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Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project. SMACC Twelfth report [20 min ] 18/10/2013. Activities since last LSC (27/09/2013) Arc splices installation By Activities By sectors Globally SIT DFBA DN200 Dashboards Activities for the next 2 weeks Conclusions.
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Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project SMACC Twelfth report[20 min]18/10/2013
Activities since last LSC (27/09/2013) • Arc splices installation • By Activities • By sectors • Globally • SIT • DFBA • DN200 • Dashboards • Activities for the next 2 weeks • Conclusions
SMACC Main activities for the next 2 weeks 3 From last LSC (27.09.2013) • Sector 56 : • Work on non-conformities including repair of overheated cable • Reclosure (not in priority) and final leak test • Sector 67 (Priority sector) • Complete installation of insulation boxes and injection • Rewelding of M sleeves • Leak test of M lines • Reclosure of interconnections and final leak tests • DFBA consolidation • Sector 78 • Installation of shunts – start installation of electricalinsulation • Quadrupole diodes consolidation • DFBAs consolidation • Reconnection of Q5L8 • Sector 81 • Complete ElQC of existingsplices • Desoldering / Resoldering of splices • Installation of shunts • Other sectors: • S12: Start ElQC of existingsplices • S23: Open busbarlines and diodes containers • S34 & 45: Reconnection of replacingmagnets • Advanced opening for outliers and CSCM segments • Inspection of connection cryostats Overheated splice redone, ≈120 ICs reclosed, 3 subsectors validated, 4 under final leak test Completed (but NCs) Completed but NCs On-going, 9/14 vac subsectors validated >100 Ics reclosed, 5/14 sub-sector under final leak test Completed but NCs, 63 ICs insulated (yesterday) 1/3 done; see later On-going Completed (≈ 28%) Desoldering almost completed; resoldering is on-going > ½ sector completed > ¼ of S12 ElQC tested, compatible with 30% of splices to redo ½ of M lines open, all diodes containers open 4 in S34 reconnected, 2 in S45 almost reconnected On-going
SEQUENCE AND STATUS Install DN200 Completed 100 % Open M sleeves Open ICs OK to open > 5 sectors >7 sectors 8 sectors Undo / Redo splices ELQC(new splices) Cancelled ≈ 4 sectors Machine Cu ELQCafter Cu mach. ELQC(old splices) > 3.5 sectors > 4 sectors > 3.5 sectors Consolidate Q diodes Availability of components ≈ 2.5 sectors Weld M Leak test M Close IC Final LT Insulate splices ELQCafter shunt Install shunts ≈ 1/5 sector ≈ 3.5 sectors ≈ 2.3 sectors ≈ 3.5 sectors ≈ 1 sector ≈ 2 sectors > 1.5 sector
SMACC Progress report by activity • Opened interconnections in 8 sectors, > 7 sectors-eq are opened
SMACC Progress report by activity • M line cutting : ≈ 5.5 sectorsequivalent • Replacing team trainedat the surface, will go in the tunnel nextweek • Takes in charge the insulationremovalactivities
SMACC Progress report by activity • Desoldering : Completed in S56 & 67 & 78 and @ 65 % in S81 • Resolderingcompleted in S56 & 67 & 78 and @ 50% in S81 80 From last LSC (27.09.2013) 100 From last LSC (27.09.2013) Rates are compatible with the 30 % of splices to redo and the baseline rate Courtesy H Prin
SMACC Progress report by activity • Shunts are installedin ≈ 3.5 sectors-eq (1/2) Shunt weekly installation rate (4 weeks sliding average) • Rate in 81 is sticking to the baseline • «Last 10% effect» in 3 sectors • Delay reduced: < 1/2 week (nominal rate)
SMACC Progress report by activity • Shunts are installedin ≈ 3.5 sectors-eq (2/2)
SMACC Progress report by activity • Installation of insulation box: 56 & 67 are completed and 1/3 in 78, • 63 Ics are completed in 78 • Rate is still too low but improving (41 is the maximum achieved so far, average of the last 4 weeks: 33) • Progress curves will be integrated with the new baseline Courtesy H Prin / M Duret
SMACC Progress report by activity • Quadrupole diodes • > 6 sectors are opened / ≈ 2.5 sectors are consolidated • Components to cover 78 and 1/3 of 81 (3.3 sectors) • Not on the immediate critical path • Second order launched for critical components (expensive) • Delivery expected in a month time • A third solution (reasonable price) is under investigation as a fall back solution • Visit of the 1st company today (Delay issues and also NC components) Courtesy L Grand-Clement / F Savary
SMACC Progress report by activity • M Welding : 410 ICswelded, ≈ 2 sec-eq: • No welding this week to build a buffer of ICs ready to be welded (Announced @ last LSC) • Holes in 56 and 67 will be done next week • Work at a rate of 35-40 IC/week to start next week in 78 (About 70 ICs will be available on Monday), to sustain up to end 2013 • Will be integrated in the overall rebaselining
SMACC Progress report by activity • M sleevesleaktesting : (320 ICs)are leaktested (≈ 1.5 sec-eq) • All possible subsectors of S56 (11/14) are leak tested • 9/14 subsectors are leak tested in 67 • Present situation will be included in the general rebaselining Courtesy P Cruikshank / L Mourier
SMACC Progress report by activity • Reclosure of interconnections : On-going in 67 (priority) and 56 (> 1 sec eq), • 120 ICs are reclosed in 56 and 100 in 67 • Priority is on S67 • Global rate to increase and reachbaseline value with the reinforcement of part of the DN200 team
SMACC Progress report by activity • Final leak test: Starting • 3 subsectors validated • 9 more under test (4 in 56 and 5 in 67) • Almost 1 sec eq • Results in 2 weeks time
SMACC Progress report by sector QBQI.18R8 QQBI.27R8 • Main activities are on non-conformities • Overheated cable resoldered, now to be shunted and reinsulated • Uninstall shunts to remove the DFBAK shuffling module • Similarrepair (Sandwich) to beapplied in otherICs Courtesy M Duret, N Dalexandro, P Voisin, R Principe
SMACC Progress report by sector • All non-problematic ICs are shunted, insulated and rewelded • Main activities are the leak test of M lines, the reclosure and the final leak tests • This sector should be the first to be ready for pressure test • Planned to be completely reclosed for end of November
SMACC Progress report by sector • All non-problematic ICs are shunted • Main activities are the installation of the electrical insulation and the rewelding of M lines (to start next week)
SMACC Dashboards • Openingisahead of schedule • Shuntingisalmost back on schedule • Criticalactivityis the insulation(Progress curvesoon to beincluded) • Welding and M leak test are limitedby release rate, confident that nominal rate canbeachieved, margin has been eaten up • Reclosure: Not yet nominal rate, to beincreased • Final leak test on-going for almost 1 sec eq
SMACC Progress report SIT • SIT • All cryomagnets are reconnected, except the 2 dipoles in S45 and the Q5L8 (SAM) • Standard reconnection will be done by the train when it will arrive • Just started: Interventions on SAM He level gauges: Accessible for MME intervention (Not critical) • On hold: Intervention on the triplets braid • Disconnection of the DFBAK SHM that will start next Monday (See TE-CRG presentation) Courtesy N Bourcey, S Le Naour
SMACC Progress report DFBA • DFBA: See TE-CRG presentation • Impact of interventions to fix the M bellows is under integration in the new baseline • DFBAK shuffling module to be disconnected • DFBAO on-hold ? Courtesy TE-CRG, TE-MSC and EN-MME
SMACC Progress report DN200 • DN200 : Workcompleted • DN200 to install on removed cryomagnets and for the installation of the cryogenics BLM • Part of the team is staying and is trained to assist the opening/closure of interconnections and also the upgrade of the IC thermal shields Courtesy Jose Manu Gomes de Faria, A Musso and collaboration with DUBNA
SMACC Dashboards Baseline: 38.1 % (30.9 %) Completed: 33.7 % (27.0 %) Delay 12 (11) days Baseline: 54.6 % (49.6 %) Completed: 45.8 % (38.7 %) Delay 30 (28) days Delay stable Delay stable Baseline: 56.6 % (47.4 %) Completed: 37.4 % (32.0 %) Delay 39 (38) days Baseline: 100 % (100 %) Completed: 100 % (88.2 %) Completed Not representative To be rebaselined
SMACC Dashboards Progress: Baseline: 42.8% (36.3 %) Completed: 36.8% (30.1 %) Delay18 (18) days Stable ; Δbaseline ≈ Δcompleted
SMACC Summary on progress Main 13 kA Splices: Delay stabilised to 2 weeks Special Interventions: Delay stable, new activities (DFBAK SHM) DFBA: To be rebaselined DN200: Completed SMACC: About 3 weeks (stable) Delays are stable Nominal rate achieved these last 5 weeks !
SMACC Main activities for the next 2 weeks • Sector 56 : • Work on non-conformities including installation of all shunts, completion of M welding • Disconnection of DFBAK SHM • Reclosure (not in priority) and final leak test • Sector 67 (Priority sector) • Leak test of M lines • Reclosure of interconnections and final leak tests • Sector 78 • Installation of electricalinsulation • M linesrewelding (35-40 ICs /wk) • Quadrupole diodes consolidation • DFBAs consolidation • Reconnection of Q5L8 • Sector 81 • Desoldering/ Resoldering of splices • Installation of shunts • Other sectors: • S12: ElQC of existingsplices • S23: Open busbarlines • S34: Opening of interconnections • S45: Reconnection of replacingmagnets and opening of diodes containers • Inspection of connection cryostats
Conclusions • DN 200 installation is completed • Repair the overheated cable in 56 completed as planned • Delays are stabilised • Margin has been eaten up for someactivities (M welding, M leak test) • Solution isunderimplementation for the components of the quadrupole diodes • Issues: • Consolidate the splices production rates and increase the rate of installation of the insulationsystemskeepingquality • Impact of repair of DFBA bellows (SIT & Vacsubsectors) So far, not so bad …