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Technical Review-Heat Seals

AVPM Annual Meeting October 6, 2009 Peter Garvin RPET Blisters and the impact on Heatseal Technology. Technical Review-Heat Seals. Components Blister types Adhesive Technologies Current Status. Technical Review-Heat Seals. Blister Type Traditional PVC – Vast Majority of Market

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Technical Review-Heat Seals

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  1. AVPM Annual MeetingOctober 6, 2009Peter GarvinRPET Blisters and the impact on Heatseal Technology

  2. Technical Review-Heat Seals Components • Blister types • Adhesive Technologies • Current Status

  3. Technical Review-Heat Seals Blister Type • Traditional PVC – Vast Majority of Market • PET & RPET Blisters -Expanding

  4. Technical Review-Heat Seals Blister Type – other impacts • Blister Flange – need a minimal size to ensure heatsealing operation adherence of the blister to the ink/board stock • Mold Release & denesting lubricants – need minimal amounts to preclude disruption of adhesion

  5. Technical Review-Heat Seals Visual Carded PackagingComponents & Assembly Plastic Blister Blister Flange Blister Flange Heat Seal Coating Printing Ink Clay Coating Clay Coating FINISHED SHEET Clay Coating BASE SHEET Chemical Sizing Paperboard Chemical Sizing

  6. Technical Review-Heat Seals Adhesive Technology • The adhesive itself is applied over wax-free inks on the blister board • The heatsealing operation allows the molten adhesive to wet out the blister and the ink/board

  7. Technical Review-Heat Seals Adhesive Technology • The adhesive does not “dive in” to the board as originally thought. (Determined by AVPM technical committee analysis) • Thus – the blister itself is vital to a proper and secure structure • A proper seal is the result of the bond between blister and ink/board, being strong enough so that the board ruptures in the base sheet (not clay split!!)

  8. Technical Review-Heat Seals Adhesive Technology (Solvent Base) • Applied off-line in second step on roll-coater over dry inks (may require spray powder) • Able to adhere to a wide variety and “quality” of blisters – most forgiving technology – better wets out the flange. • EVA and Vinyl Technologies • Solvent recovery or incineration required

  9. Technical Review-Heat Seals Adhesive Technology (Water – Base) • Applied in-line over wet ink on a litho press equipped with an in-line coating unit • Lower cost than off-line coating - 1 step process • PUR and Acrylic Technologies

  10. Technical Review-Heat Seals Current Status • “Green” concerns drive the blister package to more environmentally friendly components • Board stock is repulpable (Beloit Study) • Heatseal Adhesive – Currently water-base, devoid of organic solvents / and in-line which eliminates a second operationwhich reduces energy and cost

  11. Technical Review-Heat Seals Current Status – Blisters • PVC Blisters – Issue with environment (Chlorine) Being greatly reduced and eliminated in EU and now in North America • Recyclability provides for “better score” on Walmart score card as well as with the consumer/customer – Hence RPET!!!!

  12. Technical Review-Heat Seals Current Status – Blisters – RPET • RPET Blisters vary in amount of “recycled” components • This may vary the surface energy and corresponding effect on the ability of the adhesive to wet the substrate and adhere the blister to the ink/board

  13. Technical Review-Heat Seals Current Status – Blisters – RPET • Thus to overcome the variation – solvent base systems provide the safest solution (traditional system with the ability to wet out the film when sealed) • Solvent base (EVA) in effect “covers the sins” of the variation inherent in typical RPET blister stock

  14. Technical Review-Heat Seals Current Status – Blisters – RPET • Water base systems (PUR) - are being developed to allow for their benefits (one-pass / no organic solvents) • This will take the Blister Package to the “greenest” option • Best bet is to test the combination of board /ink / heatseal coating / blister in the laboratory prior to approval

  15. Technical Review-Heat Seals Current Status – Blisters - RPET • When completed make sure to specify each component!!! • With the same board – ink – heatseal / and specified RPET!!! This structure should provide the optimal desired and properly sealed package!!!

  16. Technical Review-Heat SealsQuestions??Thank you!!!Peter GarvinHenkelPeter.Garvin@us.henkel.com(513) 417 - 3980

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