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Spezielle Anwendungen des VLSI – Entwurfs Applied VLSI design. Phase 5 Reliability - Electromigration Robert Mars. Metal wire. Thickness fixed by process parameters Width can be adapted by designer. Metal r eliability. Blacks´s Equation: lifetime of an interconnect scales with and
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Spezielle Anwendungen des VLSI – Entwurfs Applied VLSI design Phase 5 Reliability - Electromigration Robert Mars
Metalwire • Thicknessfixedbyprocessparameters • Width canbeadaptedbydesigner
Metalreliability • Blacks´s Equation: • lifetime of an interconnect scales with and • Source: ITRS (International Technology Roadmap for Semiconductors) 2011
Electromigration • Metalionsmovetowardstheanode • Force on ions due toelectronscattering in directionofelectronflow • Electricfield in metalcauseselectrostaticforce on ions • Damagecausedbydivergences in atomicflux
Enhancingreliability • WireWidening • increasingcross-sectionarea • Passivation Layer • preventdiffusion, betterdissipationofjouleheat • Gold Metallizations • very high activationenergy • AlloyingofMetallization • additionofTi-Si orCuto Al • Deposition Techniques • i.e. MTTF smallerforSputteringthanelectron-beam deposition • Wirelength • ifwireisshorterthan Blech lengthmechanical stress compensates material flow
Quellen • http://www.synopsys.com/Tools/Verification/CapsuleModule/CustomSim-RA-wp.pdf • http://www.doitpoms.ac.uk/tlplib/electromigration/index.php • http://www.ece.mtu.edu/faculty/goel/EE-4271/Web-Interconnects.pdf
JmaxCalculation • Quelle: http://www.itrs.net/Links/2011ITRS/2011Chapters/2011Interconnect.pdf
Blech length • – activationvolume (m³) • – hydrostaticcomponentofmechanicalstress (kg m-1 s-2) • – electromigrationforce, whichcausesatomicmigration • - effectivevalence (represents the sign and the magnitude of the momentum exchange) • – resistivity (