical Issues. EA calibration/modification The PAS/HIS calibration report is ready in the first (drafty) version. Main EA properties as functions of the elevation angle Last simulation

13. PAS Critical Issues. EA calibration/modification Energy response EA properties as functions of the elevation angle

14. PAS Critical Issues. EA calibration/modification HIS G attenuation for different elevation angles

15. PAS Critical Issues. EA calibration/modification We have realized that the main part of the problem is coming from the top cap – analyzer interface. The top cap is too small and the electric field is quite different in the center and at the periphery, But particle entering at the periphery still can pass the analyzer. See the next slide.

16. PAS Critical Issues. EA calibration/modification If we make a ray tracing with the same conditions as the calibration, for 14° of elevation angle for instance, we will see that only periphery ions pass the analyzer while the central ions almost suppressed. They move at too low altitude and strike the inner sphere.

17. PAS Critical Issues. EA calibration/modification D=0.05 D=0.10 If we try to pull up the ions by Utopcap, it acts for only the central part of the beam. The whole profile is moving with Udefl value.

18. PAS Critical Issues. EA calibration/modification What to do: Try to find the optimal voltage Change the deflector shape. It should be conical Try to change the size of the Top Cap Change the analyzer interplate distance Questions: 1. Whish variation of G(Elevation) is acceptable 2. Does HIS need a variable GF?

19. PAS CEM life time / qualification The small vacuum chamber for CEM life time tests HV boards testing is ready. HV board is the chamber (see photo) But we still did not start the CEM tests Date: End of August

20. PAS ion optics HV board HIS EA-IS HV boardunder calibration and test. Test at full voltage underdielectricliquid Test in vacuum withthermofoilheaters in preparation

21. PAS Cleaning and Purging Particulate contamination level Prediction of contamination according to: (ECSS-Q-ST-70-01C) Where: M is the ISO class, c = 0,069 a constant from measurement , p = 0,72 a constant from measurement PAC prediction on sensitive surface: Particulate contamination level Launch of a simulation with COMOVA to predictmolecular contamination on sensitive surfaces Sensitive surface Sensitive surface PAS Analyser Sensitive surface E-Box CEMs Cross view of PAS model usedon simulation

22. PAS Cleaning and Purging PAS Purging Calculationsbased on G. Ucker model Input parameters in table here opposite PAS purgingrequirements on table herebelow:

23. PAS/HIS alignment • The goal: we have to avoid a direct steady state sun light on any internal part of the sensor (see next slide) • The maximal possible steady state sun light ray deviation is 4.5°. This value includes: • EIDA R-140: 3.5° steady state off pointing • 1° solar radius at 0.28au • 3. We assume that PAS/HIS fixation plane uncertainty (deviation of the line of intersection of S/C YZ plane and the fixation plane form S/C X axis) is +/- 0.25° (EIDA R-074, communication with Erik (if I understood him correctly). -> see next page

24. PAS/HIS alignment • 4. We assume that we can provide an alignment inside the instrument +/- 0.25°. This is an uncertainty between PAS fixation plane and the PAS entrance axis. Thus we have 4.5° + 0.25° + 0.25° = 5° total possible deviation of the sun light from the instrument X axis. • 5. According these assumption the PAS/HIS sensor design was made as it is shown below. We have 10° free area to pass any possible steady state sun rays. • 6. ASTRIUM : • Agree to make a interface plate according to our spec. • Demands to prove the X axis alignment when the instrument is bolted. HO TO DO THIS? • Telecon 30th of July. We have to give an answer.

25. PAS interface bracket PAS bracket IRD and CAD do not conform to PAS in many aspects including the vertical position of PAS, URF etc

26. PAS interface bracket The mechanical interface is completely wrong.

27. PAS planning • EM: • EM-1: All boards and mechanics are ready to assembly: Nov 29, 2013 • EM-1: Ready for delivery (real delivery depends on DPU EM) Jan 2 2014 • FM HIS parts: • FM HIS EA mechanics design ready Nov 2013 (TBC) • FM HIS EA ready to delivery Mar or Apr 2014 (TBC) • HV board is ready for delivery Apr 2014 • FM PAS: • New EA design: Sep 2013 (optimistic) • PAS FM is ready for AIT Jun 2014 • PAS FM calibration Sep 2014 • Other tests Jan 2015 • PAS FM delivery Jan 2015 (optimistic)