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LSWG September 2012

LSWG September 2012. M. Gilchriese LBNL September 5, 2012. Introduction. What’s new on pixel upgrades at LBNL in the last year? Very little Will very briefly summarize where we are but for those that remember….not much new

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LSWG September 2012

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  1. LSWGSeptember 2012 M. Gilchriese LBNL September 5, 2012

  2. Introduction • What’s new on pixel upgrades at LBNL in the last year? • Very little • Will verybriefly summarize where we are but for those that remember….not much new • Severe funding limitations and other work commitments have precluded progress • Progress on “pixel electrical staves” • Brief summary • No feedback on mechanical design from this yet. • New ideas – see Bill’s talk • Enhanced emphasis from DOE for industrial connection • Funding source for additional work • Broader than ATLAS upgrades

  3. Many Pixel Upgrade Prototypes Made 1.4m long, with cables 70cm long, active stave ready for modules 1m I-beam “Co-cured” inner stave(UK) Electrical cable inside foam 1m stave, cable on top, dummy module heaters Section of bent stave(20o) One of dozen or so 12cm prototypes, some-co-cured partly Disk section prototype

  4. I-Beam Section • Since last meeting, I-beam section, with fiber wrapped Ti tube, co-cured made and thermally tested, including after thermal cycling (no change) • Similar technique used for flat short prototypes, same result • Penalty (for wrapping in fiber) is  20% increase in effective thermal resistance compared to without fiber

  5. Prototype Results Summary • Diverse prototypes constructed using same building blocks: CO2 cooling, Ti tube, conducting carbon foam, carbon fiber • After extensive thermal cycling – no change in thermal performance within measurement errors demonstrated on many prototypes. • After irradiation to 1 GRad,thermal performance (including representative module adhesive) degrades by < 10% • Many prototypes made but not enough to address manufacturing (particularly reliability) issues and trade off between reliability and material. • Reasonable agreement between modeling (FEA and other) and prototype results. Although refinements needed, decent predictive capability in place. • Still waiting for overall design constraints (supports, access) to guide more detailed design.

  6. “Modules” • Two types of “digital modules” (chips and hybrid, but no sensor” have been used. • Both are rudimentary prototypes to get first experience • 4-chip flex VERY rudimentary • 2-chip flex, based on IBL, less rudimentary, but only 2 chips • Real modules with sensor tile bump bonded to 4 readout chips will be soon available, but no flex hybrid yet.

  7. Outer Staves with Embedded Cable • 1 electrical half-stave and 1 full stave made with the 2010 cable design • Half stave at LBNL, has been used for initial electrical test of noise performance. • Full stave is at Bonn, getting ready to use for serial power chain test with 2-chip modules • Next version of stave cable was launched at last years mechanics meeting, but has suffered many cable fabrication delays and is not yet integrated in any stave • We finally have electrical cables in our hands – see next page. Will incorporate into first stave soon (stave- made by Allcomp- has been ready for nearly a year) • The electrically sound cables are 2/3 of the intended length (this was necessary to get them fabricated successfully) • This is not a fundamental problem (we hope). Will be able to make longer cables in the future. This was done to salvage the present prototype cycle.

  8. Cables Top: Electrically active, length was limited by manufacturer. To be used in next generation electrical stave at LBNL and Bonn. But need to make “short” staves just for this purpose. Bottom: Not electrically functional, mechanical use. About 61 cm long. For use in existing Allcomp long stave (parts).

  9. Existing electrical staves FULL (at Bonn) HALF (at LBNL, some testing underway)

  10. How new cables fit in stave Pixel Stave Cable Stauts -- M. Garcia-Sciveres

  11. Pixel Stave Cable Status -- M. Garcia-Sciveres

  12. Cables • Key mechanical issue to evaluate is reliability of rigid board mechanical connection at end of stave. • And related bonding of cable into stave. How to co-cure (if want to use this to reduce mass)

  13. Plan • Highly funding dependent, uncertain • Priorities • Assemble “electrical staves” with working cables, LBNL and Bonn. Get experience. • One of these at least using co-curing, minimal material techniques developed via short prototypes • I-beam with cabling, mechanical concept, not electrical

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