CSC ME1/1 Upgrade Status of Electronics Design

1. CSC ME1/1 UpgradeStatus of Electronics Design Mikhail Matveev Rice University March 28, 2012

2. Scope and Responsibilities ● Digital Cathode Front End Board (DCFEB): 72 chambers x 7 boards = 504 boards (OSU) ● Optical Data Acquisition Motherboard (ODMB): 72 new boards 9Ux400 mm (UCSB, Northeastern University) ● Trigger Motherboard (TMB): 72 new FPGA mezzanines (Texas A&M University) ● New FPGA Mezzanine for Anode Local Charged Track (ALCT) board: 72 boards (UCLA) ● Low Voltage Distribution Board (LVDB): 72 new boards (JINR Dubna, NCPHEP Minsk) ● Low Voltage Mezzanine Board (LVMB): 72 new mezzanines (UC Davis) CMS CSC ME1/1 Upgrade ECR Follow-Up

3. DCFEB First Prototype ● Same size as old CFEB board ● Same input connections and 6 BUCKEYE amplifier-shaper ASICs ● 12 Texas Instruments ADS5281 ADC (8-channel, 12-bit, 50 MSPS, serial LVDS output) ● 2 legacy skewclear connectors compatible with old TMB and DMB ● 3.2Gbps optical links to new TMB and new DMB ● Xilinx Virtex-6 XC6VLX130T-FFG1156 FPGA ● 20-layer PCB CMS CSC ME1/1 Upgrade ECR Follow-Up

4. DCFEB Status ● Two initial prototypes under tests since spring 2011 - bench tests at OSU - on ME2/1 chamber in B904 in place of old CFEB - trigger optical path (comparator hits) tested with new TMB (3.2Gbps) - DAQ optical path (digitized samples) tested with another DCFEB (3.2Gbps) ● Production prototype: - remove excessive R&D options - few minor changes (add DAC for calibration references and FF_EMU ASIC for TTC signals, replace voltage regulator with rad hard Micrel) ● Schematics completed, PCB layout is being finalized (~2 weeks) ● Plan to fabricate 10 boards in April (preproduction run), most parts in hand ● Low level firmware and DCS software is ready and tested CMS CSC ME1/1 Upgrade ECR Follow-Up

5. New TMB Mezzanine ● XC6VLX195T-2FFG1156 (x5 more room than the original XC2V4000 ● SNAP12 transmitter and receiver - 7 receivers for DCFEB optical links - embedded GTX links - transmitter not needed for production board CMS CSC ME1/1 Upgrade ECR Follow-Up

6. Trigger Motherboard Status ● Two prototype boards in hand since spring 2011 ● Power and mechanical: OK (<8A @ 3.3V; FPGA core temperature under 65 C) ● 8 communication paths: - VMEbus, Clock and Control Board, Muon Port Card: OK - Fiber links to DCFEB (SNAP12): PRBS data transmission tests OK - Backplane link to DMB: OK - CFEB copper link tests (for backward compatibility): OK - ALCT and RPC tests: still to do, preparing infrastructure ● Radiation and SEU testing: OK so far, done in summer2011 and more in 2012. Reactor TID this week, cyclotron SEUs in May. ● Firmware design: old Virtex-2 firmware has been ported to Virtex-6 ● Test stand for production TMB mezzanines is under development at TAMU (to be able to test all paths and all BGA connections). Loop-back test circuits developed, software test suite in progress. ● Schematic design and layout of the pre-production board completed, sending out pre-production quotes this week (initially 4 boards) CMS CSC ME1/1 Upgrade ECR Follow-Up

7. Optical DAQ Motherboard ● Copper cables (5) to CFEBs replaced by optical links (7) to DCFEBs for data readout and distribution of trigger and control signals ● Trigger and control signals (encoded and serialized) to/from the custom rad- tolerant FF-EMU ASIC (IBM CMOS 130 nm) housed on the DCFEBs ● Control and readout (including FIFO buffers) handled by one FPGA (Virtex-6 XC6VLX130T-FFG1156) ● Full compatibility with the custom backplane CMS CSC ME1/1 Upgrade ECR Follow-Up

8. ODMB and FF_EMU Status ODMB: ● Preliminary schematics reviewed at Fermilab Upgrade workshop in November 2011 ● Layout completed at CERN in December 2011 – January 2012 ● Three boards fabricated in February ● Assembly of 2 PCBs to be completed at CERN next week ● Boards to be delivered to UCSB for tests in the coming two weeks ● Test firmware and testing setup are being developed at UCSB FF_EMU ASIC: ● Samples of FF_EMU received in May 2011 and tested in summer ● Major problem discovered (DC balancing was not implemented) ● Second prototype was submitted in November 2011 and samples delivered to UCSB in March ● Tests in progress (no new test board needed) CMS CSC ME1/1 Upgrade ECR Follow-Up

9. New ALCT Mezzanine Card ● Replacement for old Virtex-E mezzanines on ME1/1 and ME4/2 ALCTs ● Take advantage of new Spartan-6 family: - 10x logic resources - 1.5-2x speed - 0.5x cost of Virtex-E CMS CSC ME1/1 Upgrade ECR Follow UP

10. ALCT Mezzanine Status ● PCB routing in progress ● Firmware already ported to XC6SLX150 FPGA ● 10 boards will be built in April-May CMS CSC ME1/1 Upgrade ECR Follow UP

11. LVDB and LVMB boards ● LVDB board distributes LV powers to on-chamber electronics ● LVMB mezzanine monitors voltages and currents on LVDB and communicates with the DMB ● Both boards need to be redesigned for ME1/1 upgrade (7 DCFEBs, additional temperature sensors) CMS CSC ME1/1 Upgrade ECR Follow-Up

12. LVDB Status ● Two new LVDB boards are in hand since December 2011 ● On-chamber tests with 7 CFEB (7 powered and 5 in readout via FASTDAQ): OK (noise studies, voltage and currents stability at 70C) ● Pre-production prototypes manufacturing in March ● Interface to LVMB has been finalized ● Procurement of components for LVDB is finished CMS CSC ME1/1 Upgrade ECR Follow-Up

13. Conclusion ● 1st prototypes of the TMB, DCFEB and LVDB boards have been built and successfully tested. Good progress towards pre-production boards. ● Dedugging of the ODMB will start in early April. ● Three processing boards (DCFEB, TMB, DMB) are based on Virtex-6LXT family and use other common parts (optical, voltage regulators etc) ● 2nd prototype of the FF_EMU ASIC has arrived and is under tests ● Plan to start integration tests of all new boards at CERN (B904) in summer 2012 CMS CSC ME1/1 Upgrade ECR Follow-Up