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Tracking detector for AFP Upgrade Project

Tracking detector for AFP Upgrade Project. Marek Taševský (with help of Petr Šícho and Václav Vrba ) Institute of Physics, Academy of Sciences, Prague FD Review Meeting, CERN - 07/04 2011. Open questions First cost estimates. AFP = ATLAS Forward Protons.

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Tracking detector for AFP Upgrade Project

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  1. Tracking detector forAFP Upgrade Project Marek Taševský (with help of Petr Šícho and Václav Vrba) Institute of Physics, Academy of Sciences, Prague FD Review Meeting, CERN - 07/04 2011 Open questions First cost estimates

  2. AFP = ATLAS Forward Protons Proton leaves the interaction untouched, travels through LHC optics and is detected at 220 m 4 stations (-224m, -216m, 216m, 224m): 6 layers per station -> 24 FE-I4 chips & sensors With spare: ~50 FE-I4 chips

  3. Deflected protons Diffractive beam-1 protons deflected at 220m: Diffractive protons deflect horizontally in a region ~2x2 cm2 outwards the ring BEAM 1 1) Only horizontal detectors needed 2) Region of interest is ~2x2 cm2. This can be fully covered by exactly one FE-I4 chip (16.8mm x 20.2mm) 10-15 σbeam LHC appertures

  4. Layout of tracker including beam pipe

  5. Tracker design FE-I3 design: 2 sensors per layer

  6. Position detectors The same requirements for 220 and 420 m regions: Close to the beam => edgeless detectors High lumi operation => radiation hard Silicon detectors Mass resolution of 2-3% => 10-15 μm precision Suppress pile-up => add fast timing det. ATLAS, 1.5 mm (220) and 5 mm (420) from beam Reconstruct the central mass from the two tagged protons (from their trajectories and incorporating experim. uncertainties): Beam en.smearing σE= 0.77 GeV Beam spot smearing σx,y = 10 μm Detector x-position resol. σx = 10μm Detector angular resolution = 1, 2 μrad

  7. Options for Si sensors The IBL Upgrade project has similar requirements on sensors as AFP: • Radiation hardness (sustain the radiation dose of 5x1015n/cm2) • Maximum bias voltage 1000 V • Maximum inactive edge 450 μm Planar Si n-on-n: - used in current ATLAS pixel detector which functions very well - proven technology, double-side processing, slim with inactive edge ~250 μm [ON Smiconductors (Czech rep.) delivered ~50% of all pixel sensors Prague Institute of Physics (PIP) tested ~30% of all pixel sensors] Planar Si n-on-p: - single-side processing, slim with inactive edge ~450 μm - used by most of LHC upgrade projects (Si strips) PIP participates in those projects -> natural to make use of this expertise and money for AFP project 3D Silicon: - excellent in the small inactive edge and radiation tolerance - not proven in a real experiment AFP is open to all viable solutions and closely watching the IBL decision to be made in June.

  8. Insertable B-layer M. Havranek, Pixel det. , modules, 2FE-4 chips per module

  9. IBL and AFP synergy - Using the same detection technique as the IBL project would substantially reduce the manpower and funds needed. - AFP aims to install first movable beam pipes with Si pixel detectors during the 2013-2014 shutdown. Possible areas of know-how and technology shares: 1) Sensors 2) Readout chip 3) Bump bonding 4) Module assembly and testing 5) Power supplies 6) External services 7) Detector Control System 8) Off-sensor readout electronics 9) Cooling plant 10) Integration of the whole system AFP was presented on the last IBL General meeting at CERN, 16.02.2011 Very positive feedback! IBL and AFP can profit from the need to solve similar problems. Let’s communicate more closely.

  10. Module of the current ATLAS pixel detector

  11. Sensor of the current ATLAS pixel detector M. Havranek,Pixel det. cm2

  12. Sensor design New design in progress (PIP group): n-implantation to p-type bulk silicon n-in-p sensor – one-side lithography (being tested by all LHC experiments and RD50) Standard inactive edge ~ 450μm. This may be reduced by modifying guard rings area and using finer cutting methods 4 stations: 6 layers per station -> 24 FE-I4 chips & sensors (~50 with spare) Total number of channels: 24x80x336 = 645120

  13. 3D-Silicon • Development motivated by low edge design • Advantages: • Short collection distance (faster collection) • Low depletion voltage • Active edge (inactive edge ~ 5 μm) • - High radiation tolerance Tracker design for AFP420 with 3D-Si

  14. Read-out chips FE-I3: - ATLAS pixel det. - Process: 250 nm IBM CMOS - Threshold tuning - Time over threshold 8 bit - Leakage current compensation FE-I4: - ATLAS pixel det. – IBL - Process: IBM 130 nm - Largest R/O chip in HE - Reduced dead space: FE-I3: 26% → FE-I4:11% Radiation dose close to the beam at L=1034cm-2s-1 is 1015p/cm2 per year (30 MRAD) The size of FE-I4 chip is similar to the region of interest for the AFP physics. This significantly simplifies the AFP tracker design!

  15. Radiation at outer tunnel wall Annual levels for nominal LHC T. Wijnands, TS Dep. Dec.2008. Radiation levels in perspective

  16. Box diagram of all services

  17. DCS pointofview: half stave 2 sensors 2 sensors 2 sensors 2 sensors 2 sensors 2 sensors FE-I4 FE-I4 FE-I4 FE-I4 FE-I4 FE-I4 FE-I4 FE-I4 FE-I4 FE-I4 FE-I4 FE-I4 half stave End Of Stave Card NTC NTC NTC • 1 half stave • readout by 1 opto board • 6 detector modules • 3 bi-modules • 1 DCS bi-module: • 1 HV for depletion of 2 (4) sensors • 1 LV for 4 front ends • 1 NTC for temperature monitoring DCS

  18. IBL DCS Overview S. Kersten, IBL • Routing and grouping of services at patch panels determine operation units • EoS/PP1 transparent for DCS • Cooling not under control of IBL DCS AFP following the same layout ?

  19. Electrical Servicesbetween PP1 and USA S. Kersten, IBL for IBL

  20. DCS Services AFP tracking system = 4 detector stations 2 detector stations = 12 Pixel-Single-Chip-Assemblies (12sensors+12FE-I4 chips) ~ ½ IBL stave LV cables = 3 pairs leading to PP2 (voltage regulator) , length =10-12 m 3 pairs leading from PP2 to USA15 (Wiener power supply), it should be robust to have the same voltage drop over 300 m cable as pixels have over 70 m cable Opto-board power supply & control (4 pairs) lead to optical link power supply (SCOLink Crate), length of cable = 10-12 m HV cables = 3 cable pairs leading to USA15 ISEG module, length of cable = 300 m! (pixel detector uses 50m) Optical link (3 fibres?), length = 300 m – should not be a problem CAN bus cables (to control PP2 and SCOLink), lentgh = 300 m should not be a problem NTC + ENV cables (temperature and humidity monitoring), 8 cable pairs (?) Interlock cables (USA15 – PP2 & SCOLink) Ideas of P. Sicho, Pixel det.

  21. DCS Services in summary • LHC tunnel: • 24 Pixel-Single-Chip-Assembiles (24 sensors and 24 FE-I4 chips) • 2 optoboards (for el-opt interface), price = • 2 simplified SCOLink crate, price = 400-500 Eur • 2 simplified PP2 voltage regulator crate, price = 1000 Eur • Standard cabling and optical cables • USA15: • 1 HV modul ISEG in pixel crate/rack, price = 5000 Eur • 1 LV Wiener crate in pixel rack, price = 5000 Eur • 1 interlock electronics • 1 electronics for temperature and humidity monitoring • As in IBL, MCCs services are going to be distributed on the chip Ideas of P. Sicho, Pixel det.

  22. Optical links C. DaVia, FP420

  23. DAQ P. Morettini, IBL New VME based ROD/BOC - Commands to the ROD via Ethernet only

  24. Diffractive Trigger - 224 m - 216 m Right Primitives Left Primitives ATLAS detector xA xB jet T L Front end T R PA SH jet xA xB +730 ns xA - xB =0 Forward Trigger Logic 8 bits xD - xC =0 T T 1,0 sec +850 ns (air cable) Pipeline buffer (6.4 sec) L1 Central Trigger Processor (CTP) ATLAS Standard 2 Jets with Pt > 40 Gev/c 2,0 sec Data concentrator Max 75 KHz ROD 2,5sec USA15 ROL Alcove Refined Jet Pt cut Vertice within millimeter  time < 5 to 10 psec ROS HLT P. LeDu, AFP

  25. Timing and Data flow (Rev nov08) BXing 0 ns P. LeDu, AFP 733 ns Proton @ RP Flight path ASIC and FPGA Average Rate = 4,16 Gbit/sec (11ns through cable to Alcove) • Bit 1 : One Track left • Bit 2 :More than one track left • Bit 3 :One track Right • Bit 4 :More than One track right • Bit 5 :One track left AND one track left within a time window. • Bit 6-7-8 : for eventual other information 1024 ns Pretrigger Data available @ 220 m(Alcove) Processing ALCOVE CTA crate Matching 2 strips Trigger primitives 8 bit per Xing Detector response 2 ns RO response ??? ns 20 ms cable 80 ns Primitives Processing 50 ns 1921 ns 8 bit/BX x 40 MHz = 0,32 Gb/s 80 bit @ 10 GB/s - 880 transfert time Triigger Data @ ATLAS CTP Cable Max 2500 ns LVL1 ACCEPT (75 KHz) 588 ns Processing 5120ns Cable RPs data @ ROD Data Production to ROD 4 events x(20 detectors x10 bit word stored in the pipeline) 4 events x 1 MCP-PMT detector x (6 bit address + 8 bit fine timing) Total per LV1 Accet = 796 bit Total x 75 KHz =60 Mb/s

  26. X X X X X X X X X X X X Implementation and read-out block diagram IP // P B PA MCPs RP Right bits LHC CLK Trigger Left bits Detector ASIC ATLAS LVL1 CTP P. LeDu, AFP 1Cable L1 ACCEPT MCC DATA RO FPGA Or cables FPGA Or cables RODs Local Logic 8 fiberss < 1 Gb/s Trigger primitives Local concentrator control logic & Monitoring 20 m Cables CTA crate 75 KHz Reference clock 60 Mb/s 160 MHz CLK (fiber) Shielded Alcove USA 15 LHC CLK Data Concentrator H L T & D A Q 3D Pixels detector ROS ROD ROD Local Trigger Processing Timing detector ROS Data Concentrator ROD ALCOVE USA15 AFP220 ACR

  27. Tracking detector – Tasks and PIP contribution Areas where the PIP engineer group is ready to contribute (x = manpower, f = financial) Break-down of manpower possibilities of the PIP group In summary: Year # people FTE 2011 8 1.3 2012 7 1.2 2013 5 1.0 Covered by CVUT (V. Vacek)

  28. First cost estimates IBL sensors (kCHF) AFP220 sensors (kCHF) Tracking detectors (from IBL TDR)

  29. Summary • Decision about the sensor option has to be made soon • AFP is open to all viable solutions and is closely watching the IBL decision process • Prague group has expertise in pixel detectors, prefers and has money for n-on-p option • First rough estimates of the cost of the whole tracking detector presented • Further collaborators are welcomed!

  30. B A C K U P S L I D E S

  31. L1 AFP Trigger time to CTP

  32. Acceptances Acceptances depend heavily on the distance from the beam and dead space! (if protons hit the dead space in 220 station, they are lost for 420 measurement) Acceptance for 420+420, 420+220 and 220+220. Numbers mean total distances. 420 at 6 mm everywhere, 220 varying from 2mm to 7mm Peter Dead space = 1.1mm 220 at 2mm obstructs the tracking at 420 ! Dead space of 1.1 mm is too cautious. Peter will make this plot for dead space of 0.5mm. In the following analyses, dead space=0mm 15 σbeam ~ 1.5 mm (thin window (400μm) + safety offset (300μm) + edge (5μm) + alignment) ~ 0.7 mm Conservative guess of distance between beam center and first sensor : 2.2 mm

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