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REFLECS project. Marco Bomben – LPNHE, Paris. Outline. Reflecs project: goals, constraints & manpower, scope What can be done within REFLECS?. REFLECS: THE PROJECT. Project goals. Develop a µ-channel based cooling system exploiting the possibilities offered by 2-phase CO 2
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REFLECS project Marco Bomben – LPNHE, Paris M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Outline Reflecs project: goals, constraints & manpower, scope What can be done within REFLECS? M. Bomben - REFLECS project kickoff meeting - 02/04/2014
REFLECS: THE PROJECT M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Project goals • Develop a µ-channel based cooling system exploiting the possibilities offered by 2-phase CO2 • REFroidissement Léger au CO2en Silicium • Aim: Atlas Phase-II; data taking: from 2024 onwards M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Project constraints • Time: all budget must be used by the end of 2014 • Money: we have been assigned 16 k€ • Expenses: • we cannot hire people • we can buy material, having work done elsewhere • we can pay a stagiaire • we can pay travel expenses M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Project: groups, people involved • LPNHE: Giovanni Calderini (senior researcher), M.B. (Post-doc) Filipe de Matos (research engineer) • IEF: Jean-Rene Coudevylle (research engineer), Frédéric Hamouda (research engineer) • CMM: Maurizio Boscardin (senior researcher) • MPI: Anna Macchiolo (senior post-doc) M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Project scope Sensor – 200 µm R.O. chip – 100-150 µm Silicon substrate – 300 - 700 µm • A demonstrator consisting of a pixel detector module cooled via µ-channels and CO2 • Probably not enough budget to accomplish this… • Work on connections between different modules M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Upgrade tracker pixel stave z R φ Scheme: courtesy of J.W. carbon frame support module w/ cooling channels parallel coolant distribution • How to deliver efficiently the coolant? • Find suitable in plane connections M. Bomben - REFLECS project kickoff meeting - 02/04/2014
I-beam stave concept 40 – 100 cm M. Bomben - REFLECS project kickoff meeting - 02/04/2014
I-beam stave concept Pixel module Pixel module M. Bomben - REFLECS project kickoff meeting - 02/04/2014
I-beam stave concept Outer coolant route Inner coolant route M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Cooling requirements needs for new pixels • To avoid negative annealing future sensors must be operated well below 0 °C ideally: -20 °C • Sensor+chip will dissipate ~ W/cm2 • Important constraint: very low material budget envisaged ( < 1% X0) • A very efficient cooling system is needed M. Bomben - REFLECS project kickoff meeting - 02/04/2014
WHAT CAN BE DONE WITHIN REFLECS? M. Bomben - REFLECS project kickoff meeting - 02/04/2014
What can be done: cooling plates Some examples from literature In our case: ~ 10 – 15 parallel channels 3x side length ~ 60 mm long Channels: 70-100 µm deep 500-1000 µm LHCb - CNM Pyrex closure? Or Silicon? Possibility to etch 6” wafers? 8”? Buried channels? Etch channels on sensors? (unlikely) But still: can we etch the support wafer of our edgeless production? FBK-CMM Realize some (how many?) cooling plates for FEI4 sensors-chip assemblies (size: 20 x 20 mm2) M. Bomben - REFLECS project kickoff meeting - 02/04/2014
What can be done: cooling distribution system? • Long staves (400-1000 mm) requires a coolant distribution system “parallel” to the stave • Microfluidic tapes? • Below the stave? • If yes: how can we create holes in the cooling plate? M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Backup material M. Bomben - REFLECS project kickoff meeting - 02/04/2014
A STUDY CASE: UPGRADE OF THE ATLAS PIXEL DETECTOR M. Bomben - REFLECS project kickoff meeting - 02/04/2014
LHC in a nutshell M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Atlas M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Current Atlas pixel detector M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Upgrade Inner Detector Layout (LoI – DRAFT) More strip layers More disks More pixel layers Forward extension M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Upgrade LoI pixel barrel Beam X M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Upgrade LoI pixel barrel First layer M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Upgrade LoI pixel barrel Second layer M. Bomben - REFLECS project kickoff meeting - 02/04/2014
Phase-II LoI pixel barrel I-beam stave M. Bomben - REFLECS project kickoff meeting - 02/04/2014