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Power Management System Integration

Research strategy 2007 - 2010 ISGE & M2D Research Groups. Power Management System Integration. Marise BAFLEUR Manager of ISGE Research Group. Society Needs. Embedded Systems & Mobile Electronic Generalization of electronic solutions Increase of embedded computing power

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Power Management System Integration

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  1. Research strategy 2007 - 2010ISGE & M2D Research Groups Power Management System Integration Marise BAFLEUR Manager of ISGE Research Group

  2. Society Needs • Embedded Systems & Mobile Electronic • Generalization of electronic solutions • Increase of embedded computing power • Challenge :power generation and distribution • Miniaturization • Power efficiency • X-by-wire challenges • Automotive & avionic : ESD/EMI reliability and robustness • Challenges of emerging microsystem applications • AmbientIntelligence : Energyautonomy October 2006

  3. ISGE Systems for electrical power conversion New devices Modeling and Design Architectures and Technologies Characterization Reliability Driving and protections Passive devices Power system Integration October 2006

  4. Scientific Goals Increase efficiency and reliability of power management systems for embedded systems • Three research areas: • Power management system integration • New control, driving and protections architectures • Advanced power devices A typical challenge: Microprocessor Power Supply : 0,8V-150A Area reduction and performance improvement in terms of losses October 2006

  5.  L, C frequency New power devices Integration high density capacitors • New Materials : • Magnetic • High-K dielectric • Varistances • 3D Technologies : • Deep trenches • Double side • Use of Si volume • Original physical mechanisms 3D capacitors 110nF/mm2 Oxide -nitride Methodology & Approach Power Management System Integration Integrated DC-DC Microconverter October 2006

  6. Innovative Devices Source Gate Pushing the physical limits • MOS • RON - VDBR Trade-off • Frequency increase • New SC: GaN, SiC, diamond Oxide P N G1 Use of silicon volume K N+ N+ N+ Drain P P P+ P+ New functionalities P+ N- Bi-directional IGBT Dedicated ESD/EMI Protection P P P+ P+ N+ N+ G2 A October 2006

  7. New Driving Architectures New Integrated architectures One example: multi-phase converter Distribution of losses Low Ripple Reduced EMI Emissions DC/DC DC/DC DC/DC DC/DC Vin Vout IIN/N DC/DC Vout Interleaved micro-inductors October 2006

  8. Alternative ESD/EMI Protections Above IC ESD Protections Integration of new materials with varistance properties SIP/WLP Generic ESD/EMI Protections EMI Protection E Substrat Métal I IT2 L VT1 V • Co-design of ESD/EMI protections • Use of silicon volume • Integrated passive devices • Material Synthesis : coll. LCC • Above IC Integration October 2006

  9. Parameter Extraction and modeling ESD Characterization Platform EMMI TLP ESD gun VF-TLP October 2006

  10. Challenges : • f ≥ 10 MHz • New conversion functions • New storage materials • Energy scavenging (piezo, RF…) • ESD/EMI co-design L µ-source C DC-DC • Challenges : • f ≥ 5MHz • New DC-DC architectures • High-K Dielectric • Varistance properties materials (ESD) L ESD ESD C DC-DC • Challenges: • f ≥ 1MHz • Deep Trenches • Magnetic Materials • Generic ESD/EMI • ESD/EMI co-design L , C, ESD,EMI DC-DC Towards the Power Management SiP 2010 2006 October 2006

  11. LAAS International Position • 18 permanent researchers (ISGE & M2D groups) • Support of technology platform • Leadership position among international community: CPES-Virginia Tech, TYNDALL-Cork, Cambridge University, CNM-Barcelone,… • Collaborations: TYNDALL-Cork, Cambridge University, CNM-Barcelona, Tarragona University • Leadership: • 18 Patents (FLIMOS; protections: ESD, short-circuit, substrate current, ...; partial SOI process, …), • Diffusion of software & models (LAASTHERM), process transfer (thermomigration), • Program committees and organisation of main conferences (ISPSD, ISPS, EPE, EPF, BCTM, EOS/ESD, SAEEI, ESREF, EOS/ESD/EMI Workshop ) October 2006

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