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Radio-Frequency Effects in Integrated Circuits

Radio-Frequency Effects in Integrated Circuits . Yun Bai Directed by Professor Neil Goldsman. Abstract. Tendency of IC evolvement: faster speed and higher chip density. Inductance of on-chip interconnects draws more attention in terms of signal transmission and circuit design.

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Radio-Frequency Effects in Integrated Circuits

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  1. Radio-Frequency Effects inIntegrated Circuits Yun Bai Directed by Professor Neil Goldsman

  2. Abstract • Tendency of IC evolvement: faster speed and higher chip density. • Inductance of on-chip interconnects draws more attention in terms of signal transmission and circuit design. • Skin effects and semiconductor substrate losses are considered. • Electromagnetic coupling happens between on-chip components and affects circuit performance.

  3. Thesis Outline • Introduction to Inductance • Characterization of On-Chip Interconnects • Characterization of On-Chip Inductors • High-Speed On-Chip Digital Signal Transmission • Electromagnetic Coupling Effects

  4. Transmission Line Theory freq > 1GHz Chip density > tens of millions of transistors RLC delay due to interconnects become significant Metal – SiO2 – Si – Ground Plane Distributed Circuit Model

  5. On-Chip Inductors • Analog RF Circuits: • Low Noise Amplifiers • Mixers • Voltage-Controlled Oscillators Experimental EM Simulator Numerical Modeling Empirical Equations

  6. Electromagnetic Coupling • Bus Lines • Interconnects EM Simulator Numerical Modeling Empirical Equations

  7. What is Inductance? • Energy Definition: Magnetic Energy Storage • Flux Definition: Magnetic Flux Leakage • Circuit Definition: Induced Voltage by AC Current

  8. Inductance Classification

  9. Internal Self-Inductance Internal Impedance: Maxwell’s Equation: Skin Effect:

  10. External Self-Inductance Average Flux: Loop Inductance

  11. Mutual Inductance Magnetic Vector Potential:

  12. What is L for an Interconnect Internal + External

  13. Interconnect Internal Impedance Current Distribution: 1D approximation:

  14. Complex Image Theory

  15. Interconnect External Impedance Quasi-TEM Slow Mode

  16. Coupled Interconnects

  17. Mutual Impedance

  18. On-Chip Inductors

  19. Inductor Inductance N L S Na

  20. Inductor Resistance N L S Na

  21. Multi-Layer Spiral • Higher Inductance • Less Chip Area • Higher Q Factor

  22. On-Chip Digital Transmission rising/falling < 10 ps Vs = 1.26 V Each Box: 1 mm

  23. Signal Attenuation, Delay, Dispersion 1 GHz : 220 ps 9 GHz : 150 ps Critical Length: 8 mm

  24. Electromagnetic Coupling

  25. Scattering Parameters S11: Insertion Loss at Port 1 when Port 2 is matched S21: Forward Gain from Port 1 to Port 2 when Port 2 is matched

  26. N-Wells

  27. Transformer

  28. Spiral and Transistor

  29. Digital Switching Noise

  30. Acknowledgement • Professor Neil Goldsman • Our Group: Zeynep, Xi, Akin, Bo, … • Committee: Professor Peckerar and Orloff

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