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Digital Image Correlation (DIC)

High Strain Rate Behavior of Environmentally-Benign Pb-free Solders Nikhilesh Chawla, Arizona State University, DMR 0805144. Digital Image Correlation (DIC). Sn-rich Pb-free solders are currently being utilized as replacement materials for Pb-rich solders in consumer microelectronics.

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Digital Image Correlation (DIC)

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  1. High Strain Rate Behavior of Environmentally-Benign Pb-free SoldersNikhilesh Chawla, Arizona State University, DMR 0805144 Digital Image Correlation (DIC) • Sn-rich Pb-free solders are currently being utilized as replacement materials for Pb-rich solders in consumer microelectronics. • During it’s service life an electronic device may experience mechanical shock, e.g., when a laptop computer is accidentally dropped from a small height. • Our research focuses on quantifying the mechanical shock behavior of Pb-free solders. • Understanding the mechanical shock behavior is crucial for designing microelectronic assemblies with superior reliability. Sn-3.9Ag-0.7Cu Tested at a Strain Rate of 10 s-1 (Local strain measurement, note formation of double necking) ε11 Load Frame Video Imaging Phantom High Speed Camera 2 Phantom Miro2 High Speed Camera (40 ms exposure per frame) 1 3 1 cm

  2. High Strain Rate Behavior of Environmentally-Benign Pb-free SoldersNikhilesh Chawla, Arizona State University, DMR 0805144 • The PI has actively recruited women and minorities to work on NSF-funded projects. • Kyle Yazzie (shown in the picture on the right) is a Native American graduate student working on this project. • Kyle got his Bachelor’s degree in Materials Science and Engineering from MIT

  3. High Strain Rate Behavior of Environmentally-Benign Pb-free SoldersNikhilesh Chawla, Arizona State University, DMR 0805144 The integrated experimental and modeling efforts will provide a meaningful and quantitative understanding of dynamic behavior of Pb-free solders in electronic package and benefit the designers on developing reliable life prediction methodologies. Continuum modeling of interfacial strength between solder and copper based on embedded-atom potential Finite element simulation of a double necking when a bar subject to dynamic tensile loading Advantage of this approach: able to capture the nanoscale feature of the interface on the average sense

  4. High Strain Rate Behavior of Environmentally-Benign Pb-free SoldersNikhilesh Chawla, Arizona State University, DMR 0805144 • Outreach to minority students: The co-PI is working with Diné College from the Navajo Indian Reservation to invite Native American students to do research via ASU’s American Indian Program (AIP) Summer Bridge Program .

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