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Corial 700. A Large Area Reactive Ion Etcher. Corial 700. Equipment Control & Software. COSMA Software with : Edit menu for process recipe edition, Adjust menu for process optimizing, Maintenance menus for complete equipment control via internet with VPN (Virtual Private Network).
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Corial 700 A Large Area Reactive Ion Etcher
Equipment Control & Software COSMA Software with: • Edit menu for process recipe edition, • Adjust menu for process optimizing, • Maintenance menus for complete equipment control via internet with VPN (Virtual Private Network). • CORS Software for: • Data reprocessing (Measures and data comparison).
Server for GUI Operator COSMA Controller Lots Actions Monitoring COSMA Supervisor Remote GUI Monitoring Process Process Controller Embedded control PU Constructor Monitoring Actions Embedded control function Device Controllers PC User Closed-loop Physical devices A Tool Organized in Successive Levels
Diagram Modes Optimization Mode Stand-by Mode Production Mode Normal Shut down Mode Step by step Mode Errors Operator Production Constructor Mode Maintenance Constructor
WAN VPN ADSL Fix IP COSMA GUI Firewall Customer Ethernet Network Dedicated Ethernet network COSMA Supervisor Ethernet Process Control Unit (2) Process Control Unit (1) Ethernet Device Control (1) Device Control (2) A Communicant Tool
Dry Pump ADP 122 Pumping System Reactor TV PTM
RIE Reactor Bottom Electrode Pumping grid Automatic Match Box Pump RF Generator
Reactor Features RIE reactor designed to fit with each customer application: • Reactor design from symmetrical (low ion bombardment) to asymmetrical (strong ion bombardment), • Reactor design for thick (up to 100 mm) and thin substrates, • Cathode size up to 700 mm X 650 mm. Real time access to the following plasma modes: • High Pressure Reactive Ion Etching (Isotropic), • Low Pressure Reactive Ion Etching (Anisotropic).
Some Process Specifications Process Underlayer Etch Rate (nm/min) Selectivity Uniformity Polyimide Si3N4 SiO2 Si3N4 SiO2 SiO2 200 80 50 >50 3 1 ±5% ±5% ±3%
A CCD camera and laser diode, in the same measuring head, enables simultaneous visualization of the die surface and the laser beam impact on it. A laser spot, of diameter 20 µm, facilitates the record of interference signals. Precise Monitoring The latest submicron technology needs precise delayering: • Automatic endpoint detection, • CCD camera with magnification > 120 X, • Laser beam diameter ≤ 20 m.
Signal Laser beam Photodiode Time Interferences Reflected beam 1 Interface 1 Interface 2 Reflected beam 2 Refractive Index = n Underlayer Laser Endpoint Detection Interferences lead to a periodic signal having a l/2n period versus time
Recap of Corial 700 Features • Very large area RIE reactor to achieve uniform etching either of large area substrates or wafers in batch mode, • Operation in RIE mode Low and High working pressure, • Wide process range from isotropic to anisotropic, • Both fluorinated and chlorinated chemistries, • Clean etching of metals.