250 likes | 392 Views
IEEE Dallas EMC Society. System Level EMC Simulation Using the TLM Method. David Johns. What is FLO /EMC …?. The first electromagnetic field simulator developed specifically for system-level EMC design in the electronics industry
E N D
IEEE Dallas EMC Society System Level EMC Simulation Using the TLM Method David Johns
What is FLO/EMC…? • The first electromagnetic field simulator developed specifically for system-level EMC design in the electronics industry • Enables EMC problems to be identified and managed in the early stages of design • Good for investigating radiated & conducted emissions, immunity (susceptibility), ESD and crosstalk problems: • Enclosures & EMI shields • Interfaces between boards and chassis • Cables and EMI filters • Unintentional antennas! (heat sinks etc.) • Based on the 3D Transmission-Line Matrix (TLM) Method
TLM Method V7 V12 V2 Y V6 Z X V10 V9 V5 V1 V3 V4 V8 V11 • 3D space-volume divided into nodes (10th wavelength) • Each node is a 12-port transmission-line junction • Scattering at the nodes models coupling between E and H fields • Transient E and H fields are calculated from combinations of voltages and currents on the transmission lines • Spectrum found by FFT Ey= ½ (V3i + V4i + V8i + V11i ) / DY
TLM Coupling Matrix Incident Pulses Vik Reflected Pulses Vrk+1 S = ½ Ey= ½ (V3i + V4i + V8i + V11i ) / w
Wave Propagation, Time 0 1 1 1 1
Wave Propagation, Time 1 0.5 0.5 0.5 0.5 -0.5 0.5 -0.5 0.5 0.5 -0.5 0.5 0.5 -0.5 0.5 0.5 0.5
Wave Propagation, Time 2 0.25 0.25 0.25 0.5 -0.25 0.5 0.5 0.5 0.25 0.25 -0.5 -0.5 -0.25 0.25 0.25 -0.5 -0.25 0.25 0.25 -0.5 0.5 0.5 0.5 -0.25 0.25 0.25 0.25
Wave Propagation, Time 3 0.25 0.25 -0.25 0.375 0.375 0.375 0.375 0.125 0.125 -0.125 -0.125 0.375 0.375 -0.125 0.375 -0.375 0.375 -0.125 -0.125 -0.375 0.125 0.125 0.125 -0.375 -0.375 0.25 0.25 -0.25 -0.25 -0.125 0.125 0.125 -0.125 0.25 0.25 -0.375 -0.375 0.125 0.125 0.125 0.375 -0.375 0.375 -0.375 -0.125 -0.125 -0.125 0.375 0.375 -0.125 -0.125 0.375 0.125 0.375 0.125 0.375 0.375 -0.25 0.25 0.25
Complexity of EMC Analysis connectors seams air vents • Accurate modeling requires geometric detail • A long narrow seam may be a good antenna! • Meshing the detail is computationally impractical Compact vent model
FLO/EMC Smart Parts • TLM method uses a TL-Matrix to model fields. • Other TL’s & lumped-circuit models can be connected into the matrix. • Arrays of small holes are often necessary to provide adequate thermal ventilation/cooling. • Apertures increase emissions and decrease shielding effectiveness of the box. • Low-frequency fields are evanescent near the apertures. • Extremely fine grid would be required to model the exponential decay. • FLO/EMC overcomes this difficulty by inserting a “smart part” into the grid.
Air vent smart part For a thin panel TEM transmission can be modelled by a shunt inductor. L is like a short at DC, but allows high freq. transmission. TEM For a thick panel the additional electric field inside the aperture can be modelled by a shunt capacitor • L models the current flow along the edges of the apertures • C models the electric field stored inside the apertures.
Transmission dependence on aperture shape and size, coverage and depth – empirical results • Fine TLM mesh of single aperture used to calculate dependence of Transmission on aperture shape and size, coverage and depth • Fit L,C air vent parameters to the Transmission results at two frequencies - 10% and 80% of aperture cut-off frequency
Air Vent Implementation Inductor modelled by short-circuit transmission line Capacitor modelled by open-circuit transmission line
Validation - Plane Wave 1D propagation through an array of circular apertures (depth equal to diameter) The fine TLM mesh and air vent model give the same results at 10% and 80% of aperture cut-off frequency
Validation - Emission [M.Li et al,’EMI…’,IEEE Trans EMC, Vol. 42, No. 3, p265,2000] r =10.0 mm p = 5.0 mm t = 1.65 mm N=252 a =50 mm b = 20 mm c = 40 mm d = 10 mm
Enclosure with thick walls r = 5.08 mm p = 0.69 mm t = 5.20 mm N= 45 a = 100 mm b = 80 mm c = 15 mm
Enclosure with vents & slots r = 5.08 mm p = 0.69 mm t = 0.20 mm N= 45 a =50 mm b = 20 mm c = 40 mm l= 94.92 mm w =0.69 mm t = 0.20 mm
Air ventsand slots 3m from air vent 3m from slot Run time on Dual Xeon with 3 GHz clock
Multi-WireSmart Part cable connector pins Compact vent model • Multi-conductor TL models of wires are connected into the TLM grid • Full coupling between wires and fields • Supports splits, bends, multi-way connections, circuit terminations and ports
Near Field Scan Smart Part Emissions • Pre-determined near-field scans over entire boards or regions/components can be imported and applied as distributed frequency-dependent (time-varying) sources • Ideal for PCB with 1 or 2 layers where radiation from “exposed” nets may be important
TLM References • 1. Johns P. B. & Beurle R. L., ‘ Numerical Solution of 2-Dimensional Scattering Problems Using a Transmission-Line Matrix’, Proc. IEE, Vol. 118, No. 9, Sept 1971. • 2. Akhtarzad, S. and Johns, P. B., ‘The solution of Maxwell’s equations in three space dimensions and time by the TLM method of numerical analysis’, Proceedings IEE 122, 12, p.1344-1348, December 1975. • 3. Johns P. B., ‘A symmetrical condensed node for the TLM method’, IEEE Trans. Microwave Theory and Techniques, Vol. MTT-35, No. 4, pp. 370-377, 1987. • 4. Christopoulos C., ‘The Transmission-Line Modeling Method: TLM’, IEEE Press and Oxford University Press, 1995. A volume in the IEEE/OUP Series on Electromagnetic Wave Theory ISBN 0-7803-1017-9
If you have any questions or comments, we welcome your feedback ! Please visit the FLO/EMC web site at www.floemc.com and email us at emsupport@flomerics.com Flomerics Inc.257 Turnpike Road, Suite 100Southborough MA 01772 Tel: (508) 357 2012 Flomerics Inc. 4699 Old Ironsides Drive - #390 Santa Clara, CA 95054-1860 Tel:(408) 562-9100 Flomerics Inc. 410 South Melrose Drive, Suite 102, Vista, CA 92083 Tel: (760) 643 4028 Flomerics Inc.1106 Clayton Lane, Suite 525W Austin, TX 78723 Tel: (512) 420 9273