1 / 15

Vertex Detector Options and R&D Requirements

Vertex Detector Options and R&D Requirements. RHIC DAC Meeting December 19, 2002 Yuji Goto (RIKEN/RBRC). Outline – R&D items. Barrel strip detector strip sensor strip sensor readout / interface with PHENIX Barrel pixel detector hybrid pixel / readout /interface with PHENIX

elewa
Download Presentation

Vertex Detector Options and R&D Requirements

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Vertex Detector Options and R&D Requirements RHIC DAC Meeting December 19, 2002 Yuji Goto (RIKEN/RBRC)

  2. Outline – R&D items • Barrel strip detector • strip sensor • strip sensor readout / interface with PHENIX • Barrel pixel detector • hybrid pixel / readout /interface with PHENIX • bump bonding / thinning • monolithic pixel • Endcap pixel detector • Support frame Yuji Goto (RIKEN/RBRC)

  3. u u x x Strip sensor • Technical options • Zheng Li’s sensor or other sensors • R&D • telescope with VA2 readout chip and its beam test ongoing • cooling study • Manpower • institutional contribution • BNL instrumentation • RIKEN / Kyoto U. Yuji Goto (RIKEN/RBRC)

  4. Strip sensor telescope with VA2 readout Z. Li, Inst. Div., BNL Yuji Goto (RIKEN/RBRC)

  5. Strip sensor readout / Interface with PHENIX • Technical options • readout chip • SVX4 (preamp + digitized pipeline) • MVD-TGV+AMU/ADC recut • R&D • mismatch of Zheng Li’s sensor (DC coupling) and SVX4 (AC coupling) • accumulation of leakage current – frequent reset of the SVX4 • cooling (lower than the room temperature) to decrease leakage current • data management method / ladder structure • local processing or driving signals on kapton cables • buffering capability • low power data transmission • Manpower • R&D proposal • ORNL / BNL physics • 1 FTE electronic engineer in FY03 • institutional contribution • ORNL • RIKEN / Kyoto U. Yuji Goto (RIKEN/RBRC)

  6. R&D issues readout chip decision interface with PHENIX ladder Technical options SVX4 or MVD-TGV+AMU/ADC recut other sensors Barrel strip detector Run-2 Run-3 Run-4 Run-5 Run-6 2001 2002 2003 2004 2005 2006 sensor prototype telescope prototype test sensor production or further R&D readout chip R&D and decision with MVD-TGV + AMU/ADC recut readout chip production or further R&D readout/interface prototype ladder prototype prototype test ladder production assembly / installation with SVX4 •  Strip sensor • BNL instrumentation / RIKEN / Kyoto U. • Strip readout / Interface with PHENIX • BNL physics / ORNL / RIKEN / Kyoto U. Yuji Goto (RIKEN/RBRC)

  7. Hybrid pixel / Readout / Interface with PHENIX • Technical options • ALICE1 hybrid or other hybrids • BTeV FPIX2 readout chip • ALICE pilot chip or our own pilot chip • R&D • parallelization of readout • development of FEM or FEM+CCB (Central Control Board) • Manpower • R&D proposal • Stony Brook • 0.5 FTE post-doc and 0.25 FTE electronic engineer in FY03-04 • institutional contribution • Stony Brook • 2 FTE students or post-docs and 0.25 FTE electronic engineer in FY03-04 • RIKEN • 2 FTE post-docs at CERN (and 1-2 more will be added) • collaboration is starting with KEK instrumentation • collaboration with NA60 / ALICE Yuji Goto (RIKEN/RBRC)

  8. Hit map 1.0 cm Hybrid pixel • NA60 pixel detector The first 4-chip pixel plane Yuji Goto (RIKEN/RBRC)

  9. Bump bonding / Thinning • Technical options • Fermilab-led efforts • PHENIX involvement by ISU • McNC North Carolina/Unitive • AIT Hong-Kong • CERN-led efforts • PHENIX involvement by RIKEN • R&D • alternative options for bump bonding / thining • evaluation of bump-bonding samples made by McNC and AIT • Manpower • R&D proposal • ISU • 0.5 FTE post-doc and 0.5 FTE electronic engineer in FY03-05 • institutional contribution • RIKEN • collaboration with NA60 / ALICE Yuji Goto (RIKEN/RBRC)

  10. Monolithic pixel • Technical options • epitaxial monolithic detectors by LEPSI • float-zone monolithic detectors by Bonn/Munich • R&D • increased speed of readout • R&D started • readout time halved to 110 nsec/pixel or 5 sec/chip • next steps, event buffering • thick, high-quality silicon • partner with Munich/Bonn groups to build readout on top of detector-grade silicon • Manpower • R&D proposal • ISU Yuji Goto (RIKEN/RBRC)

  11. Barrel pixel detector Run-2 Run-3 Run-4 Run-5 Run-6 2001 2002 2003 2004 2005 2006 hybrid R&D with NA60 hybrid R&D with ALICE • R&D issues • readout / interface with PHENIX • bump bonding / thinning • Technical options • monolithic pixel • other hybrids bump bonding / thinning R&D hybrid production monolithic pixel R&D monolithic prototype & production readout/interface R&D with monolithic pixel readout/interface prototype ladder prototype prototype test ladder production assembly / installation with ALICE1 •  Hybrid pixel / Readout / Interface with PHENIX • Stony Brook / RIKEN • Bump bonding / Thinning • ISU / RIKEN • Monolithic pixel • ISU Yuji Goto (RIKEN/RBRC)

  12. Endcap pixel detector Run-2 Run-3 Run-4 Run-5 Run-6 Run-7 2001 2002 2003 2004 2005 2006 barrel pixel R&D (shown previously) modification to match the endcap • Technical options • ALICE1 or LHCb hybrid • BTeV FPIX2 readout chip • monolithic pixel • R&D • increased capacitance load on the readout chip • sensor pad topology • routing of control lines • location of the pilot chip • Manpower • R&D proposal • LANL • electronic engineer (1 FTE in FY04, 0.5 FTE in FY05) endcap prototype prototype test endcap production assembly / installation Yuji Goto (RIKEN/RBRC)

  13. Support frame Run-2 Run-3 Run-4 Run-5 Run-6 Run-7 2001 2002 2003 2004 2005 2006 mockup study frame conceptual design • Technical options • conceptual design by the engineering team that designed the ATLAS support frame (HYTEC) • recommendation as to the best technical appoach and the areas that need further study and prototype • R&D • prototype end cap disk sector – test cooling and stiffness • prototype barrel ladder – test cooling and stiffness • prototype outer support structure • Manpower • R&D proposal • LANL • mechanic engineer (0.5 FTE in FY03, 1 FTE in FY04, 0.5 FTE in FY05) • mechanic designer (0.25 FTE in FY03, 0.5 FTE in FY04) • institutional contribution • LANL / HYTEC • RIKEN frame R&D and prototype assembly / installation Yuji Goto (RIKEN/RBRC)

  14. Support frame mockup by RIKEN conceptual design of the support frame by LANL/HYTEC Yuji Goto (RIKEN/RBRC)

  15. PHENIX institutional involvement barrel strip detector BNL (physics, instrumentation), RIKEN, Kyoto U., ORNL barrel pixel detector Stony Brook, RIKEN, ISU endcap pixel detector LANL support frame LANL, RIKEN Related R&D efforts hybrid pixel NA60, ALICE monolithic pixel STAR support frame HYTEC R&D budget request Yuji Goto (RIKEN/RBRC)

More Related