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Radio-Frequency Effects in ICs: Inductance, EM Coupling, and Digital Signals

This thesis explores the impact of radio-frequency effects in integrated circuits, focusing on inductance, on-chip interconnects, and electromagnetic coupling. Topics include characterization of on-chip components, high-speed signal transmission, and analog RF circuits. The study also delves into inductance theory, circuit modeling, and empirical equations related to electromagnetic coupling. Acknowledgment is made to the supervisor and committee members involved in the research.

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Radio-Frequency Effects in ICs: Inductance, EM Coupling, and Digital Signals

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  1. Radio-Frequency Effects inIntegrated Circuits Yun Bai Directed by Professor Neil Goldsman

  2. Abstract • Tendency of IC evolvement: faster speed and higher chip density. • Inductance of on-chip interconnects draws more attention in terms of signal transmission and circuit design. • Skin effects and semiconductor substrate losses are considered. • Electromagnetic coupling happens between on-chip components and affects circuit performance.

  3. Thesis Outline • Introduction to Inductance • Characterization of On-Chip Interconnects • Characterization of On-Chip Inductors • High-Speed On-Chip Digital Signal Transmission • Electromagnetic Coupling Effects

  4. Transmission Line Theory freq > 1GHz Chip density > tens of millions of transistors RLC delay due to interconnects become significant Metal – SiO2 – Si – Ground Plane Distributed Circuit Model

  5. On-Chip Inductors • Analog RF Circuits: • Low Noise Amplifiers • Mixers • Voltage-Controlled Oscillators Experimental EM Simulator Numerical Modeling Empirical Equations

  6. Electromagnetic Coupling • Bus Lines • Interconnects EM Simulator Numerical Modeling Empirical Equations

  7. What is Inductance? • Energy Definition: Magnetic Energy Storage • Flux Definition: Magnetic Flux Leakage • Circuit Definition: Induced Voltage by AC Current

  8. Inductance Classification

  9. Internal Self-Inductance Internal Impedance: Maxwell’s Equation: Skin Effect:

  10. External Self-Inductance Average Flux: Loop Inductance

  11. Mutual Inductance Magnetic Vector Potential:

  12. What is L for an Interconnect Internal + External

  13. Interconnect Internal Impedance Current Distribution: 1D approximation:

  14. Complex Image Theory

  15. Interconnect External Impedance Quasi-TEM Slow Mode

  16. Coupled Interconnects

  17. Mutual Impedance

  18. On-Chip Inductors

  19. Inductor Inductance N L S Na

  20. Inductor Resistance N L S Na

  21. Multi-Layer Spiral • Higher Inductance • Less Chip Area • Higher Q Factor

  22. On-Chip Digital Transmission rising/falling < 10 ps Vs = 1.26 V Each Box: 1 mm

  23. Signal Attenuation, Delay, Dispersion 1 GHz : 220 ps 9 GHz : 150 ps Critical Length: 8 mm

  24. Electromagnetic Coupling

  25. Scattering Parameters S11: Insertion Loss at Port 1 when Port 2 is matched S21: Forward Gain from Port 1 to Port 2 when Port 2 is matched

  26. N-Wells

  27. Transformer

  28. Spiral and Transistor

  29. Digital Switching Noise

  30. Acknowledgement • Professor Neil Goldsman • Our Group: Zeynep, Xi, Akin, Bo, … • Committee: Professor Peckerar and Orloff

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