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A Partnership Foundry Business Model. Dr. Jackson Hu Chief Executive Officer Oct. 16, 2003 Beijing, China. Foundry Business Overview. Three good quarters. Is this a persist recovery? Strong cell phone and DVD demand Oversupply for matured process technologies
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A Partnership Foundry Business Model Dr. Jackson Hu Chief Executive Officer Oct. 16, 2003 Beijing, China
Foundry Business Overview • Three good quarters. Is this a persist recovery? • Strong cell phone and DVD demand • Oversupply for matured process technologies • 20% CAGR for foundry business in next five years • Wireless and digital entertainment products will drive the next round of silicon demand • The challenge for foundry industry is how to make profit!
What It Takes to Do Foundry Business Today? Knowledge : --. Understand customers' applications --. Understand customers' system requirements Process Technology : --. Meet customers’ existing product performance requirements --. Meet customers’ product roadmap Design Support : --. IP/Library requirements --. Process related IP ready ahead of time Operation : --. New product / project success --. On time delivery --. Yield improvement
Trade-offs Facing SoC Designs • Architecture partition between hardware and software • General purpose RISC/DSP vs. hardwired • System partition between digital & analog, on-chip or off-chip • Power consumption considerations • Cost implications • Overall system performance
GPS Receiver RFBits Baseband Processor LNA Cellular Receiver Audio Codec Audio out RFAnalog Baseband RL m Controller Flash Memory RF Codec DSP RL SRAM/ DRAM Memory PA RFAnalog Baseband Audio Codec Audio in To Codec,RF Keyboard, Display & Pwr Mgmt Cellular Transmitter Bluetooth Radio RFBits Baseband Processor RFBits A Generic 3G Cell-Phone Design
Impact of New EDA tool CapabilitiesCadence X Architecture • Courtesy Cadence
IP is Most Critical for Fabless Customers • Availability • Standard cell library, IO, memory blocks are basic requirements. • Analog IP and high-complexity functional IPs are needed for SoC designs. • Portability & Re-usability • Cost • Methodology (Design Flows and Tools) • IPR
IP Needed for 3G Cell Phone 3D Graphics FM, MP3, DAB GPS, EOTD MPEG4, JPEG GSM-GPRS-EDGE- WCDMA/CDMA2000 /STD-SCDMA (RISC, DSP, Protocol Stack, System BIST) Speech to Text, Voice Recognition WiFi, Bluetooth
UMC Foundry Revenue Trend US$ billion 3.32 UMCJ (exchange rate 116) UMC (exchange rate 35) 2.16 1.99 1.77
Balanced Application Mix (Year 2002) Other2% Memory 6% Communication32% Computer28% Consumer32%
UMC’s Current Fabs Diversified manufacturing in Japan, Singapore & Taiwan Fab 6A Fab 8E UMCJ Fab 8AB Fab 8F UMCi Fab 8C & D Fab 12A
Partnership Foundry • Customer is our Way, our Truth, and our Life. • Focused cooperation and quality support • Win with UMC.
Partner Collaborative Win-Win Effort Process Engineer Designer, Application Product Planner IPs Customer Engineer and Sales -Market & Applications- -Roadmap, Plan Ahead- -Best Fit Technology- -Best Fit IPs- Outsource Director The Partnership Model
Partner Success Example Revenue $ million Source: Company information
1T-SRAM13, eFuse13, eDRAM1 ADC/DACAFE eDRAM1, ADC/DAC3 1T-SRAM13, eDRAM4, eFlash1, ADC/DAC3 IP by Application Memory MM CPU/DSP Peripheral Application Specific SSTL3, LVDS4 S-ATA4, USB13 PCI-Exp4 Serdes4 1G PHY/MAC2 ARM13, MIPS13, MPU/DSP13, Teak Communication Bluetooth4QPSK Bluetooth4 MPEG2/44 1394,DMA IrDA Com-puting ARM13, MIPS13, MPU/DSP13 PCI-X/Exp4, USB13, 1G PHY/MAC2 Smartcard MPEG2/44 AC3/4,QPSK QAM, TMDS IrDA HSTL4, USB13DVI4, LVDS4 RSDS4 UART4, SPI44 ARM13, MIPS13, MPU/DSP13,Teaklite3 Consumer 1: 0.13um 2: 0.15um 3: 0.18um 4: planned All trademarks owned by each individual vendor
UMC Logic Technology Roadmap 2006 2007 2000 2001 2002 2003 2004 2005 0.13um Cu 0.15um Al,Cu 90nm Cu 65nm Cu LOGIC 0.13um 90nm 65nm ITRS Box center marks the start of pilot production.