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SPACE PACKAGES OFFERING & ROADMAP

68. MCM. 350/ 08. 350/ 11. Screened die/Flip-Chip. 1000/ 12. Screened die. 350/ 10. Al.N. High Pin Count with Flip-Chip. 900/ 11. 350/ 09. Al.N. CSP with Flip-Chip. 800/ 10. 349. 1.27-1 mm MCGA. 625/ 07. 350/ 09. Al.N. High Pin Count. 800/ 10. 68. MQFP. 352. 18. DIL/FPDIL.

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SPACE PACKAGES OFFERING & ROADMAP

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  1. 68 MCM 350/08 350/11 Screened die/Flip-Chip 1000/12 Screened die 350/10 Al.N. High Pin Count with Flip-Chip 900/11 350/09 Al.N. CSP with Flip-Chip 800/10 349 1.27-1 mm MCGA 625/07 350/09 Al.N. High Pin Count 800/10 68 MQFP 352 18 DIL/FPDIL 40 SPACE PACKAGES OFFERING & ROADMAP double ring array double ring 95/190µm 110 µm 95 µm ASIC die pad pitch 90 nm ATC18 MG2/MH1 MG2RTP Density & price efficiency 500/600 600/700 700/800 800/900 Pin/pad count Pin count / year of introduction

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