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HIGH DENSITY DESIGN COMPONENT SOLUTIONS

HIGH DENSITY DESIGN COMPONENT SOLUTIONS. Technology Challenges. Market Drivers: Make it smaller Make it operate faster Make it more efficient Make it cheaper . Technology Challenge. Smaller Circuits Design: Higher levels of circuit integration on silicon

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HIGH DENSITY DESIGN COMPONENT SOLUTIONS

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  1. HIGH DENSITY DESIGN COMPONENT SOLUTIONS

  2. Technology Challenges • Market Drivers: • Make it smaller • Make it operate faster • Make it more efficient • Make it cheaper

  3. Technology Challenge Smaller Circuits Design: Higher levels of circuit integration on silicon Use of smaller foot print components + Components can be placed closer together - Closer the components get to each other, the more unwanted signal noise coupling occurs • SMT 0603 – 0402 • CERAMIC CHIP CAPACITORS • CHIP RESISTORS • FERRITE CHIP BEADS • INDUCTORS

  4. Technology Challenge Faster Speed of Operation: More done in shorter amount of time Higher complexity of functions & display + Smaller SMT Components Can Function at Higher Speeds. - Distances between components and traces become significant factors in limiting performance and creates need for control of signal integrity. MHz 1200 800 600 400 • SMT 0603 – 0402 • CERAMIC CHIP CAPACITORS • CHIP RESISTORS • FERRITE CHIP BEADS • INDUCTORS

  5. Technology Challenge Less Power Consumed: More features using less power Thinner barrier silicon IC chips = lower voltage operation = less energy needed. + SMT Passive Components can function at lower voltages - Lower voltage IC have reduced tolerance to spikes – transients. Higher level of transient and noise control is required = more passive components needed (capacitors and TVS devices) - Lower ESR (lower loss) components needed • CERAMIC CHIP CAPACITORS • MLV – VARISTORS • LOW ESR ALUMINUM & TANTALUM CAPACITORS

  6. Technology Challenge Reduced Cost of Products: • Reduce size of PCB = less cost • Use SMT = faster production and reduced cost to build • Reduce component count by component integration • Use smaller size components (less raw material = less $$$) + Many SMT Passive Components cost less than leaded equivalents + Integrated (multiple element passives) reduce board space and place costs • CERAMIC CHIP CAPACITORS & ARRAYS • CHIP RESISTORS & ARRAYS • FERRITE CHIP BEADS / INDUCTORS • PASSIVE ARRAYS (IPC)

  7. Component Solution: Component Size Reduction NRC SERIES CHIP RESISTORS SMT Component Size 0201 • 0201 • NMC SERIES CERAMIC CHIP CAPACITORS NIN/NIS SERIES CHIP INDUCTORS 0805 0603 0402 0201 12mm 3mm NACxx SERIES SMT ALUMINUM ELECTROLYTIC CAPACITORS

  8. Integrated Component Solution: Resistor Arrays High Density Design Solutions: Component Size Reduction and Integration Get More Components In Less Space 2 OR 4 OR 8 ELEMENTS CHIP RESISTORS 10 PIN 8 ELEMENTS 4 PIN 2 ELEMENTS NRSN SERIES RESISTOR ARAYS REPLACE WITH

  9. Thick Film Resistor Arrays High Density Design Solutions: Component Size Reduction and Integration Quad flat pack or PLCC package IC 0.5mm (0.20”) ”) ~ 1.27mm (0.39”) pitch Four ‘0603’ resistors (1.6mm X 0.6mm each) Typically 0.2~0.5mm space between parts (3.0mm X1.6mm total) Component size, spacing, land patterns and connection layout takes up valuable board space! Placing four components = $$$$ 103 103 103 103 NRSNA4I2 Quad flat pack or PLCC package IC NRSNA4I4 0.5mm (0.20”) ~ 1.27mm (0.39”) pitch SUPERIOR PERFORMANCE IN HIGH SPEED CIRCUITS! 103 0.5mm (0.20”) pitch (Same or less pitch as IC!) ‘0804’ resistor arrays (2.0mm X 1.0mm total) NIC P/N: NRSNA4I4 Far less board space used and short connection layout frees up valuable board space! Placing one component = ¼ the placement cost = $$$ saved!

  10. Integrated Component Solution: Capacitor Arrays High Density Design Solutions: Component Size Reduction and Integration Get More Components In Less Space NCA SERIES CAPACITOR ARRAY 1 PART: 4 ELEMENTS 1206 SIZE 4 ELEMENTS CERAMIC CAPACITORS REPLACE WITH

  11. Integrated Component Solution: Capacitor Arrays High Density Design Solutions: Component Size Reduction and Integration 0603 Ceramic chip capacitor = ~$6/1000 = 0.6¢ each… 4 parts = 2.4¢ total. Placement cost = 0.5¢ ~ 5¢ each (industry estimates) lets say it's 2¢ per part = 8¢ for 4 parts. Total cost of 4 ceramic chip capacitor elements =10.4¢ Total board area = 1.6mm X 4.7mm = 7.52mm² C1 C2 C3 C4 1.6mm 4.7mm C1 C2 C3 C4 1.6mm 3.2mm • 4 Element capacitor array = ~$40/1000 = 4.0¢ each… 1 part = 4.0¢ total. Placement cost = 0.5¢ ~ 5¢ each (industry estimates) lets say it's 2¢ per part = 2¢ for 1 part. • Total cost of 4 ceramic chip capacitor elements = 6.0¢(42% savings) • Total board area = 1.6mm X 3.2mm = 5.12mm²(32% smaller) • Capacitor Array Benefits = Lower total cost and less board space used!

  12. Integrated Component Solution: Passive Component Arrays High Density Design Solutions: Component Size Reduction and Integration Get More Components In Less Space SUPERIOR PERFORMANCE IN HIGH SPEED CIRCUITS! NPA SERIES PASSIVE ARRAY 1 PART: 8 ELEMENTS 1608 SIZE 8 ELEMENTS 4 CAPACITORS 4 RESISTORS REPLACE WITH

  13. Integrated Component Solution: Passive Component Arrays High Density Design Solutions: Component Size Reduction and Integration NPASERIES - Four element R•C network arrayin EIA 1608 size package Capacitance values from 10 ~ 180pF Resistive element values from 10 ohm ~ 1K-ohm. R R R R C R C C C C 1608 size : 0.16” long X 0.08” wide 4.0mm long X 2.1mm wide

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