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Information Society Technologies Micro - and Nano- electronics in FP6 call 1. Georg Kelm European Commission DG Information Society Unit C1 : Micro-, nano- and opto-electronics components georg.kelm@cec.eu.int. Presentation Outline. Framework Programme 6 : IST
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Information Society TechnologiesMicro- and Nano- electronicsin FP6 call 1 Georg Kelm European Commission DG Information Society Unit C1 : Micro-, nano- and opto-electronics components georg.kelm@cec.eu.int
Presentation Outline • Framework Programme 6 : IST • Micro- and Nano-electronics in FP6 call 1
Budgets for the Specific Programmes • Integrating & strengthening • Genomics 2,255 B€ • IST 3,625 B€ • Nanotechnologies, int.. 1,300 B€ • Aeronautics and space 1,075 B€ • Food safety 0,685 B€ • Sustainable development 2,120 B€ • Citizens in knowledge 0,225 B€ • Anticipation of S&T needs • SMEs 0,430 B€ • Specific InCo 0,315 B€ • Anticipating needs 0,555 B€ • Reinforcing ERA basis 0,320 B€ • Structuring ERA • Research and Innovation 0,290 B€ • Human resources 1,580 B€ • Research Infrastructures 0,655 B€ • Science/Society 0,080 B€ • Joint Research Centre 0,760 B€ 12,905 B€ 2,605 B€ 760 B€ 16, 270 B€ Euratom: 1,230 B€
IST Strategic Objectives - networked organisations - services for mobile user - service & product engineering - eHealth - eInclusion - eSafety of transport - environmental risk mgmt - learning & culture - dependability & security - GRID-based systems & complex pb solving Applied IST research for major societal and economic challenges ‘anywhere, anytime, any service, for all’ core technologies & “pull-through” applications Components & microsytems Communication, computing & software technologies Knowledge & interface technologies - mobile: beyond 3G - broadband access - networked audio- visual systems - software & services development - embedded systems - semantic-based knowledge - cross-media content - [post-]CMOS - optical, opto-el., photonics - micro & nano systems - displays - multi-modal interfaces - cognitive systems
Defining the Strategic Objectives (1) • Reinforce leadership where Europe has demonstrated strengths, e.g. • mobile communications and services, broadband communications • micro-, opto-electronics & µsystems, • networked audiovisual systems... • Security and dependability,… • Seize new opportunities that arise from the ‘AmI’ vision and address weaknesses / threats critical for its realisation, e.g. • multimodal interfaces, semantic-based knowledge handling,.. • embedded systems, integration of sensing & actuating devices, ... • Knowledge and computing GRIDs
Defining the Strategic Objectives (2) • Continued support to leading / challenging applications, responding to emerging needs, e.g. • eHealth, eInclusion, eLearning and culture, • Entertainment and leisure content • business support tools, networked organisations,... • Support to research at the frontier of knowledge • FET open • FET proactive • Cognitive science • Support to infrastructure development • Research networking test beds • Open development platforms • IST for safety in transport, risk management,..
Time Table for calls 2003-2004 • Call 1 • opened 17 December 2002, • closing 24 April 2003 at 17:00 • Call 2 • opening 15 June 2003 • closing 15 October 2003
FP6: Six instruments for “Priority Areas” • Integrated Projects • Objective driven • Networks of Excellence • Exploratory research • Article 169 • Member states initiative • Specific Targeted Research Projects • Address specific issues • Co-ordination actions • Support Actions New instruments No longer available ….. - Individual Take-up Actions - SME Exploratory Awards
Presentation Outline • Framework Programme 6 : IST • Micro- and Nano-electronics in FP6 call 1
45 Design 40 35 18% 30 µElectronics Opto 25 IP 52% 48% 20 NoE Technology 15 10 34% 5 0 µElectronics Opto Technology Design Expressions of Interest 161 EoIs in Micro-, Nano- and Opto-electronics (analysis see http://www.cordis.lu/ist/ka4/mel/future.htm) Topics :devices CMOS limits SoC components compound semic. (IP re-use, material alternative devices RF, MS) (+ applicat.) lithography low power
IST Workprogramme 2003-2004 Pushing CMOS, Preparing post-CMOS Micro & nano systems Broadband access for all Mobile & wireless systems beyond 3G Towards a global dependability& security framework Multimodal interfaces Semantic-based knowledge systems Networked AV systems& home platforms Networked businesses & governments eSafety of road & air transports eHealth eLearning & access to cultural heritage Advanced displays Optical, opto-electronic & photonicfunctional components Open development platforms for software & services Cognitive systems Embedded systems Applications & services for the mobile user & worker Cross-media content for leisure & entertainment GRID-based systems for solving complex problems Improving risk management eInclusion Products & services engineering 2010 FET Call 1 Call 2
Topics for WP 2003-2004 (call 1) • Pushing the limits of CMOS and preparing for post-CMOS Prepare for electronic components of 2010 and beyond Focus on: Technology (down to 5nm) • nano CMOS : integration of advanced and non-CMOS devices, on-chip wiring • high frequency : facilitating ultra high frequency and power applications silicon-based or compound semiconductors including packaging • lithography : pushing the limits of lithography (including maskless) • alternative technologies and devices for post-CMOS: emerging nanoelectronics technologies for future applications • IPs may include equipment assessment activities
Escalating Design Costs ! • Skill Shortage ! Transistors/Chip (M) Transistor/PM (K) 1,600my • Grand Challenge = Multiply productivity by 10 ITRS’99 IC Design “Productivity Gap” • Can we design what we can produce? IC Production Design productivity
Topics for WP 2003-2004 (call 1) • Pushing the limits of CMOS and preparing for post-CMOS Improve design productivity by a factor of 10 by 2010 Focus on: Design : reliable 1 billion gate systems • system level : novel approaches to design better and faster improve system performance / reliability, specify / verify at system level, stimulate IP re-use, enhance flexibility / reconfigurability, optimize power consumption • improve the use of large systems (redundancy), improve testability • specific design challenges : mixed-signal, low power, RF, packaging • support change from board electronics to system-on-chip : develop, demonstrate and standardize architectures, design productivity • complement with education and training in design
Websites for information General FP6 Site: (Legal texts etc). • http://europa.eu.int/comm/research/fp6/index_en.html Instrument fiches: • http://europa.eu.int/comm/research/fp6/networks-ip.html Contracts: • http://europa.eu.int/comm/research/fp6/working-groups/model-contract/index_en.html Expressions of Interests: • http://www.cordis.lu/fp6/eoi-instruments/home.html Micro-, nano- and opto-electronics components (Unit C1): • http://www.cordis.lu/ist/ka4/mel/index.html KEEP YOURSELF UPDATED Georg.Kelm@cec.eu.int