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Packaging

Packaging . Emily F. Burmeister , Walter Yuen , Henrik N. Poulsen, John P. Mack, John E. Bowers, Daniel J. Blumenthal. Buffer Packaging. First package has been completed successfully.

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Packaging

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  1. Packaging Emily F. Burmeister, Walter Yuen, Henrik N. Poulsen, John P. Mack, John E. Bowers, Daniel J. Blumenthal

  2. Buffer Packaging • First package has been completed successfully. • Largest challenge - fiber affix. However reasonable coupling efficiencies to spot size converters were achieved (-3.9 dB, -4.7 dB, -6.2 dB, and -7.4 dB) for the four ports of the first package. DOD-N PI Review, November 6-7, Santa Barbara, CA

  3. Buffer Assembly Order • Assembly order is critical 1. Chip on carrier, wirebonds (AuSn paste @280˚C) 2. Carrier on submount (In solder ribbon @160˚C) 3. Fan-out boards to package (In solder ribbon @160˚C) 4. Surface mount thermistor (Ag epoxy @125˚C) 5. Submount to TEC and TEC to package (epoxy or _ ˚C) 6. Solder TEC leads to fan-out board 7. Wirebond to fan-out boards and package pins (100 ˚C) 8. Bring chip to operating conditions and perform fiber attach using UV-curing low-shrink epoxy 1 3 3 5 8 DOD-N PI Review, November 6-7, Santa Barbara, CA

  4. Buffer Packaging Innovations and Challenges • Innovations • Detachable wall allows for easier fiber manipulation and attach • Fiber assemblies have not been implemented in the first package, but should allow for easier fiber alignment as well and more strain relief. • Challenges • Achieving the right heights for fiber epoxying is difficult • Epoxying the fiber directly to the carrier can be too little height difference. • 100 micron additional height difference provided by submount is too much. DOD-N PI Review, November 6-7, Santa Barbara, CA

  5. A Super Cooler for High Heat Flux and Localized Heating Applications W. W. Yuen J. P. Tu Department of Mechanical Engineering University of California, Santa Barbara, Calif. 93105 DOD-N PI Review, November 6-7, Santa Barbara, CA

  6. Passive Hybrid Super-Cooler Motivation Goals: To allow operation of a high power device at room temperature (20 ˚C) without the use of a thermoelectric cooler; thus saving overall power consumption The passive cooler should be able to dissipate up to 2 W by natural convection. With internal fins, we anticipate that it can dissipate 5 W or more. Gene Tu and Walter Yuen DOD-N PI Review, November 6-7, Santa Barbara, CA

  7. Package Selected for the Current Study DOD-N PI Review, November 6-7, Santa Barbara, CA 7

  8. Numerical Modeling To assess the effect of replacing a “supporting” packaging material (Kovar, k = 17.3 W/m-K, a = 4.6e-6 m2/s) with Carbon Foam (k = 135 W/m-K, a = 3.59e-4 m2/s) Side view Top view 20mm Assuming 1W, 1.5W, and 2W heat flux InGaAsP (Active region) 0.1mm InP 5 microns AuSn solder (280oC) AlN 2mm 5.5mm 20mm 5.8mm 5 microns AuSn solder (280oC) 0.5mm Kovar 5mm InSnPb solder (95oC) Keep 20oC 5 microns 5.5mm TE-cooler DOD-N PI Review, November 6-7, Santa Barbara, CA 8

  9. Use of Carbon Foam to Enhance Cooling Replacing Kovar with Carbon Foam completely or with a “cold finger” configuration DOD-N PI Review, November 6-7, Santa Barbara, CA 9

  10. Preliminary Results (Numerical) Detail of the “cold finger” configuration DOD-N PI Review, November 6-7, Santa Barbara, CA 10

  11. Numerical Simulation Steady State Result (Power = 5W, Q = 200 W/cm2, TEC on (2V)) DOD-N PI Review, November 6-7, Santa Barbara, CA 11

  12. Design of a Super Cooler Passive Hybrid Super-Cooler Structure AlN, Kovar and Carbon/carbon foam will be brazed together to minimize thermal resistance Foam will be saturated with liquid (water) and the wicking effect to ensure liquid re-circulation (heat pipe effect) Operating At room temperature (20 ۫C) Interior evacuated to low pressure so water will boil at less than 40 C Expect to dissipate up to 2W by nature convection (with no thermoelectric cooler) With external fins, expect to dissipate up to 5W DOD-N PI Review, November 6-7, Santa Barbara, CA DOD-N PI Review, November 6-7, Santa Barbara, CA 12

  13. Design of a Super Cooler Copper Cover Dimension D = 1.18 in. L = 2.13 in. Thickness of Carbon Foam Shell d = 0.16 in. DOD-N PI Review, November 6-7, Santa Barbara, CA DOD-N PI Review, November 6-7, Santa Barbara, CA 13

  14. Experimental Setup Reflecting Mirror Heater Super Cooler Electrical Connection to Power Supply DOD-N PI Review, November 6-7, Santa Barbara, CA 14

  15. Experimental Setup Infrared Camera DOD-N PI Review, November 6-7, Santa Barbara, CA 15

  16. Test Conditions for a 30-sec Run Heating Data Heating area: 0.5 mm x 5 mm Resistance: 25 Ohm Input Voltage 10 Volt Input Power 4 Watts Input Flux 160 W/cm2 Heating Duration 30 sec. DOD-N PI Review, November 6-7, Santa Barbara, CA 16

  17. Passive Cooler Experiment: Temperature Rise Initial Temperature Rise, 0 < t < 5 sec, Dt = 0.25 sec. Huge power output from heater leads to a fast rise, but begins to level off. Gene Tu and Walter Yuen DOD-N PI Review, November 6-7, Santa Barbara, CA

  18. Passive Cooler Experiment: 4 Watt Heater Temperature Transient, 5 < t < 30 sec, Dt = 2.5 sec. Can observe that temperature levels off below 40 ˚C. Gene Tu and Walter Yuen DOD-N PI Review, November 6-7, Santa Barbara, CA

  19. Passive Cooler Experiment: Cool Down End of Heating Period, 30 < t < 32 sec, Dt = 0.1 sec. After heater is turned off, temperature drops quickly, demonstrating that the passive cooler may be especially useful for pulsed operation. Gene Tu and Walter Yuen DOD-N PI Review, November 6-7, Santa Barbara, CA

  20. 30-sec .vs. 60-sec Run DOD-N PI Review, November 6-7, Santa Barbara, CA 20

  21. Summary and Future Works Heat Transfer Capability of Super Cooler More data on operations under Steady State Periodic Heating Pulse Effect of heater orientation and forced convection Fundamental Work on Two-Phase Heat Transfer in Carbon Foam Boiling characteristic, wetting characteristics on carbon foam What is the critical heat flux, i.e. heat transfer limit More basic understanding on the fundamental heat transfer and fluid mechanics Fabrication issues Add fin to external surface to enhance natural convection Brazing between carbon foam with other electronic packages (e.g. materials other than AlN, Copper and Kovar) DOD-N PI Review, November 6-7, Santa Barbara, CA 21

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