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No Lab Assignment for Next Week Mandatory Attendance Scheduled Open Lab for:

No Lab Assignment for Next Week Mandatory Attendance Scheduled Open Lab for: Update of Requirements Spreadsheet Revision of Block-Block Interface Spreadsheet Detailed Design Prototyping. Open Book, Open Note (No PCs) 3 Multipart Questions Bring a Calculator, Lecture Slides.

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No Lab Assignment for Next Week Mandatory Attendance Scheduled Open Lab for:

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  1. No Lab Assignment for Next Week • Mandatory Attendance • Scheduled Open Lab for: • Update of Requirements Spreadsheet • Revision of Block-Block Interface Spreadsheet • Detailed Design • Prototyping

  2. Open Book, Open Note (No PCs) 3 Multipart QuestionsBring a Calculator, Lecture Slides • Business Processes • Organization and Roles • Annual Business Cycles and Processes • Standard, Performance Requirement Types • Sales, CM, OM and Net Income Arithmetic • Business Cases for New Product Development • Design Inputs, Design Outputs and Reviews • Verification and Validation • Product Program Milestones and Process

  3. Requirements, Flowdown, Block Diagram • Aspects of Good Requirements, Poor Requirements • Validation and Verification • Standard Requirements • Performance Requirements • Allocation and Margin • Association • External Interfaces • Block Requirements and Bl-Bl Interfaces • Analog, Digital and Power Interface Signal Requirements

  4. Safety • Types of Mitigations • Protections against Known Hazards, Unsafe Modes, & Unsafe Usage • Test Labs, Standards Bodies and Government Agencies • Design Control Terms • NEC, Underwriters Labs, CSA, ISO, IEC • US Government Departments & Applicable Agencies • US DoD Organization • Common Applicable Standards, MIL-STDs, UL-STDs • CE Mark • Commonly used Electrical-Electronic Safety Components • Key Aspects of Product Safety, Electrical, Mechanical, EHS

  5. Ethics in Engineering • Definition and Type of Ethics • Societal Needs & Business Needs, Conflicts • Founding Engineering Professional Organizations • IEEE Code of Ethics • Common Ethical Issues in Industry and Guiding Priorities • Global Power • Ranges of Voltage and Frequency • Power Quality Standards • Proper Wire Gauge • Power Input Safety Devices

  6. Electromagnetic Compliance • Legal Implications & Rationale • EMC Directives • Real World Effects & EM Stresses • Test Types & Product Permutations • Digital Waveform Frequency Content • Basic Fields, Near-Far Transitions, Plane Waves • Current Loops, Signal Rise/Fall Times and Field Strengths • Shielding Effectiveness • Near Field, Far Field • E Field, H Field • Emission Tests and Limits • CISPR11 Radiated and Conducted E Field Emission • EN61001-3-2 Powerline Harmonic Emission • EN61001-3-3 Voltage Fluctuation and Flicker Emissions

  7. Electromagnetic Compliance Continued • Susceptibility Tests • Standard Response Levels, Classifications • EN61000-4-2 Electrostatic Discharge Stress • EN61000-4-3 Radiated E-Field Stress • EN61000-4-4 Electrical Fast Transient Stress • EN61000-4-5 Power Surge Stress • EN61000-4-6 RF Conducted Electrical Stress • EN61000-4-8 Power Frequency B-Field Stress • EN61000-4-11 Power Dropout, Variation Stress

  8. Prototyping Systems • Production Design vs Prototype • Methods • Breadboard • Wirewrap • Perfboard with and without pads • Deadbug • PCB’s handmade transfer, photolithography • Prototype Guidelines • Solder, Soldering Guidelines • Substrates & Boards • Overall Prototyping Systems and Limitations • Thru Hole vs SMT Packages • Printed Circuit Board Prototyping Process • Analog Design  Will be part of Exam 2 content

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