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Exploring Thin Film Technology in High-Tech Industries

This course introduces the technological foundations of high-tech industries focusing on thin film deposition and patterning for various devices. Topics include deposition morphology, vacuum technology, and thin film structure. Key aspects such as pressure, temperature, flow rates, and film properties are discussed, with applications in optical switches, MEMS devices, and solid-state lasers. Chemical vapor deposition and solution-based deposition methods are explored. Participants will gain a comprehensive understanding of thin film technology in industrial applications.

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Exploring Thin Film Technology in High-Tech Industries

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  1. Section I: Motivation and introduction The technological foundations of most high-tech industries are based primarily on the development/creation and utilization of different kinds of thin films: deposition and patterning.

  2. Basic thermostat and vacuum tech sources deposition morphology Outline of the course

  3. Example: Cross section of a computer chip

  4. Magnetic storage • ---towards terabits/in2 • C. Ross, Annu. Rev. Mater. • Res. 2001. 31:203-235. • Three strategies: • exchange-decoupled grains • (conventional) • In-plane patterned media • Perpendicular patterned media

  5. 1 “Photonic bandgap: woodpile structure” (Professor S. Lin, RPI)

  6. MRS: Colvin, MRS Bulletin August, 2001, page 637

  7. Optical switches: • MEMS---mirror switches: D. Bishop et al, Physics Today Oct 2001 (Lucent) MEMS

  8. Solid state laser: http://www.rpi.edu/futurechips/

  9. Mini-machnines (Micromechanical systems): actuator, resonator, valve, damper, motor…. Wu (2002) Cleland (2003) Industrial Physics (2002) microns Micro-mirror arrays--Lucent (2001)

  10. substrate thickness monitor vapor source pump Physical vapor deposition: thermal evaporation, e-beam evaporation, sputter deposition, laser ablation, ion beam deposition Base pressure --vacuum seal, outgasing, contamination, pumps Deposition rate (nm/s) --source T, vapor pressure, impinging rate Film structure --morphology, crystal orientation, substrate T, uniformity

  11. Ar H2 Ar precursor CF CF 3 3 O C C O - - O O CH 2+ Pd HC Substrate Heater C O C O Pump CF CF 3 3 Chemical vapor deposition: thermal CVD, atomic layer deposition Pressure, T (source and substrate), flow rate, deposition rate, pulse duration, film properties

  12. + - OH- wafer H+ e- Cu2+(EDTA) Cu2+ SO42- SO42- glyoxylic acid wafer anode Cl- Solution based deposition: electrochemical deposition (ECD), Electroless deposition (ELD) electrochemical deposition Electroless deposition (HO2CCH2)2NCH2CH2N(CH2CO2H)2 T~70o Room T

  13. Home work. 1. (Deadline: Sept 7, 8am) Describe briefly five different devices or structures (with figures or drawing) that require extensive thin film coating work. (One page per device.)

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