1 / 66

Computer Architecture

Explore advancements in CPU design focusing on system bus speed, clock frequencies, casing, cooling systems, caches, and more to boost overall system performance.

johnsonstephen
Download Presentation

Computer Architecture

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Computer Architecture Part II-D: Survey of Processor Architecture

  2. Microprocessors in the Market What’s the difference?

  3. Areas of Development • Below are technologies which can be improved in CPU design: • System bus speed • Internal and external clock frequency • Casing • Cooling system • Instruction set • Material used for the die • End result: enhance speed of the CPU and the system in general

  4. CPU Caches System Bus Adapters Memory Bus Controllers Disks Displays Keyboards I/O Devices: Networks The System Bus • Conduit for moving data between the processor and other system components

  5. System Bus Speeds • Intel Pentium Core 2 Quad/Duo have CPU clocks of 2.66/3 GHz with system bus speeds of 1066/1333 MHz • AMD: 2nd Generation Opteron (dual core) processor has clock speed of 1.8 GHz with a 1000 MHz system bus

  6. Split Clock Frequency • Internal clock frequency • Speed of data processing inside the CPU • External clock frequency • Speed of data transfer to and from the CPU via the system bus • Intel 486DX2 25/50 was first to use clock doubling to implement split clock system

  7. The GHz Race in CPU Frequency • June 1999: API (Alpha Processor Inc.) demonstrated a 1 GHz chip • March 2000: AMD released Athlon 1 GHz; within days Intel released 1 GHz Pentium III • 2002: AMD, Intel uses 0.13 micron technology • Athlon XP 2200+ (June) • Pentium 4 2.53 GHz (May), mobile Pentium 4 2 GHz (June) • 2004 • Pentium 4: 3.6 GHz, 800 MHz system bus • AMD: 3200+, 2.2 GHz, 400 MHz : Same as 2003 32-bit CPUs  now concentrating on 64-bit • 2005 • Pentium 4: 3.73 – 3.8 GHz, 800/1066 MHz system bus • AMD: Same as 2004

  8. Is Moore’s Law Dead? • Intel’s vision of a 10 GHz CPU cannot be realized due to heat problems • Some have pushed speed limits through high-end cooling systems • Both Intel and AMD no longer concentrating on speed as performance driver • SIA says “Moore’s Law is still going strong after 40 years”

  9. Micron Technology • A micron is 1 millionth of a meter • Human hair strand about 100 microns • Objective: thinner wires • Allow CPU to operate at lower voltage • Results in CPU generating less heat and operating at higher speeds • Currently, processors are in the range of 0.065 microns (65 nm) • Intel’s Roadmap: 45  15 nm

  10. Micron Technology Through the Years

  11. Thinner Wires = Increased Transistors Pertium 4 42,000,000 AMD K6 8,800,000 486SX/486DX 486DX2/486DX4 1,200,000 386DX/386SX 250,000 Pentium, Cyrix AMD K5, MMX 3,100,000 8086/8088 22,000 286 128,000 Athlon 1.4 GHz 37,000,000

  12. The Switch to Copper • Aluminum limits making chips smaller • Copper is a good choice because it • is a better conductor • consumes less energy, and • takes up less space than aluminum • Copper allowed processors to boost speeds to the GHz range • IBM pioneered the use of copper on September 1, 1998 (IBM Power PC 740/750)

  13. PC on a Chip • Integrates a number of key components into one chip • Result: The chip replaces dozen or so separate chips (memory, FPU, graphics, video, etc.) • Applications: PDAs, cellphones, set-top boxes, embedded processors, etc.

  14. Impact of PC-on-a-Chip • Smaller and quieter desktops • Battery of devices lasts longer because of the low power drain • Proliferation of information appliances

  15. CPU Receptacle • ZIF • Zero Insertion Force socket - type of socket designed for easy insertion of chips that have high density of pins • Socket 7 - popular implementation of ZIF

  16. CPU Receptacle • Slot 1 • Consists of receptacle on the motherboard that holds an Intel Single Edge Contact (SEC) cartridge • Cartridge may contain up to two CPUs and an L2 cache (runs at half the speed of CPU) and plugs into 242-pin receptacle • Started with Pentium II

  17. CPU Receptacle • A Pentium II mounted on Slot 1

  18. CPU Receptacle • Slot 2 • An enhanced Slot 1 • Uses 330-pin SEC • Holds up to four CPUs • L2 cache runs at full processor speed • First used in Intel's Pentium II Xeon

  19. CPU Receptacle • AMD’s Slot A • Receptacle on motherboard for K7 CPU • Physically similar to Slot 1, but has different electrical requirements

  20. Casing: FC-PGA (Flip-Chip) Traditional Wiring Flip-Chip (IBM)

  21. Advantages of FC-PGA • Greater # of I/O pins available • Shorter electrical connections • Better manufacturing efficiency

  22. Casing: FC-LGA Bottom view of LGA/BGA-based CPU LGA Socket 775

  23. Advantages of FC-LGA • Lower voltage used (less distance traveled, reduced signal loss) • Less heat dissipation

  24. Cache • Works as buffer between CPU and memory • Two types: • Internal • External

  25. L3 L2 L1 Levels of Cache • Level 1 • Level 2 • Level 3

  26. Cache Placement • Intel used to have external L2 cache • Pentium Pro • Internal but CPU and L2 cache are separate • Result: larger chip that requires a larger socket

  27. Overclocking • Going beyond recommended clock frequency settings • 3 method of overclocking • System bus frequency • CPU frequency multiplier • Change both of the above • Some CPUs have locked frequencies

  28. Overclocking: How to... • Done through BIOS program • Older systems require motherboard jumpers • Some motherboards (e.g. ASUS TX97) contain jumper codes

  29. Overclocking Issues • Heat! • Can main memory cope? • Will the software still work?

  30. Cooling Systems • CPUs get hotter as they get faster • Developed to keep the CPU from overheating • Sophisticated cooling systems allow more reliable CPU operation

  31. Liquid Nitrogen: Extremely Cool! CPU: Pentium 4 (Northwood) Date: Christmas 2003

  32. The CPU Gets Watered Down

  33. Multimedia Processing • Multimedia applications require geometric transformation • Re-computation of location and size of an image to determine new position • Deals with FP • FPU handles all real number computations • Drawing landscapes (e.g. games) involves lots of computations and CPU may not handle it as fast as the player could react

  34. Ways of Handling Multimedia • Speed up the CPU • Improve the CPU’s FPU by adding more pipelines • Use high-end 3D graphics cards • Add new multimedia instructions

  35. Multimedia Innovations in CPUs • MMX • 3DNow! • SSE

  36. MMX • Introduced 1995 in the Pentium processor • Had 57 new instructions for 3D graphics • Introduced SIMD (Single Instruction Multiple Data) instructions: technique that processes more than one integer simultaneously • Problems: • Only works with integers • CPU can only work with either MMX or FPU, not both simultaneously because they share registers

  37. 3DNow! • Introduced summer of 1998 in the AMD K6-2 • Characteristics • Supports SIMD instructions • Improved handling of numbers • Successful! • Integrated in Windows, games, and drivers • Does not use the same registers

  38. SSE • Introduced in Pentium III (Katmai) 500 MHz as Intel’s response to 3DNow! • Characteristics • 8 new 128-bit registers (can hold four 32-bit #s) • Has Streaming SIMD Extensions • 50 new instructions enabling simultaneous advanced calculations of more FP with a single instruction • New Media Instructions designed for coding and decoding MPEGs

  39. Problems with SSE • Pipelines can only handle two 32-bit numbers at a time • To take advantage of 128-bit registers, FPU pipeline should have been doubled (would have pushed back release date of Katmai) • Potentially, it could have enhanced 3D graphics since registers can handle four 32-bit numbers at a time

  40. SSE Enhancements • SSE2 • Started in Pentium 4 • Has 144 new instructions (since SSE) • Data width now 64 bits • SSE3 • 13 additional SIMD instructions (since SSE2) • New instructions primarily designed to improve thread synchronization and specific application areas such as media and gaming • Supplemental SSE3 (Core 2)  SSE4

  41. Other CPU Innovations • Data width • Internal: How many bits can the CPU process simultaneously? • External: How many bits can the CPU receive simultaneously for processing • Superscalar architecture • Superpipelined architecture Superscalar processing

  42. Intel Corporation • Produced biggest impact on microprocessor technology • Main line of business is CPU but also has other hardware products (e.g. motherboards)

  43. Short History of Intel • 1968: Birth of Intel • Started in memory business • First product was 64-bit memory • 1970s: Increase in market share • Early 1980s: Japanese eats up memory market with 16 - 256 KB chips • 1984: Business slowing down  “Get us out of memory!” • 1986: Exited from memory due to success of 80386

  44. Intel Processor Time Line 1982: 286 16-bit processor Optimized Instruction handling 1978: 8086 First 16-bit CPU from Intel 1988: 386SX Cheaper version of the 386DX 2 1979: 8088 Reengineered CPU to fit existing 8-bit hardware 1989: 486 Built in math co-processor L1 cache on-chip 1985: 386 First 32-bit CPU (32-bit system bus) 1971: 4004 Intel’s first microprocessor (108 KHz, 4 bit bus width)

  45. Intel Processor Time Line May 7, 1997: Pentium II (Klamath) 512 KB L2 L1 cache of 32 KB 1993: Pentium Classic Superscalar (5x 486DX-33 MHz) Width of system bus: 64 bit Speed of system bus: 60 to 66 MHz Initially produced a lot of heat 486SX Discount chip No math co-processor Nov 1, 1995: Pentium Pro RISC Processor 32 bit processing L2 cache is built in 3 486DX4 Triple the clock speed From 25 MHz to 75 MHz 33 MHz to 100 MHz Jan 8, 1997: Pentium MMX New set of instructions for multimedia 32 KB L1 cache

  46. Intel Processor Time Line 2000: Pentium 4 7th Generation 0.18 micron technology 1998: Celeron (Mendocino) 333 MHz 128 KB L2 internal cache Jan 26, 1998: Deschutes 333 MHz 0.25 micron technology 1999: Pentim III (Katmai) Enhanced MMX2 graphics instructions Core (2005) 2001: Itanium (formerly Merced) 64-bit CPU 0.18 micron technology > 25 million transistors 1Q 1998: Celeron (Covington) Pentium II without the L2 cache July 26, 1998: Pentium II Xeon 450 MHz Custom SRAM Different L2 caches: 512, 1/2 MB Can have 4 - 8 Xeons in one server 1999: Pentium III Xeon (Tanner)

  47. Current Intel CPU Innovations • Hyperthreading • Multi-core • Core • Core 2 (64-bit architecture)

  48. Intel’s First 64-Bit Chip (Server): Itanium • Was known as IA-64 (but IA-32 compatible) • EPIC (Explicitly Parallel Instruction Computing) processor • Enables up to 20 operations/clock cycle • Employs branch prediction and speculation • Three levels of cache: 2 MB / 4 MB L3 cache, 96K L2 cache, and 32K L1 cache • 128 integer registers, 128 FP registers

  49. Itanium 2 • Available from 1 - 1.66 GHz • Internal L3 cache (1.5 MB, 3 MB, 4 MB, 6 MB, or 9 MB) • System bus: 400/533/667 MHz, 128-bits wide • 0.13 microns, 592 million transistors • Next version (“Montecito”) has 1.72 billion transistors, 26 MB on-die cache, 90 nm

  50. Current Intel CPU Lineup • Mobile • Centrino (Core and Core 2) • Desktop • Core 2 Extreme • Core 2 (now used in Apple Mac Mini) • Servers and workstations • Xeon (now used in Apple Mac Pro) • Itanium 2

More Related