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The Impact of Lead-free Soldering Processes on Defense Industry Electronic Assembly Practices

The Impact of Lead-free Soldering Processes on Defense Industry Electronic Assembly Practices. Dave Hillman Rockwell Collins SMTA Huntsville Chapter 2011. The goal of Today’s Presentation/Discussion: Educate – Entertain - Engage!.

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The Impact of Lead-free Soldering Processes on Defense Industry Electronic Assembly Practices

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  1. The Impact of Lead-free Soldering Processes on Defense Industry Electronic Assembly Practices Dave Hillman Rockwell Collins SMTA Huntsville Chapter 2011

  2. The goal of Today’s Presentation/Discussion: Educate – Entertain - Engage!

  3. Impact of Lead-free Soldering Processes on Defense Industry Electronic Assembly Practices • Agenda: • Background • Specifications • Lead-free Topics of Interest - in no particular order!

  4. Whenever there is a challenge, there is an opportunity………….. Graph Source: ELECTRONICS INDUSTRIES MARKET DATA UPDATE, Spring 2010

  5. The Predominate Component Surface Finish Is…… Graph Courtesy of CALCE Consortium, 2009ish

  6. Military and Aerospace sectors have little influence on the global transition to Lead-Free (<1% Market Share) High Harshness of Service Environment (Temperature, Vibration, Shock, Humidity) Lead-Free Transition = Increasing Difficulty Consequence of Failure Low 10 3 20 30 5 1 Satellites Medical Equipment Missiles Spacecraft Aircraft Cars 8% < 1% 62% 29% Network Servers Industrial Products Cell Phones Major Home Appliances Desktop PCs Operational Service Life (Years)

  7. Influence of Lead-free Soldering on the Defense Industry Products Military/Aerospace Electronic Products Characterization: • Life Critical & Flight Critical Applications • Extremely Stable Qualified Material Lists • Significant Use Life ~ 20-30 Years Not Uncommon • Manufacturing Mode: High Mix/Low Volume • Design Cycle Mode: Deliberate and Long ~ 12 Months • Customer Certification * Nothing is set in stone – and there is no guarantee that “legacy” products will have infinite exemption or exclusion status Graphic source: M. Kelly, SMTAI 2007, “Case Study: Qualification of a Lead-free Card Assembly &^ Test Process of a Server Complexity PCBA

  8. Impact of Lead-free Soldering Processes on Defense Industry Electronic Assembly Practices

  9. Impact of Lead-free Soldering Processes on Defense Industry Electronic Assembly Practices • Agenda: • Background • Specifications • Lead-free Topics of Interest (in no particular order!

  10. LEAP WG Actionable Deliverables GEIA-STD-0005-1, Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder Used by aerospace electronic system “customers” to communicate requirements to aerospace electronic system “suppliers” GEIA-STD-0005-2, Standard for Mitigating the Effects of Tin Whiskers in Aerospace In High Performance Electronic Systems GEIA-STD-0005-3, Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Lead-Free Solder and Finishes Used by aerospace electronic system “suppliers” to develop reliability test methods and interpret results for input to analyses GEIA-HB-0005-1, Program Management / Systems Engineering Guidelines For Managing The Transition To Lead-Free Electronics Used by program managers to address all issues related to lead-free electronics, e.g., logistics, warranty, design, production, contracts, procurement, etc. GEIA-HB-0005-2, Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-Free Solder and Finishes Used by aerospace electronic system “suppliers” to select and use lead-free solder alloys, other materials, and processes. It may include specific solutions, lessons learned, test results and data, etc. GEIA-HB-0005-3,Rework and Repair Handbook for Aerospace and High Performance Electronic Systems Containing Heritage SnPb and Lead-Free Solder and Finishes GEIA-HB-0005-4, Impact of Lead Free Solder on Aerospace Electronic System Reliability and Safety Analysis Used to determine, quantitatively if possible, impact of lead-free electronics on system safety and certification analyses, using results from tests performed per GEIA-STD-0005-3

  11. Influence of Lead-free Soldering on the Defense Industry Products GEIA-STD-0005-1, Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder (Published) *Used by aerospace electronic system “customers” to communicate requirements to aerospace electronic system “suppliers” – Lead-free Control Plan

  12. Influence of Lead-free Soldering on the Defense Industry Products GEIA-STD-0005-2, Standard for Mitigating the Effects of Tin Whiskers in Aerospace In High Performance Electronic Systems (Published) *Tin Whisker Protocols and Procedures

  13. Influence of Lead-free Soldering on the Defense Industry Products GEIA-HB-0005-2, Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-Free Solder and Finishes * Used by aerospace electronic system “suppliers” to select and use lead-free solder alloys, other materials, and processes. 200 cycles: SnPb (left) and SAC (right)

  14. Project documents, test plans, test reports and other associated information will be available on the web: NASA-DoD Lead-Free Electronics Project: http://www.teerm.nasa.gov/projects/NASA_DODLeadFreeElectronics_Proj2.html Joint Test Protocol Project Plan Final Test Reports Super Resource

  15. Influence of Lead-free Soldering on the Defense Industry Products:The Basis for Understanding Lead-free Soldering – The “One” Cell

  16. Impact of Lead-free Soldering Processes on Defense Industry Electronic Assembly Practices • Agenda: • Background • Specifications • Lead-free Topics of Interest • (In No Specific Order!)

  17. Influence of Lead-free Soldering on the Defense Industry Products: Process Robustness: Alloy Proliferation Graph Source: W. Liu and N. C. Lee, “Novel Sacx Solders with Superior Drop Test Performance”, SMTAI 2006

  18. Influence of Lead-free Soldering on the Defense Industry Products: Process Robustness: Alloy Proliferation The Material Engineers are still playing in the sandbox……… Graph Source: G. Henshall et al, “iNEMI Pb-Free Alloy Proliferation Project” SMTAI 2008.

  19. Influence of Lead-free Soldering on the Defense Industry Products: Process Robustness Graphic Source: The Lead Free Electronics Manhattan Project – Phase I, Contract # N00014-08-D-0758

  20. Influence of Lead-free Soldering on the Defense Industry Products: Process Robustness Photos Courtesy of Celestica

  21. Influence of Lead-free Soldering on the Defense Industry Products: Process Robustness Left Photos courtesy of NPL/Bob Willis

  22. Influence of Lead-free Soldering on the Defense Industry Products: Process Robustness Equipment Issues - Wave Solder • Molten Tin is Corrosive! Corroded Solderpot Hardware Corroded Wave Solder Impeller (Photo Sources:“Lead-Free Technology and the Necessary Changes in Soldering Process and Machine Technology”, H. Schlessmann, APEX 2002 Conference Proceedings and “Real Life Tin-Silver-Copper Alloy Processing”, A. Rae et al, APEX Conference Proceedings, 2003

  23. Influence of Lead-free Soldering on the Defense Industry Products: Process Robustness Equipment Issues - Soldering Irons 18,000 Soldering Hits! (Sn63 Solder Alloy !) (Photos “Under The Plating”, American Hakko Products Technical Report, July 2002)

  24. Influence of Lead-free Soldering on the Defense Industry Products: Process Robustness • Equipment Issues - Soldering Irons • Available Temperatures Ranges Seem Useable • Tip Maintenance Becomes More Critical • Use of Hot Air Systems Gaining Ground (Graph Source: “Dissolution rates of iron plating on soldering iron tips in molten lead-free solders”, Takemoto et al, Soldering & Surface Mount Technology, Vol. 16, No. 3, 2004

  25. Influence of Lead-free Soldering on the Defense Industry Products: Mixed Metallurgy Test Results: Solder Joint Failure @ 137 Cycles for SAC BGA in SnPb Reflow Process

  26. Influence of Lead-free Soldering on the Defense Industry Products: Mixed Metallurgy

  27. Influence of Lead-free Soldering on the Defense Industry Products: Mixed Metallurgy Large AgSn Platelets

  28. Influence of Lead-free Soldering on the Defense Industry Products: Mixed Metallurgy – New Physics ???

  29. Influence of Lead-free Soldering on the Defense Industry Products: Mixed Metallurgy SAC BGA Reworked with SAC Solder Paste, Original Solder Joint was SnPb, Magnified View of Crack with Pb Phase Present- Failed after 822 Thermal Cycles

  30. Influence of Lead-free Soldering on the Defense Industry Products: Mixed Metallurgy

  31. Mixed Metallurgy • Interaction of lead and bismuth in a bismuth containing LF solder alloy: Joint Council on Aging Aircraft (JCAA)/ Joint Group on Pollution Prevention (JGPP) LF Solder program. • Solder Alloy Included in Test Program: • Sn3.4Ag1.0Cu3.3Bi With SnCu and SnPb TSOP Component • Weblink: http://acqp2.nasa.gov/JTR.htm)

  32. Head On Pillow (HOP) What is HOP – incomplete coalescence of the BGA solderball and the solder paste deposit

  33. Graph Source: P. Su, “Effects Of Component Warpage On Board Assembly Defects And Effective Mitigation Measures”, SMTAI 2010 Head On Pillow (HOP)

  34. Head On Pillow (HOP) Graph Source: P. Su, “Effects Of Component Warpage On Board Assembly Defects And Effective Mitigation Measures”, SMTAI 2010

  35. Graph Source: P. Su, “Effects Of Component Warpage On Board Assembly Defects And Effective Mitigation Measures”, SMTAI 2010

  36. Head On Pillow (HOP) – Component Warpage

  37. Head On Pillow (HOP) Incorrect Solder Paste Deposit

  38. Head On Pillow (HOP) – Incorrect Reflow

  39. Pad Cratering Graphic Courtesy of B. Roggeman, Unovis Consortium

  40. Pad Cratering

  41. Fillet Lifting and Shrinkage Voids Fillet Lifting and Shrinkage Voids Are An Inspection Issue, Not A Reliability Issue

  42. Tin Whiskers • Conformal Coating • Silicone Conformal Coat Photo Shown Here. • NOT a Cure-All, Lower Risk. • Conformal Coating Only Captures and Does Not Eliminate. Photo Courtesy of Bob Ogden

  43. Tin Whiskers • Conformal Coating Thickness Plays a Role • Have You Characterized Your Coverage Consistency? Chart Courtesy of Dr. Tom Woodrow, “CALCE Part Reprocessing, Tin Whisker Mitigation and Assembly Rework Symposium”, 2008

  44. Tin Whiskers • References You Should Read: • 2010 CALCE 4th Tin Whisker Symposium, Hunt/Wickham

  45. Tin Whiskers • Soldering Process • Assembly Processes Will Cover Pure Tin on Small Parts with Solder • There Are Geometry Limitations Dependent on Component Construction • Where Is Your Process Data???

  46. The Concept of a System of Risk Mitigation Chart Courtesy of CALCE Consortium

  47. An Example: Photo Source: NASA Engineering and Safety Center Technical Assessment Report, TI-10-00618, “Technical Support to the National Highway Traffic Safety Administration (NHTSA) on the Reported Toyota Motor Corporation (TMC) Unintended Acceleration (UA) Investigation”, January, 2011. Automotive Industry segment: Unintended Consequences of Pure Tin Surface Finishes

  48. Rules Of a Tin Whisker Mitigation Plan Graphic Courtesy of D. Pinsky, Reference: “Controlling Tin Whisker Risk: Implementation of Appropriate Mitigations”, IPC Tin Whisker Conference 2010

  49. Influence of Lead-free Soldering on the Defense Industry Products: Copper Dissolution (Data courtesy of Nihon Superior/K. Sweatman

  50. ENIG – 1.5mil Copper – 60 Sec ImSn – 1.5mil Copper – 60 Sec Influence of Lead-free Soldering on the Defense Industry Products:Copper Dissolution

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