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Although it requires a considerably greater degree of manufacturing process control and accuracy as well as uses the same processes as for single layer boards, the manufacture of multi-layer printed circuit boards. The PCB fabrication must be efficient.
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High Thermal Conductive PCB Part No.: M0125060189A Layer count: 1 layer metal core PCBMaterial: Aluminum core, 1.5mm, 1 OZ, 2.0 W/M*KMinimum tack: 25 mil Minimum space(gap): 25 milMinimum hole: 3.0mmSurface finished: ENIEPIGPanel size: 28*258mm/1up
Electronics Boards Assembly | Electric Charging Boards Layer count: 4 layerMaterial: FR4, TG170, 1.6mm, 2 OZ for all layerMinimum tack: 10 milMinimum space(gap): 12 mil Minimum hole: 0.30mmSurface finished: LF HASL Panel size: 358*118mm/1up
High frequency PCB | Rogers4350 + FR4 PCB Part No.: E0415060179ALayer count: 4 layerMaterial: FR4, 1.6mm, high TG+RO4350B, 1 OZ for all layer Minimum tack: 8 milMinimum space(gap): 8 milMinimum hole: 0.30mmSurface finished: ENIGPanel size: 58*38mm/1up
Copper Core Printed Circuits Part No.: M0155360169C Layer count: Single Layer Copper Core PCB Material: Copper core, 1.6 mm, 3 OZ, 10.0 W/M*K Minimum tack: 20 mil Minimum space(gap): 20 mil Minimum hole: 3.2mm Surface finished: ENIG Panel size: 208*118mm/1up
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