1 / 24

Preliminary LumiCAL FEE Specification

Preliminary LumiCAL FEE Specification. Presented by Alexander Solin NC PHEP solin@hep.by. FCAL collaboration meeting , February 12-13, 2006, Krakow ( INP PAS) , Poland. Contents. Preliminary LumiCAL FEE Specification

duscha
Download Presentation

Preliminary LumiCAL FEE Specification

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Preliminary LumiCAL FEE Specification Presented by Alexander Solin NC PHEP solin@hep.by FCAL collaboration meeting, February 12-13, 2006, Krakow (INP PAS), Poland

  2. Contents • Preliminary LumiCAL FEE Specification • ASICs for FCAL detectors prototypes (main parameters measurement setup, bench and beam tests) February 12-13, 2006, Krakow A.Solin

  3. Preliminary LumiCAL FEE Specification February 12-13, 2006, Krakow A.Solin

  4. Estimation of the padSi-sensor capacitancies February 12-13, 2006, Krakow A.Solin

  5. Estimation of the stripSi-sensor capacitancies February 12-13, 2006, Krakow A.Solin

  6. Estimation of the maximum Si-sensor charge collection (1-1000)MIP channel signal range from B.Pawlik’s talk February 12-13, 2006, Krakow A.Solin

  7. LumiCal Si-sensorparameters February 12-13, 2006, Krakow A.Solin

  8. LumiCAL ASIC requirements February 12-13, 2006, Krakow A.Solin

  9. ASIC technologies Next four pictures can help to estimate noises of frond end electronics. Calculations are done for Bi-JFET technology (see picture). Same calculations can be done for other technologies. Preamplifier noises will be similar to the presented calculations. February 12-13, 2006, Krakow A.Solin

  10. Capacitance of Si-sensor vs its area 572pF 28pF February 12-13, 2006, Krakow A.Solin

  11. ENC vs preamplifier power consumption 8000e February 12-13, 2006, Krakow A.Solin

  12. ENC vs shaping time 8000e February 12-13, 2006, Krakow A.Solin

  13. ENC vs Si-sensor Capacitance 572pF February 12-13, 2006, Krakow A.Solin

  14. ASICs for FCAL detectors prototypes(main parameters measurement setup, bench and beam tests) February 12-13, 2006, Krakow A.Solin

  15. Tetrode-BT, Tetrode-JFET ASICs 1996 year, CMS ECAL Two designs CSP were made in Minsk NC PHEP withslightly different circuits for amplifying of signals from Hamamtsu R2149 vacuum phototetrode: “TETRODE-BT” with bipolar input transistor; “TETRODE-JFET” with p-JFET input transistor. February 12-13, 2006, Krakow A.Solin

  16. Design requirements to Tetrode CSPs Hamamtsu R2149 parameters: CSP requirements: February 12-13, 2006, Krakow A.Solin

  17. CSP based on Tetrode JFETENC=320e+18e/pF, Tp=800ns February 12-13, 2006, Krakow A.Solin

  18. AS01PDA, AS01T ASICs 2002 year, TESLA THCAL NextAS01PDA ASIC were designed and manufactured in Minsk NC PHEP for amplifying of signals from photodetectors. The AS01PDA ASIC is a development of the “Tetrode BT” design line. It additionally contains a shaper and shaper gain control stage. February 12-13, 2006, Krakow A.Solin

  19. AS01PDAmain parameters February 12-13, 2006, Krakow A.Solin

  20. AS01PDA block diagram February 12-13, 2006, Krakow A.Solin

  21. AS01PDA tests • October, 2002 • Output signals were digitalized with theTDS3032 scope. February 12-13, 2006, Krakow A.Solin

  22. AS01PDA noise curves • February, 2006 • Noise is measured with the Infiniium 54830B scope. February 12-13, 2006, Krakow A.Solin

  23. ASIC for large capacitance detectors AS01T is optimazed for using with large capacitance detectors. • It has the same structure as AS01PDA. • The package is the same too. • Both chips (AS01T and AS01PDA) are placed on the same wafer and are manufactured in one process. February 12-13, 2006, Krakow A.Solin

  24. Conclusion The next steps of development of FEE for FCAL • Making of readout electronics for immediate beam tests (Tetrode, AS01 ASICs) • Qualification of LumiCAL ASIC specification and design of new prototype of 22 channel preamplifier-shaper ASIC for amplifying of Si-detector signals. • Creation of multichannel readout electronics for larger FCAL prototypes. February 12-13, 2006, Krakow A.Solin

More Related