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RTAX-S Qualification and Reliability Data

RTAX-S Qualification and Reliability Data. September 7-9, 2005 2005 MAPLD International Conference Minal Sawant Ravi Pragasam Solomon Wolday Ken O’Neill. Outline. Design Overview MIL-STD-883B Enhanced Antifuse Qualification (EAQ) Sample Size and Test Sequence Results MIL-STD-883B

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RTAX-S Qualification and Reliability Data

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  1. RTAX-S Qualification and Reliability Data September 7-9, 2005 2005 MAPLD International Conference Minal Sawant Ravi Pragasam Solomon Wolday Ken O’Neill

  2. Outline • Design Overview • MIL-STD-883B • Enhanced Antifuse Qualification (EAQ) • Sample Size and Test Sequence • Results • MIL-STD-883B • Enhanced Antifuse Qualification (EAQ) • Enhanced Lot Acceptance (ELA) • Plan • Results Terminology: EAQ = ELA (both processes use the same design) Group C = High Temperature Operating Life (HTOL) = Dynamic Programmed Burn In (DPBI)

  3. MIL-STD-883B Uses the QBI (Qualification Burn In) design Goal: Device Feature Maximum Utilization of logic cells Test all IO standards Test all macro offering (Carry chain, buffys etc) Test RAM feature Test for propagation delay Note: QBI = QCMON EAQ Uses the EAQ design Goal: Antifuse Reliability Tests all possible antifuse type Based on NASA style design Test for delay perceptibility Design Overview

  4. QBI Design EAQ Design Top Level

  5. QBI includes one small delay chain EAQ includes 8 delay chains Delay Paths 22 Stages: ~ 36 ns

  6. Design Summary • QBI • I/O’s are configured with all the different combinations of I/O standards, slew and pull-up resistor (I/O standards LVTTL, PCI, and PCIX, LVPECL, and Vref are used) • EAQ (RTAX1000S-CG624)

  7. Antifuse Utilization

  8. QBI : 129 equivalent RTAX2000S-CQ352B devices used at 125°C Additional 78 devices of RTAX1000S-CQ352B used for LTOL (Low Temperature Operating Life) experiment at -55°C EAQ : 300 devices of RTAX1000S-CG624 used Sample Size

  9. QBI : HTOL QBI : LTOL EAQ : AXS1 EAQ : ASX2 Test Sequence

  10. QBI Summary • QBI • For RTAX2000S (87 units) = 84 + 3 spares • For RTAX1000S (98 units) = 90 + 8 spares • 7 failures were observed during the HTOL and LTOL tests

  11. QBI FA Investigation & Conclusions • All the 7 failures* observed from the (QBI) devices indicated identical failure signature due to equipment induced ESD • Physical Failure analysis indicated damage to the ESD circuit • Duplication of failure mode with MM testing indicated identical failure signature • ESD zap is due to the charge buildup on the CQ352 socket lid • This charge does not exist on the CG624 package • Thus no failures observed in the EAQ experiment • No additional failures due to ESD have been observed since the use of ESD friendly and staticide treated socket lids • De-processing of a second failed device showed the same failure signature • RTAXS Passed ESD at 2000 V HBM • RTAXS Passed ESD at 250 V MM *Failure analysis report available upon request

  12. EAQ Summary • EAQ • 9 failures were observed during the HTOL and LTOL tests • 8 Failures had identical failure signature • 1* (HTOL after 1000 hrs) unit has a different failure signature • Failure Analysis under progress • Antifuse has been eliminated as a potential cause • No Antifuse failures observed • EAQ experiment will be continued for an extra 1000 hours of HTOL on a sample size of 120 units from above lot • Results expected by Mid October 2005

  13. EAQ FA Investigation Conclusions • Analysis and testing showed that all 8 failures* were on the same output pin “AE16” • All 8 devices came from burn-in board locations D1 and D2 • Failure analysis indicated that the damage was on the output buffer pull-down transistor • Damage was due to contention problem on the burn-in boards • The -1V on the output, with over 300 mA current, exceeded the absolute worst case condition for extended periods • No additional failures have been observed since the contention was eliminated • AXS1 completed 250 hrs of LTOL and AXS2 completed 1000 hrs of HTOL with no failures • De-processing of a second failed device showed the same failure signature *Failure analysis report available upon request

  14. ELA Plan • Uses the same high perceptive design as EAQ • ELA is the EAQ design used in the production flow of RTAX-S devices • A sample of units will be tested per each wafer lot before shipment • This will qualify the lot for shipment • Units will be programmed to the ELA design • Units will be sent for 168 hours of Burn in at 125°C • 100% yield is required to qualify lot for shipment

  15. ELA Results • Results to date – No Antifuse failures • Shipping RTAX-S to Space Flight Applications today

  16. DSCC SMD Application Status • SMD# • Pre-assigned SMD# for RTAX-S are • 5962-04219 for RTAX250S • 5962-04220 for RTAX1000S • 5962-04221 for RTAX2000S • SMD Application • SMDs in draft • Derived from Actel datasheet • Qualification Package in preparation • Qual results, FA reports, with TRB approval minutes • Qual lots attribute sheets, copies of assembly/test/burn-in travelers • Silicon technology summary • with XSEM showing planarized process • Support documents • Submission to DSCC being planned for the end of October 2005 • Certification expected by the end of 2005

  17. Conclusion • NO ANTIFUSE FAILURES • More than 650,000 hours of test data available now • MIL-STD-883B Qualification completed successfully • EAQ experiment completed successfully • 150 units with 1000 hours of HTOL and 250 hours of LTOL • 150 units with 250 hours of LTOL and 1000 hours of HTOL • Shipping RTAX-S to Space Flight Applications today • Both “B” & “E” flows shipping

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