Factory Integration “De Rode Hoed Subterran” Team

1. Factory Integration“De Rode Hoed Subterran” Team

2. Increasing global restrictions on environmental issues Example: Lead free initiatives Ability of the factory to meet new, rapidly changing, and complex business requirements Building 30+ mask layer SoC with long TPT’s in an environment of rapidly changing or uncertain needs Many and co-existing business models Faster new product delivery to customers Rapid and frequent factory plan changes CAGR vs. ASP decline Implications of rising wafer and packaging costs on factory design/operations Factory and equipment not meeting reliability, capability or productivity requirements Low equipment availability, run rate, utilization Need for faster learning and to meet tighter process windows Managing Factory Complexity Quickly and effectively integrating rapid changes in process technologies Complexity of integrating new processes and materials into the factory design Flexibility, Extendibility, Scalability Ability to convert to new process technologies while reusing equipment, facilities, and skills Ability to scaling to large 300mm fab sizes (50k wspm) Post Conventional CMOS Manufacturing Uncertainty Inability to predict factory requirements associated with different manufacturing requirements Emerging factory paradigm changes Next wafer size conversion (450mm) requirements and timing Factory design and operational attribute differences from 300mm paradigm 2003 Factory Integration Difficult Challenges >45nm through 2009 < 45nm after 2009

3. Some Attributes of Future 300mm Fabs (90nm  45nm)Rev -99 for Discussion Only • New Process Intercepts • 157nm and NG Litho • High K gate stack • Low k dielectrics • New Materials Fab Capital Costs Very High!! Wafer Data Standard For Packaging On-line Specs & Tool Maintenance Manuals Faster Cycle time Fabs for Hot Lots & High Mix Predicative, Efficient Spares Management 100% Direct Transport AMHS for Fast Cycle Time Data standards and Systems for Rapid Mask Set Creation Aggressive NPW Reduction Systems Scaled for Large Size (50k wspm) Wafer Level Tracking and Recipe/Parameter Changes Standard Facilities (Gas, Power, etc.) Connections Large Scale Process Control Systems Manufacturing Execution Systems Equipment Engineering Capabilities (EEC) Equipment Control Systems Rapid Process Matching SECS Control Line APC FDC SPC Recipes Factory Scheduler And Material Control Yield PCS E-Diag EPT Equipment Data Diagnostic Data Acquisition (DDA) for Rich Standard Equipment Data Offline tools to test schedule rules and rapidly put in Mfg Pervasive E-Diagnostics Partner, Customer Or Supplier Standard, Detailed Equipment Performance Tracking (EPT) Data

4. ?? Questions to the IRC ?? • Appears to be good intersection with the NEMI roadmap and the assembly/packaging manufacturing areas. Can you provide key contacts to help us sync with them? • Overall Equipment Efficiency metric for production equipment is being replaced by its key components. Any issues? • The technology roadmap requires effectively trained scientists, engineers, and technicians to implement it. Should we include these educational needs directly within the roadmap or should these needs be reflected outside of the roadmap? • EUV litho costs are projected to be $65M US for each tool with the same run rates as today. How can we afford this?