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11022 Transcutaneous Signal Transmission for LVAD

11022 Transcutaneous Signal Transmission for LVAD. October 8 , 2010 Yevgeniy Popovskiy, Vince Antonicelli, Craig LaMendola , Chrystal Andreozzi. System Level Design Review Agenda. Project Background Project Scope and Objective Project Schedule Customer Requirements

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11022 Transcutaneous Signal Transmission for LVAD

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  1. 11022 Transcutaneous Signal Transmission for LVAD October 8 , 2010 Yevgeniy Popovskiy, Vince Antonicelli, Craig LaMendola , Chrystal Andreozzi

  2. System Level Design Review Agenda • Project Background • Project Scope and Objective • Project Schedule • Customer Requirements • Engineering specifications • Work Breakdown • System Concept Generation, Scoring and Selection • Case • Insulation/ wire • Electrical System • Risks Assessment • Project Budget • Next Steps • Questions and discussion

  3. Project Background The primary objective of this project is to design a transmission system to safely and affectively transfer power and control signal from the external power supply and control to the Left Ventricular Assist Device(LVAD).

  4. Project Objectives MSD II • Objectives • Assumable system • Troubleshoot design • Testing equipment • Deliverables • Working System • Test data to support design MSD I • Objectives • Concept Generation and Selection • Detailed Design • Ready for Construction • Deliverables • Finalizes design • Order parts • Finalize Test specification

  5. Senior Design I Schedule

  6. Work Breakdown

  7. Customer Needs THE SYSTEM NEEDS TO WORK!!!! The device must be reliable (Must produce a continuous power and control signs) The number of wires needs to be reduced The cable diameter needs to be reduced The cable needs to be more flexible Meet FDA standards or be able to be modified to meet FDA standards

  8. Engineering Specification Reliable Operation 6 hours Cable Size ~3mm Improve Cable Flexibility 200% Internal/ External Volume 450 cm3 Eternal Weight 0.9 kg Cost below $3500

  9. System Overview

  10. Outer ProtectionProtective outer layers 1st Line of Defense • Wire port sealing

  11. Sealing Methods 2nd Line of Defense Types of O-rings O-ring grooves

  12. Protective CaseCase Structural material

  13. Case Concept Selection

  14. Insulation. • Heatsink Pad • Remain sold at room temperature and then soften at heatsink operating temperature • Heatsink paste/grease • Pasted applied directly to component

  15. Insulation Cont. Electrical Potting • Epoxy • Stable material (hard) • Resistance to temp. up to 200 oC • Very good resistance to chemicals • Cracks easily

  16. Wire • Wire Types • Calmont Wire and Cable • Stranded Single-Conductor (P10022) • Thoratec Corporation (HeartMate II)

  17. Insulation and Wire Concept Selection

  18. System Overview

  19. Major Electrical Choices

  20. Current Layout Skin SA Pump SP Main Controller+ A/D + Battery MCC Blood Pump MCO Motor Control MCP LAOP LADS Linear Amplifier LAP LAOG

  21. Senior Design P10021-P10022 Layout Skin SA NSD SA Chip + Elect. SP Chip + Elect. Main Controller+ A/D + Battery MCC MCC MCO Blood Pump MCP Motor Control PADS PADS PAOP PWM Gen. PAP+MCP+SP PAP

  22. Option 1 Skin SA NSD SA Micro. + Elect. Micro. + Elect. Pump SP SP SP Main Controller+ A/D + Battery MCC Blood Pump MCO Motor Control MCP LAOP LADS Linear Amplifier LAP LAOG

  23. Option 1 Details

  24. Option 2 Skin NSD SA SA Micro. + Elect. Micro. + Elect. Main Controller+ A/D + Battery SP PADS PADS PAOP Linear Amp. Blood Pump LAP LAP MCC MCO Motor Control MCP

  25. Option 2 Details

  26. Option 3 Skin NSD SA SA Micro. + Elect. Micro. + Elect. Main Controller+ A/D + Battery SP PADS PADS PAOP PWM Gen. Blood Pump PAP PAP MCO MCC Motor Control MCP

  27. Option 3 Details

  28. Option 4 Skin SA NSD SA Micro. + Elect. Micro. + Elect. Main Controller+ A/D + Battery SP Blood Pump MCC MCC MCO Motor Control MCP MCP LAOP LADS Linear Amplifier LAP LAOG

  29. Option 4 Details

  30. Option 5 Skin SA NSD SA Micro. + Elect. SP Micro. + Elect. Main Controller+ A/D + Battery MCC MCC MCO Blood Pump MCP Motor Control LADS LADS LAOP Linear Amp. PAP+MCP+SP PAP LAOG

  31. Option 5 Details

  32. Option 6 Skin SA NSD SA Micro. + Elect. SP Micro. + Elect. Main Controller+ A/D + Battery MCC MCC MCO Blood Pump MCP Motor Control PADS PADS PAOP PWM Gen. PAP+MCP+SP PAP

  33. Option 6 Details

  34. Design Evaluation

  35. Selected Design

  36. Risk Assessment

  37. Next Steps • Yevgeniy Popovskiy • Select Chip • Component Pricing • Vince Antonicelli • Circuit Design • Component Pricing • Craig LaMendola • Determine Case Dimensions • Create Case Drawings • Material Selection with customer • Chrystal Andreozzi • Identify Wire in the Cable • Electrical Reliability Testing • Team • Contact manufactures and get pricing • Verify that different components will assumable

  38. ?

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