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A Moisture Resistant Air Cavity Plastic Microwave Power Package Capable of Eutectic Die Attach

A Moisture Resistant Air Cavity Plastic Microwave Power Package Capable of Eutectic Die Attach. John W. Roman, Richard Ross, Tony Shaffer, Dave Dewire RJR Polymers Inc., Oakland, California 510-638-5901. RJR Polymers Inc.

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A Moisture Resistant Air Cavity Plastic Microwave Power Package Capable of Eutectic Die Attach

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  1. A Moisture Resistant Air Cavity Plastic Microwave Power Package Capable of Eutectic Die Attach John W. Roman, Richard Ross, Tony Shaffer, Dave Dewire RJR Polymers Inc., Oakland, California 510-638-5901

  2. RJR Polymers Inc. • Headquartered in Oakland, CA • Worldwide sales and engineering force • Manufacturer of injection molded plastic packages, pre-applied adhesives and equipment Provider of engineered solutions to our customers’ demanding product and process applications.partners

  3. R-Pak Air Cavity Packages • Plastic backed for low power package applications like sensors • CCD / CMOS for vision and optical sensor applications with glass covers • Thermally enhanced metal backed for microwave and power applications

  4. The R-Pak Process • Packages are molded around leadframes in a multi-up format • cost effective for molding and downstream assembly • Plastic formulated to match the CTE of copper for low stress and reliability • Leads are coated with moisture resistant polymer before injection molding • RJR ITS equipment supports package assembly and sealing

  5. RJR’s Injection Molded Packages • Package Stackup • Thermal Base (Cu, WCu, CuMoCu, AlSiC, etc) • Sidewall with leads • Lids with epoxy (pre-applied) • RJR formulated epoxy as interstitial layers • Plastic alloy formulated to match the CTE of Copper or Copper alloys (WCu, CuMo, etc.) • Leads are coated with moisture resistant polymer, then injection molded • The 3 layers are bonded together using RJR IsoThermal Sealing (ITS) equipment

  6. Thermally-Enhanced Package Build Process Process Steps RJR Polymers 2) Leadframe with moisture barrier applied 3) Injection mold sidewall over leadframe 4) Nickel and Gold plate leadframe 5) Epoxy coat molded sidewall 1) Package Base Customer location –or- RJR Location 6) Perform Die attach to base leadframe 7) Using RJR’s ITS system – attach assembled base leadframe to coated injection molded sidewall 8) Wire Bond device to package 9) Using RJR’s ITS system – seal package lid to molded sidewall 10) Trim, Form and singulate

  7. Package lid with pre-applied adhesive Lid Material: Plastic, Ceramic, Metal, Glass, etc. Injection molded sidewall Shown with moisture resistant seal encapsulating the leads and pre-applied adhesive on bottom surface Wire Bonds Device Thermally-Enhanced Package Exploded View Solder Preform or Epoxy, etc. Package Base Base Material: Cu, Cu/Mo, Cu/Mo/Cu, WCu, etc. Completed Package

  8. Moisture Resistance • IPC/JEDEC J-STD-202B Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices • intended to classify “nonhermetic solid state SMDs” by moisture sensitivity to ensure that proper handling precautions are applied • Applies to plastic SMDs with cavity or without cavity • Basic issue is vapor pressure change of water during solder reflow cycle causing damage • Delamination, cracking, leaks, “popcorning” • Low moisture sensitivity comes from choice of materials, design of package and good processes

  9. Hermeticity • JEDEC standard JES D22-A109-A defines test procedures • Derivative of MIL-STD-883, Method 1013 • Historic military definition of “hermetic” means sealed to a specified helium leak rate • Assumes cavity package • Excludes organic seals or materials

  10. Nonhermetic and Near Hermetic • Rationale that organics are “non-hermetic” based on diffusion rates of water through organic materials • Metal, ceramic and glass are considered hermetic • New organic materials challenge that definition • Near Hermetic is a common term without a clear definition • Moisture getters further confound the issue

  11. Cover material Lid seal Sidewall material Lead seal Lead material and finish Base seal Base material and finish Package Elements to Consider • Plus the process! • Design • Assembly

  12. Why Liquid Crystal Polymer? Superex Polymer Inc.

  13. RJR Plastic Alloy – HTP-1280 • R-Pak Plastic Body Compound • This custom thermoplastic compound is used in RJR R-Pak plastic body package technology. The following properties are typical for the bulk material molded into standard test configurations defined by the applicable test method. These property values are intended for general engineering purposes and are not intended for establishing product specifications. • Physical: • Density: 1.67 gm/cc ASTM D792 • Water Absorption 0.02% ASTM D570 • Mechanical @ 23C: • Tensile Strength 21,000 PSI ASTM D638 • Tensile Modulus 2.5 X 106 PSI ASTM D638 • Elongation @ Break 1.2% ASTM D638 • Flexural Strength 31,000 PSI ASTM D790 • Flexural Modulus 2.4 X 106 PSI ASTM D790 • IZOD Impact Strength Notched 1.6 ftlb/in ASTM D256 • Thermal: • Melting Point 280C (536F) ASTM D3418 • DTUL @ 1.8 Mpa (264 PSI) 270C (518F) ASTM D648 • Electrical: • Volume Resistivity 1012 ohm-cm ASTM D257 • Surface Resistivity 1017 ohm IEC 93 • Dielectric Strength 766 V/mil ASTM D149 • Dielectric Constant 3.8 @ 1 kHz ASTM D150 3.7 @ 100 kHz 3.7 @ 10 MHz • Dissipation Factor 0.007 @ 100 kHz ASTM D150 0.003 @ 10 MHz ASTM D150 • Arc Resistance 165 Sec. ASTM D495 • Comparative Tracking Index 175 volts ASTM D3638 • Chemical Resistance: • Not affected by: Water, Acetone, MEK, Methyl celusolve, Hexanes, (Sulfuric Acid, Nitric Acid, and HCl) as used in electroplating baths.

  14. Epoxy Sealing Materials • Common properties • Minimal moisture transmission • Low ionics • Very low volatiles (outgassing) • Cure in minutes for efficient assembly • Lead primer formulation • Adherent to LCP and lead finish • Viscosity supports efficient lead coating process • Sealing epoxy • Uniform cover and sidewall coating • Easily B-staged

  15. Process • Design • Appropriate sidewall thickness • Molding process • Tool design and process control • Epoxy application • Complete 4 sided primer application • Consistent application to sidewall and cover • Package assembly process • Isothermal Packaging System (ITS) • Lead forming • Tool design critical to maintaining package integrity

  16. Sealing Equipment - ITS(Isothermal Packaging System) • Semiautomatic • Custom Designed and Built Plates • Controls: • Time • Pressure • Temperature • UPH: 600 - 700* • 99% + Yield ** Run Rates are Dependant on Package Size and Configuration

  17. ITS programmed cycle Isothermal Packaging System • Lid is held up during temperature ramp up • At temperature, lid is released onto package • Piston applies pressure to lid preventing pinholes and blowouts

  18. Thermally Enhanced R-Pak • Moisture resistant and near hermetic • Capable of eutectic die attach • High thermal dissipation capability • High frequency capability • parts in service at 5.8 GHz • Can pass JEDEC Level I Moisture Pre-Conditioning • Pass Mil-Std 883 Section 1010 Condition C temp cycle

  19. RELIABILITY TESTING • RESULT • TEST • CRITERIA • SO2F • SO8 • LD2 • V32 • V48 • V52 • THERMAL SHOCKJEDEC A106A, Condition C.15cycles, +125°C to -65°C • GROSS LEAKJEDEC A109, Condition C1&3 • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass • MOISTURE SENSITIVEJEDEC A112A / J-STD-20-A+85°C/85%HR, 168hrs • DIE PENETRATIONMIL-STD- 883E, Method 1034 • 20/20 Pass • 20/20 Pass • 20/20 Pass INC INC INC • INTERNAL VISUALMIL-STD-883E, Method 2014 • SOLDER REFLOWJEDEC A112A / J-STD-20-ACONV OVEN MAX. TEMP +220°C • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass • PACKAGE COPLANARITYJEDEC B108 • 20/20 Pass • STABILIZATION BAKEJEDEC A103ATEMP +150°C, 200hrs. • PHYSICAL DIMENSIONSJEDEC B100A INC INC INC INC INC INC • TEMPERATURE CYCLINGJEDEC A104B, Condition B100 CYCLES, +125°C to -55°C INC INC INC INC INC INC • PRECONDITIONINGJEDEC A113B+85°C/85%HR, 168hrs • N= 20 20/20Pass INC INC INC INC INC • WIRE BONDABILITY • WIRE PULL STRENGTHMIL-STD-883E, Method 2011.7N= 20 • MAX/MIN10.5g 8.5g12.1g 8.1g • MAX/MINXX.Xg X.XgXX.Xg X.Xg • MAX/MINXX.Xg X.XgXX.Xg X.Xg • MAX/MINXX.Xg X.XgXX.Xg X.Xg • MAX/MINXX.Xg X.XgXX.Xg X.Xg • MAX/MINXX.Xg X.XgXX.Xg X.Xg • DIE ATTACHABILITY • INTERNAL VISUALMIL-STD-883E, Method 2010.10 & 2017.7N= 20 • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass • 20/20 Pass

  20. Eutectic Die Attach in an Air Cavity Plastic Package ! The R-Pak low cost injection molded packaging process combines the thermal advantages gained by using a eutectic die attach material between die and backplane with a moisture resistant plastic sidewall specifically designed to manage higher frequency and power. • Features: • Eutectic Die attach • Moisture resistant • Low CTE • CTE matched package • Low Dielectric • Low Parasitics • High Power • High Frequency • Low Cost ! • Package Applications: • RF/ Microwave • WLAN/ LAN • Short Range Wireless • MEMS/ MOEMS • LDMOS • CCD/ CMOS

  21. Pre-applied Adhesives Prototype Design And Assembly Sealing Equip ITS AITS De-reelers Injection Molded Plastic Packages www.rjrpolymers.com

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