Conference on Substitution Hamburg, 13-14 June 2002

1. Working Group 3 Printed Circuit Boards Introduction by: J. Lohse, Ökopol Conference on Substitution Hamburg, 13-14 June 2002

2. Some Characteristics of Printed Circuit Boards: • Integral part of all electronic devices (IT, consumer goods, automotive etc.). • High-volume market, significant growth rates. • The dominating material is FR4 (glass-fibre reinforced epoxide). • UL-94 norm commonly applied defines classes V0, V1 related to resistance to flammability. • Substances most commonly applied to achieve flame resistance are brominated organic chemicals.

3. Concerns about brominated flame retardants (BFR) • Toxic and suspected CMR properties of many BFR substances • Low biodegradability and/or formation of toxic metabolites • Diffuse losses from products in use • Ubiquitous occurrence in urban environment and remote areas • Found in human blood (exposed workers) • Found in human breast-milk (general population) • PXDD/F formation upon accidental fire • PXDD/F formation upon thermal stress during recycling

4. Initiatives at the political level • Voluntary phase-out of some BFR by German chemical industry (after their behaviour as dioxin precursors was discovered) • Draft ROHS Directive requires substitution of PBB / PBDE • EU Risk Assessment on TBBA (ongoing) • Draft WEEE Directive requires dismantling of BFR-components • Legislative initiatives (e.g. in Germany and Denmark) • Eco-labelling criteria (EU flower, national & private labels) restrict the use of some or even all BFR. • Pressure from environmental NGOs.

5. Initiatives at enterprise level (individual companies) • Circuit board manufacturer: disposal problem for production waste initiated search for substitutes • E&E manufacturer: early internal ban of PBB and PBDE - working towards total BFR phase-out to fulfill eco-label criteria • Car manufacturer: early internal ban of PBB and PBDE - working towards halogen-free materials in general where possible • Base-material supplier: offers halogen-free FR4 material and seeks first mover advantage • Market pressure from several Asian manufacturers • [parallel efforts in Asia and US to phase out Pb solder]

6. Substitution strategies • Use of TBBA instead of PBB / PBDE • polymerized TBBA (reduces some but does not avoid all risks) • Phosphorus-based FR (shielding effect by solid-base reaction) • Mineral-based FR (ATH and similar - dilution & cooling effect) • Change of base material (e.g. foams, polysiloxane etc.) • Geometric separation of high and low voltage components • Reduce operating voltage. Substance --> material --> product level

7. Use of P-based FR instead of TBBA - arguments and questions: • Economics • Additional cost of material ?! • Investments in process necessary ? • Dependance on single supplier ? ! • Technical functionality • Functional equivalence of substitute ? (safety standards, market requirements) • Communication / awareness • Necessity to involve all actors in the chain ! • Ecotox-profile as strong driver at company level ?? • Risk Assessment • Sufficient knowledge about ecotox-profile of substitutes ? • Regulative frame • Upcoming legislation ! • Existing standards in favour of traditional solutions ?! • Timing of innovation depends on parallel developments (e.g. Pb-free) !

8. Questions to the Working Group:  Is it a case for substitution - YES or NO ?  If YES: what is needed to promote substitution ? (present barriers, supportive actions, legal or market instruments etc.)  If controversial: what would be the right procedure to decide ? (criteria; stakeholders to be involved; ...)  [if all say NO: why then are BFR high on the political agenda ?]