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Materials. Some outstanding issues. Foam thermal conductivity Modules measurements BN load glue DC SE4445 CTE Shear measurements Radiation studies Write up. Allcomp foam tests. Worry caused by non-isotropic nature of K in 0.36g/cc measurement in in-plane measurements.
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Some outstanding issues • Foam thermal conductivity • Modules measurements • BN load glue • DC SE4445 • CTE • Shear measurements • Radiation studies • Write up
Allcomp foam tests • Worry caused by non-isotropic nature of K in 0.36g/cc measurement in in-plane measurements. • Appears ~ isotropic in through plane measurements • Have more material and cutting thinker samples • Could cutting of thin samples damage structure?
Y.M. of foam • Worry about the order of magnitude difference in Y.M. in compression and tension for Pocofoam measurements • Resolved with measurement with video and LVDT at same time on same sample. • LVDT system measuring movement in the jig. • Higher values (~1GPa) which agree with US values believed to be correct.
BN loaded Hysol epoxy • Still have disagreement between Liverpool and Glasgow measurements. • Curing sample at 60oC for 1 hour made no difference in conductivity. • Goodfellows BN has lower packing fraction than Japanese and as a result mix has higher conductivity. • Still need to work on this area!
DC SE4445 • Thermal measurements • Having problems as the material is rubbery • Apply pressure in jig and material thickness changes • Have values from 0.8 to 4 W/mK • Two solutions: • Add spacers to prevent thickness change • Use Line source thermal conductivity probe method (Liverpool technique) • Mechanical measurements • Shear modules • Creep • These need to be started
CTE • Technique in Glasgow with Vishay strain gauges working • Lowest temperature is -40C • Project student now finished and producing write up by end Jan. • Fiona to be trained in the technique • Like to look at epoxies, epoxies and foams together.
Shear measurements • Need an update from Simon
Radiation studies & Write-up • Radiation studies • Work not started on this yet. • Will have a phone meeting to discuss this at the end of Jan. • Write up • Started writing EDMS document • Written up expt sections for thermal and mechanical measurements • Write up of results to follow • Would like to include FEA section • Is this agreeable?