1 / 38

S emiconductor/ P olymer I ntegrated F abrication F acility

S emiconductor/ P olymer I ntegrated F abrication F acility. CLEANROOM. WHAT TO EXPECT (OUTLINE). Why a cleanroom? What is it? Facilities Procedures. WHY?. IT’S A DIRTY WORLD! UNCOUNTABLE PARTICLES IN AIR ALL SIZES, SHAPES, PROPERTIES NANOTECH S M A L L L L L L L FRAGILE.

kinsey
Download Presentation

S emiconductor/ P olymer I ntegrated F abrication F acility

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Semiconductor/PolymerIntegratedFabricationFacility CLEANROOM

  2. WHAT TO EXPECT(OUTLINE) • Why a cleanroom? • What is it? • Facilities • Procedures

  3. WHY? • IT’S A DIRTY WORLD! • UNCOUNTABLE PARTICLES IN AIR • ALL SIZES, SHAPES, PROPERTIES • NANOTECH • SMALLLLLLL • FRAGILE

  4. WHATis a cleanroom? • A room, enclosure, and or environment in which you move the air by way of supply and return locations to control the airborne particle levels and in some cases temperature and humidity. Courtesy of http://www.mcr-1.com/definitions.html • A place where harmful junk is kept away from sensitive items or materials.

  5. CLEANROOM CLASSIFICATION Class limits [maximum allowable particles per cubic foot (SI/209) or meter (ISO)] Courtesy of http://www.mcr-1.com/class.html

  6. CLEANROOM FACILITIES Class 10,000 by airflow design Upgradable to Class 1,000 Tested (empty) as Class 1,000 (~780 actual counts) 2003 July 15

  7. ENTRY INTO THE CLEAN WORLD >>> STOP <<< NO FOOD OR BEVERAGES BEYOND THIS POINT

  8. STAY ON THE MATS PAST THIS POINT

  9. SHOES OR BOOTIES Booties Shoes Shoes

  10. NOW YOU CROSS THE LINE

  11. CHEMICAL PREPARATION Acids Solvents

  12. THE CLEANROOM

  13. THE GOWNING ROOM • Follow the sequence of bouffant (hairnet), shoe covers, gloves, and frock. • If you are only stepping out for a short time reuse the same items. • If you are carrying something into the cleanroom wipe it down with the presoaked wipes. • The reason for gowning is to expose a minimum of flaking skin, hair, etc. that could harm your work.

  14. CLEANROOM ENTRANCE

  15. GOWNING STEPS REVERSE THE STEPS WHEN REMOVING THE APPAREL

  16. COMMON GOWNING ERRORS • Hair protruding from bouffant. • Ears not covered. • Open collar on frock. • Gloves rolled up and/or frock sleeves pulled back from gloves. The gloves should be fully extended up the forearms. • Once again, the reason for gowning is to expose a minimum of flaking skin, hair, etc. that could harm your work.

  17. WHITE ROOM • 4’ Fume Hood • In process of obtaining additional equipment. • Reactive Ion Etcher • Deposition System(s) • Will be adding Emergency Eye Wash / Shower.

  18. WHITE ROOM Acid

  19. YELLOW ROOM • Exhausted Laminar Flow Hood • Photolithography • Sink, Spinner, Hot Plate, Oven • ISO 5 (Class 100) environment • Vertical Laminar Flow Hood • MJB 3 Mask Aligner • Microscope • ISO 5 (Class 100) environment • If the room is occupied use the telephone’s intercomm from the White Room to verify it’s safe to open the door and enter.

  20. YELLOW ROOM

  21. PHOTOLITHOGRAPHY Sink I Contaminate Waste I Spinner I Oven & Hot Plate

  22. HORIZONTAL LAMINAR HOOD Microscope (No DIC) I MJB 3 Mask Aligner I OLD Mask Aligner I

  23. MASK ALIGNER MUST be trained before use

  24. MICROSCOPE MUST be trained before use

  25. CHARACTERIZATION HALL • X-rays • Scintag X’trA XRD: powder/low angle • Philips XRD: High Resolution • Wiring Stations • Ball Bonder • Indium Soldering Station • Horizontal Laminar Flow Hood • pH • Anodization Station • Optical Tables (a work in progress) • Mid-IR Photoluminescence • C-V Analysis • Coming Soon • FIB • Hall Effect

  26. X-RAYS Scintag X’trA XRD Philips XRD

  27. WIRING STATIONS Home Built Indium Soldering Station MEI 1204B Ball Bonder

  28. pH and ANODIZATION Anodization I pH I

  29. SOME GENERAL INFO • You must be trained before using it unassisted. • Clean up and put away. • Leaving your work area in better condition than you found it is a good habit to develop. • If you have any doubts or questions, ASK. • Harm to you and / or equipment can result from improper procedures. • Using / operating available facilities / equipment is a privilege not a right. • Your privilege can be restricted or revoked if you refuse to follow accepted practices or rules.

  30. Some Useful References • UCLA Nanoelectronics Research Facility • http://nanolab.ucla.edu/new_users.htm • http://nanolab.ucla.edu/pdf/Orient.ppt • University of California at Berkeley • http://microlab.berkeley.edu/ • Georgia Tech • http://www.mirc.gatech.edu/facilities/ • University of Alabama in Huntsville • http://www.licos.uah.edu/nmf.html • Cornell Nanofabrication Facility • http://www.cnf.cornell.edu/cnf/ • http://www.cnf.cornell.edu/cnf/CNFSafetyManual8.html

More Related