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Scaling of MOS Circuits. EE213 VLSI Design. Scaling. VLSI technology is constantly evolving towards smaller line widths Reduced feature size generally leads to better / faster performance More gate / chip More accurate description of modern technology is ULSI (ultra large scale integration.
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Scaling of MOS Circuits EE213 VLSI Design
Scaling • VLSI technology is constantly evolving towards smaller line widths • Reduced feature size generally leads to • better / faster performance • More gate / chip • More accurate description of modern technology is ULSI (ultra large scale integration
Scaling Factors • In our discussions we will consider 2 scaling factors, α and β • 1/ β is the scaling factor for VDD and oxide thickness D • 1/ α is scaling factor for all other linear dimensions • We will assume electric field is kept constant
Scaling Factors for Device Parameters • Simple derivations showing the effects of scaling are derived in Pucknell and Eshraghian pages 125 - 129 • It is important that you understand how the following parameters are effected by scaling • Gate Area • Gate Capacitance per unit area • Gate Capacitance • Charge in Channel • Channel Resistance • Transistor Delay • Maximum Operating Frequency • Transistor Current • Switching Energy • Power Dissipation Per Gate (Static and Dynamic) • Power Dissipation Per Unit Area • Power - Speed Product
Scaling of Interconnects • Resistance of track R ~ L / wt • R (scaled) ~ (L / α) / ( (w/ α )* (t /α)) • R(scaled) = αR • therefore resistance increases with scaling A t w L B
Scaling - Time Constant • Time constant of track connected to gate, • T = R * Cg • T(scaled) = α R * (β / α2) *Cg = (β / α) *R*Cg • Let β = α, therefore T is unscaled! • Therefore delays in tracks don’t reduce with scaling • Therefore as tracks get proportionately larger, effect gets worse • Cross talk between connections gets worse because of reduced spacing