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Origin of Emission and Susceptibility in ICs. EMC Introduction . Personnal entrainments. Noise. interferences. System . Equipments. Printed circuit boards. Safety systems. Components. Hardware fault Software failure Function Loss. Two main concepts:. Susceptibility to EM waves.
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EMC Introduction Personnal entrainments Noise interferences System Equipments Printed circuit boards Safety systems Components Hardware fault Software failure Function Loss Two main concepts: Susceptibility to EM waves Emission of EM waves
Source of Electromagnetic Interferences Natural disturbances (cosmic rays, thunder) Radio communications, wireless, radars,… IC Electrical Overstress IC Inductive loads, motors
Origin of Parasitic Emission Basic mechanisms for core current: CMOS inverter exemple VDD Switching current IDD (0.1mA) ISS (0.1mA) IDD (0.1mA) Vin Time Voltage Output capa VOUT VSS Time ISS (0.1mA)
Origin of Parasitic Emission i(t) Time 50ps • The increasing speed and the high level of integration generate a stronger noise: Vdd Vdd i(t) Vss Vss Internal switching noise Simultaneous Switching Noise Switching gates • Main noise sources comes from AC current sources: • Clock-driven blocks, synchronized logic • Memory read/write/refresh • I/O switching
Origin of Parasitic Emission Volt Old process New process Time Stronger di/dt Increase parasitic noise Why technology scale down makes things worse ? • Current level keeps almost constant but: • Faster current switching Current di/dt Old process New process Time
Origin of Parasitic Emission Ampere Vdd i(t) time Vss Ampere 1 ns 1 A Current / gate Current / Ic 0.1 mA time 0.1 ns Example: evaluation of switching current in an IC • 0.1 mA / Gate in 100ps • 1 Billion gates (32 Bit Micro) => 100A • 10% switching activity => 10A • 10% spreading of current peak (non synchronous switching) => 1A in 1ns
Origin of Parasitic Emission Example: evaluation of SSN L=0.6nH/mm L=1nH/mm VDD Lead = 10 mm Evaluate SSN amplitude 1 A en 1 ns Puce Lead = 10 mm VSS
Susceptibility issues Power supply decrease & Noise margin reduction : => Increase of ICs sensibility to parasitic noise Supply (V) 5.0 3.3 2.5 I/O 1.8 1.2 0.8 Core 45nm 0.5µm 0.35µm 0.18µm 90nm 65nm Technology
Susceptibility Issues EMC of ICs issues 1-10GHz : Packages act as very good antennas Antenna optimal size:
Susceptibility Issues Components issues Multiple parasitic electromagnetic sources Power HF VHF UHF SHF xHF THF 1GW Radar Météo Radars Satellites 1MW TV UHF MWave 1KW TV VHF Stat. de base Badge Hobby 1W UMTS GSM Radar Hobby DECT 1mW Frequency 300 GHz 3 MHz 30 MHz 300 MHz 3 GHz 30 GHz
Susceptibility Issues Immunity suddenly decreases? Immunity increases with Freq Susceptibility trends vs frequency Barber, Herke, IEE Electromagnetic Hazard, 1994
Susceptibility Issues Desynchronization issues • Jitter is becoming increasingly important in design of logic circuit due to rising operating frequencies. • The increase of operating frequencies of digital circuits reduces their dynamic margin EMI on supply EMI induced jitter Bit error Dynamic failure EMI induced jitter
EMC environment EMC for Integrated Circuits requires various expertise High frequency measurement High frequency modelling 2D, 3D modelling Electrical modelling IC design IC floorplan
EMC measurement methods Why EMC standard measurement methods • Check EMC compliance of ICs, equipments and systems • Comparison of EMC performances between different products, different technologies, designs, PCB routings • Improve interaction between customers and providers (same protocols, same set-up)
Emission measurement methods Control - Acquisition Radiated or conducted coupling Acquisition system 50Ω adapted path Device under test Coupling device • Spectrum analyzer • EMI receiver • Oscilloscope • Coupling network • Antennas • Wave guide Emission requirements verified ? Emission – General measurement set-up
Emission measurement methods International standards for IC emission measurement methods
Emission measurement methods Septum Shielding aperture 1 Far end (to absorb ers W 50 termination) Near end (to receiver) aperture 2 Emission spectrum Example of emission measurement set-up – TEM cell measurement Chip under test Spectrum Analyzer Pre-amplifier GTEM cell
Immunity measurement methods Failure detection Injected level Extraction Disturbance generation Radiated or conducted coupling 50Ω adapted path Device under test Coupling device • Coupling network • Antennas • Wave guide • Harmonic signal • Transients • Burst Immunity requirements verified ? Immunity – General measurement set-up
Immunity measurement methods International standards for IC susceptibility measurement methods
Immunity measurement methods Susceptibility threshold Example of immunity measurement set-up Signal Synthesizer Decoupling network Chip under test Failure detection Pforw Prefl Directional coupler DPI Capacitor Amplifier • Oscilloscope • Acquisition card
Impedance extraction Equipment to extract impedance profile of board, package, chip Frequency domain Time domain Time Domain Reflectometry Vector Network Analyzer
EMC equipments Spectrum analyzer 40 GHz (40 K€) Amplifier 3 GHz 100W (60 K€) Vector Network Analyzer 10 GHz (100 K€) Signal Synthesizer 6 GHz (20 K€) GTEM cell 18 GHz (15 K€) Main equipments for EMC – typical prices • Expensive …. • Complete EMC laboratory : 500 K€