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X-Ray Inspection

X-Ray Inspection. High-resolution X-ray inspection has been used to evaluate the quality of the flip-chip assembly of dummy and active modules. Technique High-resolution 2-5 microns Real-time imaging. Missing bumps or merged bumps easily visible. Voids possible to observe

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X-Ray Inspection

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  1. X-Ray Inspection • High-resolution X-ray inspection has been used to evaluate the quality of the flip-chip assembly of dummy and active modules. • Technique • High-resolution 2-5 microns • Real-time imaging. • Missing bumps or merged bumps easily visible. • Voids possible to observe • X-ray of items made by AMS and Sofradir done, so far, in U.S. using equipment from X-Tek(purchasing inspection time by the hour). • X-ray of items made at IZM done in-house • Examples on next pages.

  2. Examples of X-Ray Inspection Sofradir IZM AMS IZM

  3. Active Devices - Correlation Column 0 Column 0 and 1-2 Complete correlation between pairs of dead and double rate channels with bridged bumps Column 1-2

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