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EXPERIENCES FROM A MULTI-CULTURAL DESIGN, BUILD, TEST PROJECT. Thomas Gustafsson School of Engineering, Jönköping University thomas.gustafsson@jth.hj.se Adam Lagerberg School of Engineering , Jönköping University adam.lagerberg@jth.hj.se
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EXPERIENCES FROM A MULTI-CULTURAL DESIGN, BUILD, TEST PROJECT • Thomas Gustafsson • School of Engineering, Jönköping University • thomas.gustafsson@jth.hj.se • Adam Lagerberg • School of Engineering, Jönköping University • adam.lagerberg@jth.hj.se • 5th International CDIO Conference, 7-9 June 2009, Singapore
Outline • DBT Project Context • DBT Project Task • Experiences round one and adaptations for round two • Experiences round two • Conclusions
DBT Context • 2 year Master’s program in embedded systems • Prerequisites include bachelor degree in Electrical engineering • No room for a separate DBT project in the curriculum • DBT project given in the context of laboratory work of two parallel 10-week courses • Software engineering: Software project management • Mechatronics: Control theory and Hardware
DBT Context, continued • 100 % foreign students (middle East, Africa, east Asia, Europe, north America) • Often not used to work in groups or on open problems • Students took a course in Multicultural communication • The DBT project has been given two times
DBT Task • Course-relatedgoals • Work in a (multicultural) project group • Practiceprojectmodel • Technicalgoals • Microprocessorbasedcontrol system for hanging or invertedpendulum • Graphicaluser interface for pendulum
DBT Task, continued • Students were randomly divided into groups • Each group should deliver some artifacts: • Project documents, e.g., software requirements specification • Presentations • The end product
Grading • Group grade = weighted average of • Project documents • Presentations/demonstrations • Meetings • Individual grade = weighted average of • Fellow assessment average • Supervisor adjustment • Final project (individual) grade • Group members’ average grade adjusted to the group’s grade. • Course grading • Weighted average of Project and Written Examination
Experiences Round One • Students have problems in • Dividing a problem into subproblems • Working independently on subproblems • Move on even if stuck on some part of the problem • The amount of documentation seemed to, partly, hinder the students to focus on the problem solving • Some students thought it was awkward to do peer student assessment Project management document Software requirements specification Software architecture Software design Software test specification Software test report Software requirements tracing document Hand-over documentation
Adaptations for Second Round • Reduced amount of documentation required from each group • Control free hanging pendulum instead of inverted pendulum • Early presentation, which could force the student groups to work more iteratively • Each group had to include the risk ’student is not doing allocated task’
Experiences from Second Round • Many students didn’t work independently • It seems the students cannot divide the problem into subproblems and then work on these problems independently • One effect was that the groups got stuck in developing a plant model and running experiments in Matlab/Simulink, even though their time plans had independent branches • Reducing the documentation gave the effect that students didn’t see the benefits of working systematically – The task too ’simple’/uncomplex??
Conclusions • Multiculturalaspects: Project executioncouldhavebeenbetter • When is a DBT projectsuccesful? • Course-relatedgoals • Work in a (multicultural) project group – got the experience • Practiceprojectmodel – got the experience, oftengoodresults • Technicalgoals • Microprocessorbasedcontrol system for hanging or invertedpendulum – got the training, mostlyfailedresults • Graphicaluser interface for pendulum – got the training, mostlysuccess • Motivate students to work hard and independently – failed (partly)
Equipment • NI I/O board • FPGA reading angle sensor and position sensor • FPGA communicates sensor values to MCU using SPI • MCU communicates motor value using SPI • MCU should send sensor values on serial comm. port to PC