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ABC130 Hybrid/module and HCC Bond Detail...

ABC130 Hybrid/module and HCC Bond Detail. ABC130 Left & Right Handed Hybrid and Module Topology . Digital I/O. Original proposal – same flavour hybrids Hybrid-module topology is asymmetrical. Revised proposal – Left & Right handed hybrids Hybrid-module topology is symmetrical. Power Entry.

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ABC130 Hybrid/module and HCC Bond Detail...

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  1. ABC130 Hybrid/module and HCC Bond Detail...

  2. ABC130 Left & Right Handed Hybrid and Module Topology Digital I/O Original proposal – same flavour hybrids Hybrid-module topology is asymmetrical Revised proposal – Left & Right handed hybrids Hybrid-module topology is symmetrical Power Entry 27.73 27.73 27.73 12.08 32.88 21.93 42.73 42.73 Symmetrical module topology brings hybrids closer together – results in lower impedance (inductance) reference tie between hybrids Sensor outline (97.54 x 97.54) shown in purple, All dimensions in mm (note geometry has been updated to take into account front-end wire bonding access

  3. ABC130 Left & Right Handed Hybrid - Detail HCC orientation on hybrids is the same (no rotation) – for both hybrid flavours bus connection detail is identical • Capacitor arrays used throughout for power supply decoupling and AC-coupling of stave-side signalling • Supply decoupling 0508 • 100nF,10V • Stave-side signalling 0508 & 0504 • 220pF, 50V HCC HCC Left-Handed Hybrid “New” Right-Handed Hybrid • Target size for ABC130 is 7.9mm x 6.0mm • ASICs are placed with 1.636mm gap between them (Front-end decoupling moved to the back of asic) • Target size for HCC is 3.5mm x 3.5mm • Bond pad detail aimed to match either flavour of hybrid

  4. ABC130 Common Bus Routing • ABC130s rotated 180° on right-handed hybrid • HCC orientation is the same for both hybrids • Bus tape connection is identical for both hybrids • ‘My’ Preferred direction of Bus signal flow shown in blue • Ease of routing with linear layout • Minimises stub length connection to asics • Results in ‘long’ trace length (~200mm) • Increased capacitive load to HCC drivers • ~40pF from trace alone (cf ~2pF/cm) • Left-Handed hybrid has half the load • (Could be) Problematic for HCC ‘fast’ data clock • Looking at ways of reducing Z0 • Differing termination techniques • Or • Route as an asymmetric T (shown red) • Reduced trace length (and capacitance) • End termination now moved to opposite end • Consider • Have receivers available on both sides of ABC130 • Bus topology becomes as left-handed hybrid ABC130 Bus ABC130 Bus End Termination embedded within final ABC130 Right-Handed Hybrid Left-Handed Hybrid

  5. HCC Kick off “Bond Detail” Stave • Targeting 3.5mm x 3.5mm die size • Wire bondable on all 4 sides • Should match up to either Left/Right Handed hybrids • This flexibility should tie in with Petals • Proposed bond pad orientation shown to right • Stave-side Coms towards top centre of asic • Pad detail is ‘fixed’ (due to use of AC-coupled Receivers) • Hybrid side Coms towards top sides of asic • ABC130 common bus • ABC130 Data loops on bottom side • Auxilliary Connections – Power, Sense, etc. on sides • Pad detail ‘fixed’ as shown • HCC ID set by fuse • Would like.... • A programmable logic switch to ‘steer’ Hybrid side Coms • Makes hybrid side I/O floating i.e. not tied to dedicated bond pads • On board termination Hybrid Hybrid Hybrid Side Coms Stave Side Coms Hybrid Side Coms Power HCC ID (Fuse) Logic Switch Steers Hybrid Side Communication (ABC130 Common Bus) Sense/Band Gap Hybrid Side ABC130 Data Loops Hybrid

  6. HCC Hypothetical Bond Detail 275µm 250µm 2975µm 175µm 350µm BC- DRC- DataII- DataI- R3L1- CMDL0- R3sL1- CDHL0- BCStave- BC+ R3L1+ DataII+ DataI+ CDHL0+ CMDL0+ R3sL1+ BCStave+ Bond Pads not needed? Make use of Fuse ID A0 A1 A2 Power /GND A3 A4 Xon/off+ Xon/off+ Xon/off+ Xon/off+ Data+ Data+ Data+ Data+ Xon/off- Xon/off- Xon/off- Xon/off- Data- Data- Data- Data- Die size: 3.5mm x 3.5mm 200µm 400µm 3000µm 250µm 250µm

  7. Summary • First pass of ‘realistic’ hybrid topology for ABC130 has been done • Assumptions for target sizes for both ABC130 and HCC seem ok • Assume 3-layer build for hybrid – no showstoppers yet identified • Request for 2 different flavoured hybrids taken on board - Left-handed and Right-handed • Gives us the option of making 2 different module topologies • Use of both flavours of hybrids results in a symmetrical hybrid-module topology • Advantage of reducing distance between hybrids (lower impedance reference tie) • Could introduce problems during production... • Single flavoured hybrids results in an asymmetrical hybrid-module topology • Distance between hybrids much greater (compared to above) – risk of compromising electrical performance • Advantageous for production • Dialogue has now started with ASIC designers regarding possible HCC bond pad layout • Very early days! • Bond pad detail, pad count and their location still not defined • Primarily used as a ‘kick off’ to show our thoughts • Target is for a bond pad layout that can be used for both flavoured hybrids • Should work for Petals as well...

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