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Steven Wei Semiconductor Products Group

Steven Wei Semiconductor Products Group. Efficient & Innovative Handset Components Solutions. Agenda. Introduction To Agilent Semiconductor Products Group Solutions For RF Front-End Devices Enablers for RF Front-End Integration E-pHEMT & HBT PA FBAR RF Front-End Integration

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Steven Wei Semiconductor Products Group

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  1. Steven WeiSemiconductor Products Group Efficient & Innovative Handset Components Solutions

  2. Agenda • Introduction To Agilent Semiconductor Products Group • Solutions For RF Front-End Devices • Enablers for RF Front-End Integration • E-pHEMT & HBT PA • FBAR • RF Front-End Integration • Solutions For Feature Phones • IRDA and Sensors • LED’s • Conclusions Agilent Restricted

  3. SemiconductorProducts Automated Test Life Sciences and Chemical Analysis Test andMeasurement $1.4 B $0.9 B $2.0 B $2.9 B Technology Synergy Agilent Laboratories Shared Infrastructure Agilent Revenue - $7.2 Billion in FY04 Agilent Restricted

  4. Agilent Semiconductor Products Group Market Focus Mobile Storage, Computing & Networking Optoelectronics • Wireless Semiconductors • Mobile Imaging • Infrared / Sensor Products • Computing, Storage and Networking ASICs • Printer ASICs • Storage and Networking ASSPs • Fiber Optics Products • Optoelectronic Products • Isolation Products • Motion Control Products • Optical Navigation Agilent Restricted

  5. Consumer Demand Drivers • Cost, simplicity, size and fashion. • First and foremost, it’s a phone. • Increasingly it’s a digital consumer electronics product. • Increasing emphasis on visual communications. • Large color LCD screens with white LED backlighting. • Embedded cameras and LED flash lights. • Color phone housings and blue LED keypad backlighting. • Seamless connectivity. • Maximum geographic coverage and seamless roaming. • Ability to share information between personal and/orenterprise equipment (PAN/LAN/IR connectivity). • Value added functions. • Music, games, remote control, GPS, TV tuners etc. Agilent Restricted

  6. Solutions for Mobile Communications LED Flash Higher quality pictures CMOS Image Sensors Camera functionality IrDA + Remote Control, IRFM Size advantage plus increased functionality Front-End Modules Size advantage and higher integration Proximity Sensor Automates speaker phone E-pHEMT & HBTPower Modules Extend battery life Ambient Light Photo Sensors Extend battery life FBAR Filters Size & performance advantage Navigation Improved user interface Color Chip LEDs Improved aesthetics Agilent Restricted

  7. 3G 2G 2.5G Bigger Color Display Live Video Full PDA Feature Internet Terminal Bigger Display Music Graphics Some PDA Features Voice / High Speed Data Packet / IP Based Voice Circuit Switch Voice / Data Packet RF RF Front-End W-CDMA RF Front-End GSM RF Front-End GSM RF Front-End W-CDMA RF/IF (Radio) • Multi-Band • Multi-Mode • More Memory Flash 4MB -> 32MB SRAM 2MB -> 8MB • More MPU Power • Multi-Band • Multi-Mode • LAN/PAN/ALI GSM RF/IF (Radio) GSM RF/IF (Radio) RF/IF (Radio) Base-band Base-band Base-band • Camera • Bluetooth • Memory Card • GPS • More Memory Base-band GPS RF/IF (Radio) Base-band Board Area RF 45% Base-band & Digital 55% RF 50% Base-band 50% RF 40% Base-band & Digital 60% RF Module or Radio Module RF Chipset + RF Module RF Chipset or Discrete The Quest for Increased Feature and Functionality for Voice & Data Terminals Calls for Low Cost and Highly Integrated RF Front-End and/or Radio Modules. Market Driver Agilent Restricted

  8. CMOS(130nm  90nm  65nm) SiGe BiCMOS or CMOS(250nm180nm130nm) MCOB (Organic or LTCC) GaAs, Filter, Passives 3G Transceiver RFIC Duplexer 3G AFEM / BB FLASH RAM Camera Module PA RF FEM Switch Filters Control Rx RFIC (Direct Conversion) AFE Companion LSI Wireless Base-Band Application Processor LCD Display Module VCO / PLL (Fractional N) Tx RFIC (Direct Mod and etc..) PA APC Keyboard Regulator DC-DC Power Management Battery What’s RF FEM (Front-end Module)? Evolution of Module Integration Evolution CMOS Integration Agilent Restricted

  9. EnhancementmodepsuedomorphicHighElectronMobilityTransistor A better GaAs Technology integrated matching & bias High Power Added Efficiency increases talk time in phones(all standards) vs. competing technologies High Linearity, High Band Width excellent for both linear and polar EDGE implementations superior for CDMA, W-CDMA high-performance multi-band PAs Excellent Low Voltage Operation operates well down to 1 V Enhancement Mode FET single positive supply Output stage CDMA PCS-band power module with lid removed Agilent Restricted

  10. Talk Time • Most Transmit Power Usage : -10 to 10 dBm • But, PAM is optimized for full power (28 dBm) • Poor efficiency in the mostly used power region • More than enough linearity in the low power region The Technology- CDMA Power Usage Pattern Agilent Restricted

  11. CoolPAM technology allows stage bypass without switches • Reduced insertion losses • Improved efficiency • Smaller die size Agilent’s CoolPAM Circuit Topology Digital Control Using Series Switching 4 1 1 4 No Switches! Low - power mode Agilent Restricted

  12. - Comparison of Average Current The CoolPAM Technology Past Present Future Projection Urban 160 Cool PAMTM Suburban 136 140 Future Technology Available Now ! 118 120 105 100 89 Average current ( mA ) 77 80 59 55 60 36 40 28 27 18 20 0 ConventionalPA Smart PA Analog Control Stepped Vcc Cool PAM I Cool PAM II Cool PAM III Source : RFIC symposium 2003 Agilent Restricted

  13. The CoolPAM Technology • US PCS band Performance Comparison Agilent Restricted

  14. : physical limit Agilent Value Proposition The Talk Time Value of CoolPAM Projected Talk Times (Hrs) Measured Talk Time (minutes) Output power Common PAM Cool PAM I Cool PAM II 10dBm 205 232 237 16dBm 190 221 226 Projected Packet Data Transfer Times (Hrs) Battery Capacity : 850mA·h Tested with actual phone board for Verizon models Agilent Restricted

  15. FBAR fo+3% FBAR fo+3% FBAR fo FBAR fo FilmBulkAcousticResonators Vibrating membrane creates resonance Breakthrough resonator technology displacing Surface Acoustic Wave (SAW) and ceramic dielectric filters FBAR Membrane Miniaturized Filtering Acoustic resonator yields very small, very thin products Superior Electrical Performance Steep roll-off, low loss from high kT2 * Q High power handling (> 1 W) from bulk structure Excellent for Integration Low temperature coefficient allows co-location with hot PAs and ICs Same thermal coefficient of expansion as silicon Silicon-Based for Low Cost Leverages Si processing; 6” wafer size 400 MHz to >10 GHz capability Contact Resonators are built into a filter structure CDMA PCS duplexer Ceramic Solution: 5.5 x 5 x 24 mm FBAR Solution: 5 x 5 x 1.4 mm Agilent Restricted

  16. FBAR Product Evolution FBAR Technology Introduction Phase Ceramic Packaged PCS Duplexer and Tx BPF HPMD-7904 ACPF-7001 3 x 3 x 1.1 mm3 5.6 x 11.9 x 1.9 mm3 ACMD-7401 ACPF-7002/3 PCS 1.6 x 2 x 1.0(Max) mm3 5 x 5 x 1.4(Max) mm3 New Products Coming Soon cell PCS WCDMA 2100 KPCS 3.8 x 3.8 x 1.4(Max) mm3 GSM RX QB 150 Ohm Dif-Dif ~0.8 mm sq, <0.3m thickness uCap Technology Introduction Phase uCap MCOB PCS Duplexer and Tx BPF FBAR Product Proliferation Phase Agilent plans to introduce 4 new 3.8x3.8mm duplexers and uCap GSM QB filters to further widen Agilent’s market presence and establish strong presence in the RF filter market. Agilent Restricted

  17. In Development W-CDMA 2100 FBAR Duplexer Small Size 3.8 x 3.8 x 1.4(Max) mm Excellent performance Tx: I.L. 1 dB typ, 1.5 band edge; Tx Band Isolation > 50 dBRx: I.L. 1 dB typ, 2.0 band edge; Rx-band Isolation > 45 dB Same proven reliability and power handlingas HPMD-7904 and ACMD-7401 Agilent Restricted

  18. Front-End Integration Partition - CDMA “By-Technology” Partition • Notes: • Not showing all the details of all components being integrated. • This is only showing the potential next step and will not be the ultimate integration or partition roadmap. “By-Band” Partition Agilent Restricted

  19. Agilent CDMA Front-End Module RX AFEM-7731 (5x8mm2) FBAR uCap Duplexer 5x5mm2 NEW FBAR Duplexer E-pHEMT Power Amp Matching SMDs ANT Mat-ching Tx RFIN E-pHEMT Power Amp 4x4mm2 • Combines Best-In-Class CDMA PA and Duplexer with optimized interface • Smaller Size (up to 50% board space savings) • Reduced Part Count (up to 65% parts count reduction, including passives) • Enhanced Radio Performance with guaranteed system level specs • High Effective PAE, which includes duplexer and matching loss • Low “Full-Duplex NF” for high sensitivity • Low “Tx Power at Rx” for STD test • Excellent Low Voltage Performance for DC-DC Converter operation • Less susceptible to Interference because the signal trance and reference ground plan are contained in the module. • Bulky and costly isolator is eliminated Agilent Restricted

  20. FBAR Duplexer E-pHEMT Power Amp ANT Passive OutputMatching On-Chip Inter-stage Matching Passive Input Matching TX IN Bias Network Vcntl Vdd2 Vdd1 Vbias • Specifications (Typical): TX: 1850-1910 MHz • Idd: 355mA (Pout= 24.5dBm) 95mA (Pout= 11.5dBm) • ACPR1: -55dBc • ACPR2: -60dBc RX: 1930-1990 MHz • Insertion Loss: 2.2dB • Noise Figure (Pout=24.5dBm): 3.6dB • Includes Rx-band noise from TX • TX power at Rx pin: -27.5dBm AFEM-7731, PCS CDMA FEM (2-element) RX 5x8x1.3mm3 MCOB Module • Product Description: 1900MHz CDMA 2-element FEM Optimized COB (Chip On Board) module integrated E-pHEMTPA & FBAR duplexer • Product Features: • 3.4V Operation (3.2V min.) • Small size: 5 x 8 x 1.3 mm Package • High PAE(Low current, 355mA typ at max Pout) • Low Quiescent Current < 50mA • Fixed and Dynamic Bias Control • Can be biased from DC/DC converter • High Isolation Tx-Rx • Low Rx-band Noise Leakage @ Rx port • Low Tx-band Signal Leakage @ Rx port • No Isolator Required • Encapsulation Molded Lid • Production Shipping Now ! Agilent Restricted

  21. RF front-end solutions Summary There are many combinations of the bands and modes for new 3G handsets. There are multiple options to partition the radio front-end for a given combination of bands and modes. This is a challenging situation for RF component suppliers. This may not be a big problem for Base-band and RFIC, since Moore’s Law will help integrate more functionalities on Silicon. However, RF front-end uses a MCOB (Molded Chip On Board) module to integrate multiple functionalities and different material. RF front-end modules need to be carefully partitioned and integrated for reducing size, optimizing performance and also lowering cost. Agilent owns GaAs E-pHEMT , HBT Cool PAM and FBAR as core technologies for the RF front-end building blocks, such as PAs, Switches and Filters for all the standards/bands. Both Agilent’s PA and FBAR provides the best-in-class performance, and proven high volume manufacturing capability. CDMA Tx Module (Integrated PA and Duplexer) has been developed and now in high volume production phase. It demonstrates the performance improvement by the optimized interface. Next challenge is the integration of multiple W-CDMA and GSM RF front-end functionalities. Agilent Restricted

  22. IrDA Protocol Stack Software Accelerates IrDA adoption and implementation 1 2 3 4 5 6 7 8 9 * 0 # Optical Touch Panel Replaces hard key pads Proximity Sensor Automates speaker phone Mini-Endec Accelerates IrDA adoption Extensive ProductOffering for Mobile Phones UV Sensor Increases phone feature IrDA TransceiverSize advantage Customised module Remote control feature IrFM SIR+RC, FIR+RC, VFIR Ambient Light SensorExtends battery life Agilent Restricted

  23. Remote Control Financial Messaging ConsumerApplications Digital Imaging Imaging appln in camera phones • Image exchange • Image archive • Image printing Target Market Overview Applications for Mobile Phones Agilent Restricted

  24. Agilent Surface-Mount LEDs • Top 3 LED supplier • #1 in InGaN blue LEDs for backlighting • Wide range of package sizes and configurations • Full range of LED colors • Full spectrum of single-color LEDs • Bi-color and tri-color LEDs • High volume, low cost manufacturing; billions of LEDs shipped Agilent Restricted

  25. Agilent Camera Flash Module SMW-C860, HSMW-C820 • Ideal For Camera Phones • Very high brightness • Own IP position • ESD protection • Slim package size • 2 soldering terminals Agilent Restricted

  26. Applications • AF auxiliary light source for cameras • Red-eye reduction lamp Self-timer display Preliminary Features • 8° Narrow Viewing Angle • Available in Red Orange color • Iv > 15cd @ 20mA. • Light up distance up to 3 meters • Max driving current : 50mA • Available in SMT Package • Package size: 4.8mm x 4.8mm x 5.3mm Auto Focus Auxiliary LED (Future Product) Agilent Restricted

  27. Agilent Flexible Light Strip (Future Product) • IP by Agilent • Small in strip shape, LED on 2 side, Æ 1.5 mm, any custom length • Flexi and Bendable (optical clear silicone) • Easy for assembly Agilent Restricted

  28. LCD Backlighting LCD Right angle Mt: C110,C120,tricolor Top Mt:C130, C191, C197, bicolor, tricolor Indicator • Bicolors: C15x, C16x - Tricolor: C118, C115 Camera Flash White : HSMW-C820, C830 Decorative Lighting Tricolor: C118, C115 Your ONE STOP SHOP for Cellular Phone Lighting !! Keypad backlighting Top Mt: C191,C197, C130 Reverse Mt: C265 Agilent Restricted

  29. Conclusion • Mobile phones have entered a powerful new upgrade cycle drivenby a transition from voice-centric todigital and imaging-centric features • However, consumers won’t sacrifice size, fashion and styling • Agilent’s innovative semiconductor solutionsdirectly deliver or help enable the new featuresthat consumers demand • Agilent compliments this strong portfolio of semiconductor solutions with worldwide leadership in mobile test Agilent Restricted

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